- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Weight | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Capacitance | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Memory Size | Oscillator Type | Nominal Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | On Chip Program ROM Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Speed Grade | Integrated Cache | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
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![]() MCIMX6Y2DVK09AB NXP USA Inc. | 1 | - | Datasheet | 18 Weeks | - | - | - | 272-LFBGA | - | - | - | - | - | 0°C~95°C TJ | Tray | - | i.MX6 | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | - | - | 260 | - | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | 900MHz | - | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | - | Multimedia; NEON™ MPE | - | - | - | - | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6DP6AVT8AA NXP USA Inc. | 1000 |
| Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | - | - | Active | 3 (168 Hours) | 624 | 5A992 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.4V | 0.8mm | - | - | NOT SPECIFIED | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.225V | - | - | - | - | - | 852MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 26 | - | - | YES | YES | 64 | FLOATING POINT | - | YES | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | ROHS3 Compliant | - | ||
![]() MPC755CPX400LE NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 360-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | - | Obsolete | 3 (168 Hours) | 360 | 3A991 | TIN LEAD | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 2V | 1.27mm | - | - | 30 | MPC755 | - | S-PBGA-B360 | - | - | 2.1V | - | 1.9V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC | - | 100MHz | 32 | - | - | 32 | - | - | YES | YES | 64 | FLOATING POINT | - | YES | 2.5V 3.3V | - | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.77mm | 25mm | - | - | Non-RoHS Compliant | - | ||
![]() MCIMX6Q7CVT08AC NXP USA Inc. | 10000 |
| Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6Q | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | - | 0.8mm | - | - | 40 | MCIMX6 | - | S-PBGA-B624 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 24MHz | 64 | - | - | 16 | - | - | YES | YES | 64 | FIXED POINT | - | YES | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | ROHS3 Compliant | - | ||
![]() OMAPL138EZCED4E Texas Instruments | 10 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | - | - | 361-LFBGA | YES | 361 | - | - | - | -40°C~90°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.65mm | - | 456MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR CIRCUIT | ARM926EJ-S | - | - | - | - | - | - | ARM | - | - | - | - | - | 456 MHz | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | - | Signal Processing; C674x, System Control; CP15 | - | 1 | I2C; SPI; UART; USB | - | - | Boot Security, Cryptography | LCD | - | SATA 3Gbps (1) | 1.3mm | - | 13mm | 13mm | 890μm | ROHS3 Compliant | Lead Free | ||
![]() MCIMX6X1CVO08AB NXP USA Inc. | 5 | - | Datasheet | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | - | 0.8mm | - | - | 40 | - | - | S-PBGA-B400 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | 200MHz, 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | 15 | - | - | YES | YES | 32 | FLOATING POINT | - | YES | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | - | Multimedia; NEON™ MPE | - | - | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | - | 1.53mm | 17mm | - | - | ROHS3 Compliant | - | ||
![]() P1010NSE5KHB NXP USA Inc. | 673 | - | Datasheet | 12 Weeks | - | - | - | 425-FBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 425 | - | - | - | 8542.31.00.01 | - | - | - | - | 1V | - | - | - | - | P1010 | - | - | - | - | - | 1V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | - | Security; SEC 4.4 | - | - | - | - | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | SATA 3Gbps (2) | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8245LVV350D NXP USA Inc. | 50 | - | Datasheet | 12 Weeks | - | - | - | 352-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 2V | 1.27mm | - | - | 30 | MPC8245 | - | S-PBGA-B352 | - | - | 2.2V | 23.3V | 1.9V | - | - | - | - | - | 350MHz | - | MICROPROCESSOR, RISC | PowerPC 603e | - | 66MHz | 32 | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | - | YES | 3.3V | - | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | - | - | - | - | 1.65mm | 35mm | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6G2DVM05AB NXP USA Inc. | 2325 |
| Datasheet | 12 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | 0°C~95°C TJ | Tray | 2002 | i.MX6UL | - | - | Active | 3 (168 Hours) | 289 | 5A992 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | - | S-PBGA-B289 | - | - | 1.3V | - | 1.15V | - | - | - | - | - | 528MHz | - | MICROPROCESSOR | ARM® Cortex®-A7 | - | - | - | - | - | 26 | - | - | YES | YES | 16 | FIXED POINT | - | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | - | - | - | 1.32mm | 14mm | - | - | ROHS3 Compliant | - | ||
![]() ATSAMA5D35A-CNR Microchip Technology | 36 | - | Datasheet | 7 Weeks | - | - | - | 324-LFBGA | - | 324 | - | L1 Cache, ROM, SRAM | 160 | -40°C~105°C TA | Tape & Reel (TR) | 2014 | SAMA5D3 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | 536MHz | - | ATSAMA5D35 | - | - | - | 1.2V | - | - | - | - | 2-Wire, CAN, EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB | 160kB | Internal | - | - | 128kB | - | ARM® Cortex®-A5 | DMA, POR, PWM, WDT | - | - | 32b | - | - | ARM | - | - | - | - | - | - | - | 1.2V 1.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | CAN, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | - | - | - | 1 | - | - | - | AES, SHA, TDES, TRNG | Touchscreen | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX7S5EVM08SC NXP USA Inc. | 7 |
| Datasheet | 25 Weeks | - | - | - | 541-LFBGA | YES | - | - | - | - | -20°C~105°C TJ | Tray | 2012 | i.MX7S | - | - | Active | 3 (168 Hours) | 541 | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | 1V | 0.75mm | - | - | - | - | - | S-PBGA-B541 | - | - | 1.155V | - | 0.95V | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | - | 32 | - | - | 16 | - | - | YES | YES | 32 | FLOATING POINT | - | YES | 1.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | - | Multimedia; NEON™ MPE | - | - | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | - | - | 1.42mm | 19mm | - | - | ROHS3 Compliant | - | ||
![]() MCIMX255AJM4A NXP USA Inc. | 3500 |
| Datasheet | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | - | - | -40°C~85°C TA | Tray | 2005 | i.MX25 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.45V | 0.8mm | - | - | 40 | MCIMX255 | - | S-PBGA-B400 | - | - | 1.52V | 1.2/1.51.8/3.3V | 1.38V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | ARM926EJ-S | - | 24MHz | 32 | - | - | 26 | - | - | YES | YES | 16 | FIXED POINT | - | YES | 2.0V 2.5V 2.7V 3.0V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | - | - | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | Keypad, LCD, Touchscreen | - | - | - | 1.6mm | 17mm | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6G2DVM05AA NXP USA Inc. | 15 | - | Datasheet | 10 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | 0°C~95°C TJ | Tray | 2014 | i.MX6UL | - | - | Obsolete | 3 (168 Hours) | 289 | 5A992 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | - | S-PBGA-B289 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | 528MHz | - | MICROPROCESSOR | ARM® Cortex®-A7 | - | - | - | - | - | 16 | - | - | YES | YES | 16 | FIXED POINT | - | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | - | - | - | 1.32mm | 14mm | - | - | ROHS3 Compliant | - | ||
![]() OMAP5910JGZG2 Texas Instruments | In Stock | - | Datasheet | 6 Weeks | - | - | Surface Mount | 289-TFBGA | - | 289 | 284.997756mg | FLASH | - | -40°C~85°C TC | Tray | - | OMAP-59xx | e0 | - | Active | 4 (72 Hours) | 289 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | - | BOTTOM | BALL | 220 | 1.6V | 0.5mm | - | 150MHz | - | OMAP5910 | 289 | - | - | 1.6V | - | - | - | 1.675V | I2C, MMC, SDIO, UART, USB | 32kB | - | 170mA | - | 160kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM9TDMI | - | - | 16 | 32b | 6 | 25 | - | 16 | YES | YES | - | FIXED POINT | - | YES | 1.8V 2.75V 3.3V | - | - | 1 Core 32-Bit | No | SDRAM | USB 2.0 (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART | - | Signal Processing; C55x, System Control; CP15 | MROM | - | - | NO | MULTIPLE | - | Keypad, LCD | 6 | - | - | 1.2mm | 12mm | - | - | ROHS3 Compliant | Contains Lead | ||
![]() AM3356BZCZD30 Texas Instruments | 36 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | - | 324-LFBGA | YES | 324 | 1.713814g | L2 Cache, RAM, ROM | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.1V | 0.8mm | - | 300MHz | NOT SPECIFIED | AM3356 | - | - | Not Qualified | 1.1V | - | - | - | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | 32b | - | - | ARM | - | YES | YES | - | FIXED POINT | - | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | 1 | - | - | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | - | 1.4mm | - | 15mm | 15mm | 900μm | ROHS3 Compliant | Lead Free | ||
![]() MPC8270ZUUPEA NXP USA Inc. | 2110 | - | Datasheet | 18 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | - | 40 | MPC8270 | - | S-PBGA-B480 | - | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | 450MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | - | 100MHz | 32 | - | - | 32 | - | - | YES | NO | 64 | FLOATING POINT | - | YES | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | Non-RoHS Compliant | - | ||
![]() MPC8358EVRAGDGA NXP USA Inc. | 1658 |
| Datasheet | 12 Weeks | - | - | - | 668-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 668 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 40 | MPC8358 | - | S-PBGA-B668 | - | - | 1.26V | - | 1.14V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | - | 66.67MHz | 32 | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | - | YES | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | Communications; QUICC Engine, Security; SEC | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.46mm | 29mm | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6Y2DVM09AA NXP USA Inc. | 387 |
| Datasheet | 14 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | - | Obsolete | 3 (168 Hours) | 289 | - | - | - | - | - | BOTTOM | BALL | - | - | 0.8mm | compliant | - | - | - | - | S-PBGA-B289 | - | - | 1.5V | - | 1.375V | - | - | - | - | - | 900MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | - | 900MHz | - | - | - | 16 | - | - | YES | - | 16 | - | - | - | 1.8V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 8 | Multimedia; NEON™ MPE | - | - | CAN, ETHERNET, I2C, SPI, UART, USB | - | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | 1.32mm | 14mm | - | - | RoHS Compliant | - | ||
![]() SVF331R3K1CKU2 NXP USA Inc. | 10000 |
| Datasheet | 15 Weeks | - | - | - | 176-LQFP Exposed Pad | YES | - | - | - | - | -40°C~85°C TA | Tray | 2014 | Vybrid, VF3xxR | e3 | - | Active | 3 (168 Hours) | 176 | 5A002.A.1 | Tin (Sn) | - | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 1.23V | - | - | - | 40 | - | - | S-PQFP-G176 | - | - | 1.26V | - | 1.16V | - | - | - | - | - | 266MHz, 133MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | - | YES | 3.3V | - | 10/100Mbps (2) | 2 Core 32-Bit | No | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | - | - | - | - | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() ATSAMA5D22C-CU Microchip Technology | 27 |
| Datasheet | 7 Weeks | - | - | - | 196-TFBGA, CSBGA | YES | - | - | - | - | -40°C~85°C TA | Tray | 2017 | SAMA5D2 | e2 | - | Active | 3 (168 Hours) | 196 | - | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | - | 8542.31.00.01 | - | BOTTOM | BALL | - | 1.2V | 0.75mm | - | - | - | ATSAMA5D22 | - | S-PBGA-B196 | - | - | 1.32V | - | 1.1V | - | - | - | - | - | 500MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | - | 24MHz | - | - | - | 26 | - | - | YES | YES | 16 | FLOATING POINT | - | YES | 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | - | Multimedia; NEON™ MPE | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | - | - | - | 1.2mm | 11mm | - | - | ROHS3 Compliant | - |