NXP USA Inc. MCIMX6Y2DVM09AA
NXP USA Inc. MCIMX6Y2DVM09AA
feed

NXP USA Inc. MCIMX6Y2DVM09AA

Microprocessor ARM® Cortex®-A7 i.MX6 Series 289-LFBGA

Manufacturer No:

MCIMX6Y2DVM09AA

Manufacturer:

NXP USA Inc.

Utmel No:

1786-MCIMX6Y2DVM09AA

Package:

289-LFBGA

ECAD Model:

Description:

0.8mm ARM® Cortex®-A7 Microprocessor i.MX6 Series 289-LFBGA

Quantity:

Unit Price: $11.929105

Ext Price: $11.93

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 387

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $11.929105

    $11.93

  • 10

    $11.253873

    $112.54

  • 100

    $10.616861

    $1,061.69

  • 500

    $10.015907

    $5,007.95

  • 1000

    $9.448969

    $9,448.97

Want a lower wholesale price? Please send RFQ, we will respond immediately.

RFQ Now

Add to RFQ list

User Guide

Purchase & Inquiry
Package
Shipping Information
Shopping Manual
Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
MCIMX6Y2DVM09AA information

Specifications
Documents & Media
Product Details
NXP USA Inc. MCIMX6Y2DVM09AA technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MCIMX6Y2DVM09AA.
  • Type
    Parameter
  • Factory Lead Time
    14 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    289-LFBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~95°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    i.MX6
  • Published
    2015
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    289
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B289
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    1.5V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.375V
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    900MHz
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROPROCESSOR, RISC
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-A7
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    900MHz
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    16
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    YES
  • External Data Bus Width

    The External Data Bus Width refers to the number of bits that can be transmitted simultaneously between a microprocessor and external components, such as memory or peripherals. It determines the amount of data that can be transferred in a single clock cycle. A wider data bus allows for faster data transfer rates and can improve overall system performance. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with larger widths generally offering higher throughput but requiring more complex circuitry. The External Data Bus Width is an important parameter to consider when designing or evaluating electronic components to ensure compatibility and optimal performance.

    16
  • Voltage - I/O

    Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.

    1.8V 2.8V 3.3V
  • Ethernet

    Ethernet is a widely used networking technology that allows devices to communicate with each other over a local area network (LAN). It is a set of standards that define how data is transmitted over a physical medium, typically using twisted-pair cables or fiber optics. Ethernet specifies the protocols for data transmission, addressing, and error detection, ensuring reliable and efficient communication between devices. It is commonly used in homes, businesses, and data centers to connect computers, printers, routers, and other networked devices. Ethernet has evolved over the years to support faster speeds and improved performance, making it a fundamental component of modern networking infrastructure.

    10/100Mbps (2)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration

    Graphics accelerators speed up the displaying of images on the monitor making it possible to achieve effects not otherwise possible - for example, the presentation of very large images or of interactive games in which images need to change quickly in response to user input.

    No
  • RAM Controllers

    RAM controllers are electronic components responsible for managing the flow of data to and from random access memory (RAM) in a computer system. They control the timing and data transfer between the CPU and RAM, ensuring efficient communication and data access. RAM controllers play a crucial role in determining the speed and performance of a computer system by optimizing memory access and utilization. These controllers are typically integrated into the motherboard or processor and are essential for the overall functioning of the system's memory subsystem.

    LPDDR2, DDR3, DDR3L
  • USB

    USB stands for Universal Serial Bus, which is a common interface used for connecting various electronic devices to a computer or other host device. It allows for the transfer of data, power, and communication between devices. USB ports are found on a wide range of devices such as computers, smartphones, printers, cameras, and more. The USB standard has evolved over the years to include different versions with varying data transfer speeds and power delivery capabilities. Overall, USB has become a widely adopted and versatile standard for connecting and interacting with electronic components.

    USB 2.0 OTG + PHY (2)
  • Additional Interfaces

    Additional Interfaces in electronic components refer to the extra connections or ports that allow the component to interact with other devices or systems. These interfaces can include various types of communication protocols such as USB, HDMI, Ethernet, or wireless connections like Bluetooth or Wi-Fi. The presence of additional interfaces expands the functionality and versatility of the electronic component, enabling it to send and receive data, signals, or power to and from external devices. Designers and users can utilize these interfaces to enhance the capabilities and connectivity of the electronic component within a larger system or network.

    CAN, I2C, SPI, UART
  • Number of Serial I/Os
    8
  • Co-Processors/DSP

    Co-processors and Digital Signal Processors (DSPs) are specialized electronic components designed to handle specific types of computation tasks more efficiently than a general-purpose CPU. Co-processors assist the main processor by executing complex mathematical calculations or processing data in parallel, often enhancing performance for applications like graphics rendering or scientific computations. DSPs, on the other hand, are optimized for processing digital signals in real-time, making them ideal for applications in audio processing, telecommunications, and image processing. Together, these components enable more efficient data handling and improved system performance in various electronic devices.

    Multimedia; NEON™ MPE
  • Bus Compatibility

    Bus compatibility in electronic components refers to the ability of a device to communicate effectively with other devices on a shared data bus. This parameter is crucial in ensuring that different components can exchange information seamlessly and operate together without compatibility issues. It involves factors such as voltage levels, signal timing, and data protocols that need to be standardized for proper communication. Components with good bus compatibility can work together efficiently in a system, while those with poor compatibility may lead to communication errors or system malfunctions. Manufacturers often specify the bus compatibility of their components to help users ensure proper integration and functionality within their electronic systems.

    CAN, ETHERNET, I2C, SPI, UART, USB
  • Security Features

    Security features include authentication of both users and devices as well as authorization of access to different resources such as IoT data, DM, and other system features.

    A-HAB, ARM TZ, CSU, SJC, SNVS
  • Display & Interface Controllers

    A unit in a computer system consisting of channels and associated control circuitry that connect a number of visual display units with a central processor.

    Electrophoretic, LCD
  • Length
    14mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1.32mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
0 Similar Products Remaining
Download datasheets and manufacturer documentation for NXP USA Inc. MCIMX6Y2DVM09AA.

MCIMX6Y2DVM09AA  Description

The i.MX 6UltraLite is a high-performance, ultra-efficient processor family featuring NXP's advanced implementation of the single ARM Cortex?-A7 core,

which operates at speeds up to 528 MHz. The i.MX 6UltraLite includes an integrated power management module that reduces the complexity of the external

power supply and simplifies the power sequencing. Each processor in this family provides various memory interfaces, including LPDDR2, DDR3, DDR3L, Raw

and Managed NAND flash, NOR flash, eMMC, Quad SPI, and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth?, GPS,

displays, and camera sensors.



MCIMX6Y2DVM09AA  Features

Single-core Arm Cortex-A7—The single-core A7 provides a cost-effective and power-efficient

solution.

Multilevel memory system—The multilevel memory system of the processor is based on the L1

instruction and data caches, L2 cache, and internal and external memory. The processor supports

many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR

Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including

eMMC up to rev 4.4/4.41/4.5.

Smart speed technology—Power management implemented throughout the IC that enables

multimedia features and peripherals to consume minimum power in both active and various low

power modes.

Dynamic voltage and frequency scaling—The power efficiency of devices by scaling the voltage

and frequency to optimize performance.

Multimedia powerhouse—The multimedia performance of processor is enhanced by a multilevel

cache system, NEON? MPE (Media Processor Engine) co-processor, a programmable smart

DMA (SDMA) controller, an asynchronous audio sample rate converter, an Electrophoretic

Display (EPD) controller, and a Pixel processing pipeline (PXP) to support 2D image processing,

including color-space conversion, scaling, alpha-blending, and rotation.

2x Ethernet interfaces—2x 10/100 Mbps Ethernet controllers.



MCIMX6Y2DVM09AA  Applications

Telematics

Audio playback

Connected devices

IoT Gateway

Access control panels

Human Machine Interfaces (HMI)

Portable medical and health care

IP phones

Smart appliances

eReaders




MCIMX6Y2DVM09AA Relevant information

Hot Sale
Related Categories
Similar Products
Related Products
Same Manufacturer Products
The following parts include "MCIMX6Y2DVM09AA" in NXP USA Inc. MCIMX6Y2DVM09AA.
  • Part Number
  • Manufacturer
  • Package
  • Description