- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Weight | Memory Types | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() R7S721021VCFP#AA1 Renesas Electronics America | 26 | - | - | 20 Weeks | - | - | - | 208-LQFP | YES | 208 | - | ROMless | 100 | 3145728 | 0 | - | -40°C~85°C TA | Tray | - | RZ/A1L | - | yes | Active | 3 (168 Hours) | 208 | - | - | - | - | QUAD | GULL WING | - | 1.18V | 0.5mm | 400MHz | - | - | 208 | - | Not Qualified | - | 1.26V | 1.183.3V | 1.1V | - | CAN, EBI/EMI, Ethernet, I2C, LIN, SCI, SPI, UART, USART, USB | - | - | - | External | - | 3MB | MICROCONTROLLER | - | ARM® Cortex®-A9 | DMA, POR, PWM, WDT | - | 492mA | 32 | YES | YES | - | YES | - | - | 26 | ARM | CORTEX-A9 | - | - | 32 | - | - | - | 1.2V 3.3V | - | 10/100Mbps | 1 Core 32-Bit | Yes | SDRAM, SRAM | USB 2.0 (2) | CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | - | Multimedia; NEON™ MPE | - | - | - | - | - | VDC | - | - | - | 28mm | - | - | - | - | ROHS3 Compliant | Lead Free | ||
![]() AM3517AZERC Texas Instruments | 5000 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | Copper, Silver, Tin | - | 484-BBGA Exposed Pad | YES | 484 | - | - | 186 | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 484 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.2V | - | 600MHz | - | AM3517 | 484 | - | - | 1.2V | - | - | - | 1.248V | I2S, USB | 1.248V | 1.152V | - | - | - | 64kB | MICROPROCESSOR, RISC | - | ARM® Cortex®-A8 | - | - | - | 16 | - | - | 16b | - | - | 12 | - | ARM | - | YES | YES | - | FLOATING POINT | YES | 65536 | 1.8V 3.3V | 4 | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | 1 | - | - | - | Cryptography | LCD | - | 2.48mm | - | 23mm | 23mm | 1.78mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
![]() MPC8280ZUUPEA NXP USA Inc. | 830 | - | Datasheet | 18 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | MPC8280 | - | S-PBGA-B480 | - | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | - | 450MHz | - | MICROPROCESSOR, RISC | - | PowerPC G2_LE | - | - | - | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | - | Non-RoHS Compliant | - | ||
![]() LS1043ASE7QQB NXP USA Inc. | 36 | - | Datasheet | 18 Weeks | - | - | - | 621-FBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 621 | - | - | ALSO OPERATES AT 1V NOMINAL SUPPLY | - | BOTTOM | BALL | 250 | 0.9V | 0.8mm | - | 30 | - | - | S-PBGA-B621 | - | - | 0.93V | - | 0.87V | - | - | - | - | - | - | 1.6GHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A53 | - | - | - | 64 | - | - | - | - | - | - | 16 | - | - | YES | YES | 32 | FIXED POINT | YES | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | 2.07mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX357DVM5B NXP USA Inc. | 100000 |
| - | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | - | 4 | - | - | - | -20°C~70°C TA | Tray | 2008 | i.MX35 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX357 | - | S-PBGA-B400 | Not Qualified | - | 1.47V | - | 1.33V | - | - | - | - | - | - | 532MHz | - | MULTIFUNCTION PERIPHERAL | - | ARM1136JF-S | - | 24MHz | - | - | - | - | - | - | - | - | - | - | - | YES | - | - | - | - | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | - | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | - | - | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | - | - | 1.6mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX283CVM4BR2 NXP USA Inc. | 27 |
| Datasheet | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2002 | i.MX28 | e1 | - | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX283 | - | S-PBGA-B289 | - | - | 1.55V | 1.41.8V | 1.35V | - | - | - | - | - | - | 454MHz | - | MICROPROCESSOR, RISC | - | ARM926EJ-S | - | 24MHz | - | 32 | - | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | Data; DCP | - | - | - | - | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | - | - | 1.37mm | 14mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6X3EVN10AB NXP USA Inc. | 9 |
| Datasheet | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | - | 179 | - | - | - | -20°C~105°C TJ | Tray | 2002 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | S-PBGA-B400 | - | - | 1.5V | - | 1.35V | - | - | - | - | - | - | 227MHz, 1GHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | 1000MHz | - | - | - | - | - | - | - | - | 15 | - | - | YES | - | 32 | - | - | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | - | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | 1.53mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8321VRADDCA NXP USA Inc. | 185 | - | - | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | - | - | S-PBGA-B516 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | - | PowerPC e300c2 | - | 66.67MHz | - | 32 | - | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; QUICC Engine | - | - | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC852TCVR80A NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 256-BBGA | YES | - | - | - | - | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC852 | - | S-PBGA-B256 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 80MHz | - | MICROPROCESSOR, RISC | - | - | - | 66MHz | - | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | - | Communications; CPM | - | - | - | - | - | - | - | - | 2.54mm | 23mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX502CVM8B NXP USA Inc. | 27 |
| Datasheet | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2008 | i.MX50 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.225V | 0.8mm | - | 40 | MCIMX502 | - | S-PBGA-B400 | Not Qualified | - | 1.275V | - | 1.175V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR CIRCUIT | - | ARM® Cortex®-A8 | - | 800MHz | - | - | - | - | - | - | - | - | - | - | - | YES | - | - | - | - | 131072 | 1.2V 1.875V 2.775V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | Boot Security, Cryptography, Secure JTAG | LCD | - | - | 1.6mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6V7DVN10AB NXP USA Inc. | 109 | - | Datasheet | 12 Weeks | - | - | - | 432-TFBGA | - | - | - | - | - | - | - | - | 0°C~95°C TJ | Tray | 2002 | i.MX6SLL | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1GHz | - | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2V 1.8V 2.5V 3.3V | - | - | 1 Core 32-Bit | Yes | LPDDR2, LPDDR3 | USB 2.0 OTG + PHY (2) | - | - | Multimedia; NEON™ SIMD | - | - | - | - | A-HAB, ARM TZ, CSU, SJC, SNVS | EPDC, LCD | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() OMAPL132EZWT2 Texas Instruments | 5 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | - | 361-LFBGA | YES | 361 | - | - | - | - | - | - | 0°C~90°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 200MHz | - | OMAPL132 | 361 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR CIRCUIT | - | ARM926EJ-S | - | - | - | - | - | - | - | - | - | - | - | ARM | - | - | - | - | - | - | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (1) | AC97, I2C, I2S, McASP, McBSP, MMC/SD/SDIO, SPI, UART | - | Signal Processing; C674x, System Control; CP15 | 1 | - | - | - | - | - | - | 1.4mm | - | 16mm | 16mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
![]() MCIMX6D7CVT08AC NXP USA Inc. | 5 | - | Datasheet | - | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6D | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX6 | - | S-PBGA-B624 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A9 | - | 24MHz | - | 64 | - | - | - | - | - | - | 16 | - | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MC68EN360AI25VL NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 240-BFQFP | YES | - | - | - | 46 | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | - | 40 | MC68EN360 | - | S-PQFP-G240 | - | - | 5.25V | - | 4.75V | - | - | - | - | - | - | 25MHz | - | MICROCONTROLLER, RISC | - | CPU32+ | - | 6MHz | - | 32 | NO | YES | - | NO | NO | - | 32 | - | - | - | - | 32 | - | - | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | - | Communications; CPM | - | - | - | - | - | - | - | - | 4.15mm | 31.305mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() LS1021ASN7KQB NXP USA Inc. | 2830 |
| Datasheet | 18 Weeks | - | - | - | 525-FBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 525 | 3A991.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | - | - | S-PBGA-B525 | - | - | 1.03V | - | 0.97V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR CIRCUIT | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 3.0 (1) + PHY | - | - | - | - | - | - | - | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | - | 2.07mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8343VRAGDB NXP USA Inc. | 1858 | - | - | 12 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8343 | - | S-PBGA-B620 | - | - | 1.26V | 1.22.53.3V | 1.14V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | - | PowerPC e300 | - | 66MHz | - | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | 2.46mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() AM1806EZWT3 Texas Instruments | 39 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | Surface Mount | 361-LFBGA | - | 361 | 789.392471mg | L1 Cache, RAM, ROM | - | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | - | AM1806 | - | - | - | 1.2V | - | - | - | - | Ethernet, I2C, SPI, UART, USB | - | - | 64kB | - | - | 128kB | MICROPROCESSOR, RISC | - | ARM926EJ-S | - | - | - | 32 | - | - | 32b | - | - | - | - | ARM | - | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | - | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | - | System Control; CP15 | 1 | - | - | - | - | LCD | - | 1.4mm | - | 16mm | 16mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
![]() AM5718AABCXQ1 Texas Instruments | 2341 |
| Datasheet | 8 Weeks | ACTIVE (Last Updated: 3 days ago) | - | - | 760-BFBGA, FCBGA | YES | 760 | - | - | - | - | - | Automotive grade | -40°C~125°C TJ | - | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 760 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | - | 1.15V | 0.8mm | - | - | AM5718 | - | - | - | - | 1.2V | - | 1.11V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A15 | - | 38.4MHz | - | - | - | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | NO | 524288 | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | - | Multimedia; GPU, IPU, VFP | - | - | - | - | - | HDMI, LCD | SATA 3Gbps (1) | 2.96mm | - | 23mm | 23mm | 2.39mm | - | - | ROHS3 Compliant | - | ||
![]() OMAPL138BZWT3 Texas Instruments | 81 | - | Datasheet | - | - | Copper, Silver, Tin | Surface Mount | 361-LFBGA | - | 361 | - | - | - | - | - | - | 0°C~90°C TJ | Tray | - | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1V | 0.8mm | 375MHz | - | OMAPL138 | 361 | - | - | 1.3V | - | - | - | 1.35V | I2C, SPI, UART | 1.35V | - | - | - | - | 64kB | DIGITAL SIGNAL PROCESSOR, OTHER | 32 | ARM926EJ-S | - | - | - | - | - | - | 16b | - | - | - | - | ARM | - | YES | YES | - | FLOATING POINT | - | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | - | Signal Processing; C674x, System Control; CP15 | - | - | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | - | 1.4mm | 16mm | - | - | - | No SVHC | ROHS3 Compliant | Lead Free | ||
![]() ATSAMA5D35A-CN Microchip Technology | 36 | - | Datasheet | 10 Weeks | - | - | - | 324-LFBGA | - | 324 | - | L1 Cache, ROM, SRAM | 160 | - | - | - | -40°C~105°C TA | Tray | 2015 | SAMA5D3 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | 536MHz | - | ATSAMA5D35 | - | - | - | 1.2V | - | - | - | - | 2-Wire, CAN, EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB | 1.32V | 1.08V | 160kB | Internal | - | 128kB | - | - | ARM® Cortex®-A5 | DMA, POR, PWM, WDT | - | - | - | - | - | 32b | - | - | 2 | - | ARM | - | - | - | - | - | - | - | 1.2V 1.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | CAN, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | - | - | 1 | - | - | - | AES, SHA, TDES, TRNG | Touchscreen | - | - | - | - | - | - | - | - | ROHS3 Compliant | - |