- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
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Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Bus Compatibility | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 AM3351BZCE30 Texas Instruments | 27 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | - | - | 289-LFBGA | YES | 298 | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 298 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | 0.65mm | - | NOT SPECIFIED | AM3351 | - | - | - | - | 1.144V | - | 1.056V | - | - | - | - | - | 300MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 26MHz | 32 | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | 131072 | 1.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (1) | I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | - | Cryptography, Random Number Generator | LCD, Touchscreen | 64 | - | 1.3mm | - | 13mm | 13mm | 890μm | - | ROHS3 Compliant | Lead Free | ||
 MPC8260ACZUMHBB NXP USA Inc. | 21 | - | Datasheet | 12 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | 30 | PC8260 | - | S-PBGA-B480 | - | - | 2.2V | - | 1.9V | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | - | - | 32 | - | YES | NO | - | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | Non-RoHS Compliant | - | ||
 MC68EN360AI25L NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 240-BFQFP | YES | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | - | - | - | 40 | MC68EN360 | - | S-PQFP-G240 | - | - | - | - | - | - | - | - | - | - | 25MHz | - | RISC MICROCONTROLLER | CPU32+ | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6X4CVM08AB NXP USA Inc. | 5000 | - | Datasheet | 15 Weeks | - | - | - | 529-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6SX | - | - | Active | 3 (168 Hours) | 529 | 5A992 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | NOT SPECIFIED | - | - | S-PBGA-B529 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | 200MHz, 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | 16 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | - | - | - | 1.5mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
MPC8255ACZUMHBB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 1997 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | 30 | PC8255 | - | S-PBGA-B480 | - | - | 2.2V | - | 1.9V | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | - | - | 32 | - | YES | NO | - | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | Non-RoHS Compliant | - | ||
 AM1808BZCE3 Texas Instruments | 62842 | - | Datasheet | - | - | Copper, Silver, Tin | Surface Mount | 361-LFBGA | - | 361 | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | - | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.2V | 0.65mm | 300MHz | - | AM1808 | 361 | - | - | - | - | - | - | 1.32V | I2C, SPI, UART, USB | 1.3V | 950mV | 64kB | - | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | 32 | 32b | 4 | 23 | ARM | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | - | - | - | LCD | - | SATA 3Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | Contains Lead | ||
 MCIMX27MOP4A NXP USA Inc. | 32 |
| Datasheet | - | - | - | - | 473-LFBGA | YES | - | - | - | - | -40°C~85°C TA | Tray | 2004 | i.MX27 | e1 | - | Not For New Designs | 3 (168 Hours) | 473 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | - | 40 | MCIMX27 | - | S-PBGA-B473 | Not Qualified | - | 1.52V | - | 1.38V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | ARM926EJ-S | 26MHz | 32 | - | - | 26 | - | YES | YES | - | 16 | FIXED POINT | YES | - | 2.0V 2.5V 2.7V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | Security; SAHARAH2 | - | - | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | - | - | - | 1.54mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
 MPC860DEZQ50D4R2 NXP USA Inc. | 191 | - | Datasheet | 8 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tape & Reel (TR) | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | 32 | - | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MPC8377CVRANGA NXP USA Inc. | 2443 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | MPC8377 | - | S-PBGA-B689 | - | - | 1.1V | 1.051.8/2.52.5/3.3V | 1V | - | - | - | - | - | 800MHz | - | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
MCIMX6X4AVM08AC NXP USA Inc. | 5 |
| Datasheet | 14 Weeks | - | - | - | 529-LFBGA | - | - | - | - | - | -40°C~125°C TJ | Tray | 2017 | i.MX6SX | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | 200MHz, 800MHz | - | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 AM3715CBPD100 Texas Instruments | 104 |
| Datasheet | - | NRND (Last Updated: 3 days ago) | - | - | 515-WFBGA, FCBGA | YES | 515 | ROM | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | - | 1GHz | - | AM3715 | 515 | - | - | 1.1V | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.5V | - | 32kB | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | 32b | - | - | ARM | YES | YES | - | - | FLOATING POINT | YES | 65536 | - | 4 | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | - | - | LCD | - | - | 700μm | - | 12mm | 12mm | 500μm | No | ROHS3 Compliant | Lead Free | ||
MPC860TVR50D4 NXP USA Inc. | 297 |
| Datasheet | 8 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 2004 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | 32 | - | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8555ECPXAJD NXP USA Inc. | 2258 | - | Datasheet | - | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e0 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | - | 30 | MPC8555 | - | S-PBGA-B783 | - | - | 1.26V | - | 1.14V | - | - | - | - | - | 533MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | - | - | 64 | - | YES | YES | - | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | - | 3.75mm | 29mm | - | - | - | Non-RoHS Compliant | - | ||
AM3715CBP Texas Instruments | 36 |
| Datasheet | - | NRND (Last Updated: 5 days ago) | Copper, Silver, Tin | - | 515-WFBGA, FCBGA | YES | 515 | ROM | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | - | 800MHz | - | AM3715 | 515 | - | - | 1.1V | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.5V | - | 32kB | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | 32b | - | - | ARM | YES | YES | - | - | FLOATING POINT | YES | 65536 | - | 4 | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | - | - | LCD | - | - | 700μm | - | 12mm | 12mm | 500μm | No | ROHS3 Compliant | Lead Free | ||
 MCIMX7D7DVK10SD NXP USA Inc. | 30 | - | - | 16 Weeks | - | - | - | 488-TFBGA | YES | - | - | - | Commercial grade | 0°C~95°C TJ | Tray | 2012 | i.MX7D | - | - | Active | 3 (168 Hours) | 488 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.4mm | - | 40 | - | - | S-PBGA-B488 | - | - | 1.25V | - | 1.045V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 32 | - | - | 16 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 3.3V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | - | - | 1.1mm | 12mm | - | - | - | ROHS3 Compliant | - | ||
MPC880VR66 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC880 | - | S-PBGA-B357 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | - | 32 | - | - | 32 | - | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
 MPC755BPX300LE NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 360-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | - | Obsolete | 3 (168 Hours) | 360 | 3A991 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | - | 30 | MPC755 | - | S-PBGA-B360 | - | - | 2.1V | - | 1.8V | - | - | - | - | - | 300MHz | - | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | - | - | 32 | - | YES | YES | - | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | - | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | 2.77mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MCIMX355AJQ5C NXP USA Inc. | 12700 |
| Datasheet | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | 3 | Automotive grade | -40°C~85°C TA | Tray | 2002 | i.MX35 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX355 | - | S-PBGA-B400 | - | - | 1.47V | - | 1.33V | - | - | - | - | - | 532MHz | - | - | ARM1136JF-S | - | - | - | - | - | - | YES | - | AEC-Q100 | - | - | - | - | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART | Multimedia; IPU, VFP | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; SPI; UART; USB | Secure Fusebox, Secure JTAG | Keypad, KPP, LCD | - | - | - | 1.6mm | 17mm | - | - | - | ROHS3 Compliant | - | ||
 AM3715CBCD100 Texas Instruments | 36 |
| Datasheet | - | NRND (Last Updated: 3 days ago) | - | - | 515-VFBGA, FCBGA | YES | 515 | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | 0.5mm | 1GHz | - | AM3715 | 515 | - | - | 1.1V | - | - | - | 1.8V | - | 1.5V | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | - | - | - | ARM | YES | YES | - | - | FLOATING POINT | YES | 65536 | - | 4 | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | - | - | LCD | - | - | 950μm | - | 14mm | 14mm | 630μm | No | ROHS3 Compliant | Lead Free | ||
 MPC8270ZQMIBA NXP USA Inc. | 44 |
| Datasheet | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8270 | - | S-PBGA-B516 | - | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | 266MHz | 32 | - | - | 32 | - | YES | NO | - | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | Non-RoHS Compliant | - |