NXP USA Inc. MCIMX355AJQ5C

Microprocessor ARM1136JF-S i.MX35 Series 400-LFBGA

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

The center distance from one pole to the next.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.

Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.

Ethernet is a widely used networking technology that allows devices to communicate with each other over a local area network (LAN). It is a set of standards that define how data is transmitted over a physical medium, typically using twisted-pair cables or fiber optics. Ethernet specifies the protocols for data transmission, addressing, and error detection, ensuring reliable and efficient communication between devices. It is commonly used in homes, businesses, and data centers to connect computers, printers, routers, and other networked devices. Ethernet has evolved over the years to support faster speeds and improved performance, making it a fundamental component of modern networking infrastructure.

Graphics accelerators speed up the displaying of images on the monitor making it possible to achieve effects not otherwise possible - for example, the presentation of very large images or of interactive games in which images need to change quickly in response to user input.

RAM controllers are electronic components responsible for managing the flow of data to and from random access memory (RAM) in a computer system. They control the timing and data transfer between the CPU and RAM, ensuring efficient communication and data access. RAM controllers play a crucial role in determining the speed and performance of a computer system by optimizing memory access and utilization. These controllers are typically integrated into the motherboard or processor and are essential for the overall functioning of the system's memory subsystem.

USB stands for Universal Serial Bus, which is a common interface used for connecting various electronic devices to a computer or other host device. It allows for the transfer of data, power, and communication between devices. USB ports are found on a wide range of devices such as computers, smartphones, printers, cameras, and more. The USB standard has evolved over the years to include different versions with varying data transfer speeds and power delivery capabilities. Overall, USB has become a widely adopted and versatile standard for connecting and interacting with electronic components.

Additional Interfaces in electronic components refer to the extra connections or ports that allow the component to interact with other devices or systems. These interfaces can include various types of communication protocols such as USB, HDMI, Ethernet, or wireless connections like Bluetooth or Wi-Fi. The presence of additional interfaces expands the functionality and versatility of the electronic component, enabling it to send and receive data, signals, or power to and from external devices. Designers and users can utilize these interfaces to enhance the capabilities and connectivity of the electronic component within a larger system or network.

Co-processors and Digital Signal Processors (DSPs) are specialized electronic components designed to handle specific types of computation tasks more efficiently than a general-purpose CPU. Co-processors assist the main processor by executing complex mathematical calculations or processing data in parallel, often enhancing performance for applications like graphics rendering or scientific computations. DSPs, on the other hand, are optimized for processing digital signals in real-time, making them ideal for applications in audio processing, telecommunications, and image processing. Together, these components enable more efficient data handling and improved system performance in various electronic devices.

Bus compatibility in electronic components refers to the ability of a device to communicate effectively with other devices on a shared data bus. This parameter is crucial in ensuring that different components can exchange information seamlessly and operate together without compatibility issues. It involves factors such as voltage levels, signal timing, and data protocols that need to be standardized for proper communication. Components with good bus compatibility can work together efficiently in a system, while those with poor compatibility may lead to communication errors or system malfunctions. Manufacturers often specify the bus compatibility of their components to help users ensure proper integration and functionality within their electronic systems.

Security features include authentication of both users and devices as well as authorization of access to different resources such as IoT data, DM, and other system features.

A unit in a computer system consisting of channels and associated control circuitry that connect a number of visual display units with a central processor.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.