- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
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Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Halogen Free | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Max Frequency | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Number of Cores | Number of External Interrupts | Bus Compatibility | Security Features | Display & Interface Controllers | Communication Protocol | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6Y7DVM09AA NXP USA Inc. | 7 | - | Datasheet | 53 Weeks | - | - | 289-LFBGA | YES | - | - | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | - | Obsolete | 3 (168 Hours) | 289 | - | - | - | - | - | - | BOTTOM | BALL | - | - | 0.8mm | compliant | - | - | - | - | S-PBGA-B289 | - | - | 1.5V | - | - | 1.375V | - | - | - | - | - | 900MHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A7 | 900MHz | - | - | - | - | - | - | - | - | 16 | - | - | YES | - | 16 | - | - | - | 1.8V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 4 | Multimedia; NEON™ MPE | - | - | - | ETHERNET, I2C, PCI, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | 1.32mm | 14mm | - | - | - | - | RoHS Compliant | - | ||
 MPC860TVR80D4 NXP USA Inc. | 325 | - | Datasheet | - | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | 80MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
 Z84C0008PEG Zilog | 7 | - | - | 13 Weeks | - | Through Hole | 40-DIP (0.620, 15.75mm) | - | 40 | ROMless | 24 | - | - | -40°C~100°C TA | Tube | 2002 | Z80 | e3 | yes | Active | 1 (Unlimited) | 40 | 3A001.A.2.C | MATTE TIN | - | - | DRAM REFRESH COUNTER | - | DUAL | - | - | 5V | 2.54mm | - | 8MHz | - | Z84C00 | 40 | - | - | - | - | - | - | - | 5V | - | 5V | 4.5V | 64kB | - | - | MICROPROCESSOR | 8 | - | - | 8 | - | - | 8b | - | - | - | - | - | Z8 | - | NO | YES | - | FIXED POINT | NO | 0 | 5.0V | - | - | 1 Core 8-Bit | No | - | - | - | - | - | - | - | 2 | - | - | - | - | - | 4.19mm | - | 62.74mm | 14.22mm | - | - | Unknown | ROHS3 Compliant | Lead Free | ||
 MCIMX6DP4AVT8AB NXP USA Inc. | 2698 |
| Datasheet | 26 Weeks | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | - | - | Active | 3 (168 Hours) | 624 | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | - | 1.225V | - | - | - | - | - | 852MHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 LS1048ASE7Q1A NXP USA Inc. | 2076 |
| Datasheet | 18 Weeks | - | - | 780-BFBGA, FCBGA | - | - | - | - | - | - | 0°C~105°C | - | - | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | 250 | - | - | - | - | 30 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10GbE (2), 1GbE (8) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | - | - | - | - | Secure Boot, TrustZone® | - | - | SATA 6Gbps (1) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC850CZQ50BU NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 256-BBGA | YES | - | - | - | - | - | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | - | - | 40 | MPC850 | - | S-PBGA-B256 | - | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | - | - | 26 | - | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | 2.35mm | 23mm | - | - | - | - | Non-RoHS Compliant | - | ||
 MPC8536BVJAVLA NXP USA Inc. | 2757 | - | Datasheet | 18 Weeks | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Active | 3 (168 Hours) | 783 | 3A991.A.2 | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | - | MPC8536 | - | S-PBGA-B783 | - | - | 1.05V | - | - | 0.95V | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR | - | PowerPC e500 | - | 32 | - | - | - | - | - | - | - | 16 | - | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | 2.76mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8347EVVAJF NXP USA Inc. | 25000 | - | Datasheet | - | - | - | 672-LBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2009 | MPC83xx | e2 | - | Obsolete | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | - | 40 | MPC8347 | - | S-PBGA-B672 | - | - | 1.26V | 1.22.53.3V | - | 1.14V | - | - | - | - | - | 533MHz | - | MICROPROCESSOR | - | PowerPC e300 | 66MHz | 32 | - | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | Security; SEC | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 1.69mm | 35mm | - | - | - | - | ROHS3 Compliant | - | ||
MPC8555PXALF NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC85xx | e0 | - | Obsolete | 3 (168 Hours) | 783 | 5A992 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | - | - | 30 | MPC8555 | - | S-PBGA-B783 | - | - | 1.26V | - | - | 1.14V | - | - | - | - | - | 667MHz | - | MICROPROCESSOR, RISC | - | PowerPC e500 | 166MHz | 32 | - | - | - | - | - | - | - | 64 | - | - | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | 3.75mm | 29mm | - | - | - | - | Non-RoHS Compliant | - | ||
 OMAP3530DCBCA Texas Instruments | In Stock | - | Datasheet | - | - | Surface Mount | 515-VFBGA, FCBGA | - | 515 | L2 Cache, ROM, SRAM | - | - | - | -40°C~105°C TJ | Tray | - | OMAP-35xx | e1 | no | Obsolete | 3 (168 Hours) | 515 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 260 | 1.8V | 0.65mm | - | 720MHz | - | OMAP3530 | 515 | - | - | - | - | - | - | - | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | - | 600 MHz | 64kB | MICROPROCESSOR, RISC | - | ARM® Cortex®-A8 | - | 32 | - | - | 32b | - | - | - | 12 | 26 | ARM | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | Signal Processing; C64x+, Multimedia; NEON™ SIMD | - | - | - | - | - | LCD | - | - | - | 1mm | 14mm | - | - | No | - | ROHS3 Compliant | Contains Lead | ||
 MCIMX6D4AVT10AC NXP USA Inc. | 10086 |
| Datasheet | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | - | 40 | MCIMX6 | - | S-PBGA-B624 | - | - | 1.5V | - | - | 1.35V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 16 | - | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8260AZUMHBB NXP USA Inc. | 127 | - | Datasheet | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | - | 30 | PC8260 | - | S-PBGA-B480 | - | - | 2.2V | - | - | 1.9V | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | - | PowerPC G2 | 66.66MHz | 32 | - | - | - | - | - | - | - | 32 | - | - | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | - | Non-RoHS Compliant | - | ||
 MCIMX6X4EVM10AC NXP USA Inc. | 11 |
| Datasheet | 15 Weeks | - | - | 529-LFBGA | - | - | - | - | - | - | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | 260 | - | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 227MHz, 1GHz | - | - | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | - | Multimedia; NEON™ MPE | - | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC860SRVR66D4 NXP USA Inc. | 220 | - | Datasheet | - | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
MPC850DECZQ50BU NXP USA Inc. | 12 | - | Datasheet | 12 Weeks | - | - | 256-BBGA | YES | - | - | - | - | - | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | - | - | 40 | MPC850 | - | S-PBGA-B256 | - | - | 3.6V | 3.3V | - | 3V | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | - | - | - | 26 | - | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | 2.54mm | 23mm | - | - | - | - | Non-RoHS Compliant | - | ||
MC68302FC16C Freescale Semiconductor, Inc. (NXP Semiconductors) | 1000 | - | - | - | - | - | PQFP | YES | 132 | - | - | - | - | - | Bulk | - | - | e0 | - | - | 3 (168 Hours) | 132 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | - | - | QUAD | GULL WING | - | 5V | 0.635mm | - | 16MHz | - | - | 132 | - | Not Qualified | - | 5.5V | 5V | COMMERCIAL | 4.5V | - | - | - | - | - | - | - | SERIAL IO/COMMUNICATION CONTROLLER, LAN | - | - | - | - | - | - | - | - | Not Halogen Free | - | - | 24 | - | - | YES | NO | 16 | - | - | - | - | - | - | - | - | - | - | - | 4 | - | - | 1 | - | 68000 | - | - | ASYNC, BIT | - | - | 4.572mm | - | - | - | - | - | RoHS Compliant | Contains Lead | ||
 MPC8572EVJATLE NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | - | - | 1023-BBGA, FCBGA | - | - | - | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC85xx | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8572 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | - | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | - | DUART, HSSI, I2C, RapidIO | - | Signal Processing; SPE, Security; SEC | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 AM3894CCYG135 Texas Instruments | In Stock | - | Datasheet | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | - | 1031-BFBGA, FCBGA | YES | 1031 | - | 64 | - | - | 0°C~95°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 4 (72 Hours) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 245 | 1V | 0.65mm | - | - | NOT SPECIFIED | AM3894 | - | - | Not Qualified | 3.3V | 1.05V | 1V | - | - | - | SDIO, SPI, UART, USB | - | - | 32kB | 1.35GHz | 64kB | MICROPROCESSOR, RISC | - | ARM® Cortex®-A8 | - | 32 | - | - | 32b | - | - | - | 7 | - | ARM | 1.33GHz | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 3 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | DDR2, DDR3 | USB 2.0 + PHY (2) | I2C, McASP, McBSP, SPI, SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | HDMI, HDVPSS | - | SATA 3Gbps (1) | 3.31mm | - | 25mm | 25mm | 2.81mm | - | - | ROHS3 Compliant | Lead Free | ||
 MVF60NN151CMK50 NXP USA Inc. | 7 | - | Datasheet | 15 Weeks | - | - | 364-LFBGA | YES | - | - | 131 | 0 | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | - | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | - | - | 40 | MVF60NN151 | - | S-PBGA-B364 | Not Qualified | - | 1.26V | 3.3V | - | 1.16V | - | - | - | - | - | 500MHz, 167MHz | - | MICROCONTROLLER, RISC | - | ARM® Cortex®-A5 + Cortex®-M4 | - | 16 | YES | YES | - | NO | - | YES | - | 16 | - | - | - | - | 16 | - | - | - | 3.3V | - | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | FLASH | - | - | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
 OMAP3530ECBBALPD Texas Instruments | 36 |
| Datasheet | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | - | 515-VFBGA, FCBGA | YES | 515 | - | - | - | - | -40°C~105°C TJ | Tray | - | OMAP-35xx | e1 | yes | Active | 3 (168 Hours) | 515 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 260 | 1.35V | 0.5mm | - | 600MHz | NOT SPECIFIED | OMAP3530 | 515 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | ARM | - | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | Signal Processing; C64x+, Multimedia; NEON™ SIMD | - | 1 | - | - | - | LCD | - | - | 900μm | - | 12mm | 12mm | 610μm | - | - | ROHS3 Compliant | Lead Free |