- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
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- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Operating Temperature (Max.) | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of External Interrupts | Number of PWM Channels | Bus Compatibility | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 MPC860ENVR80D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | 80MHz | - | MICROPROCESSOR, RISC | - | - | - | 50MHz | - | 32 | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
 SVF512R3K2CMK4 NXP USA Inc. | 23 | - | Datasheet | 15 Weeks | - | - | - | 364-LFBGA | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | - | Vybrid, VF5xxR | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A5 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | - | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC850ZQ50BU NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 256-BBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | - | 40 | MPC850 | - | S-PBGA-B256 | - | 3.6V | 3.3V | - | 3V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | - | - | - | 32 | - | - | - | 26 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | - | 2.54mm | 23mm | - | - | - | - | Non-RoHS Compliant | - | ||
 LS102MASE7EHA NXP USA Inc. | In Stock | - | - | 12 Weeks | - | - | - | 448-FBGA Exposed Pad | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2014 | QorlQ LS1 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 650MHz | - | - | - | ARM1136JF-S | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (2) | 2 Core 32-Bit | No | DDR2 | USB 2.0 + PHY (1) | I2C, PCIe, PCM/TDM, SPI, UART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8540VT667LC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 784-BBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2001 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8540 | - | S-PBGA-B783 | - | 1.26V | - | - | 1.14V | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | - | PowerPC e500 | - | 166MHz | - | 32 | - | - | - | 64 | - | YES | YES | 64 | FIXED POINT | YES | - | 2.5V 3.3V | - | 10/100Mbps (1), 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI, RapidIO | - | - | - | - | - | - | - | - | - | 3.85mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6G3DVM05AA NXP USA Inc. | 5 | - | Datasheet | 10 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | Commercial grade | - | 0°C~95°C TJ | Tray | 2012 | i.MX6UL | - | - | Obsolete | 3 (168 Hours) | 289 | 5A992 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | S-PBGA-B289 | - | 1.5V | - | - | 1.275V | - | - | - | - | - | - | 528MHz | - | MICROPROCESSOR | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | 16 | - | YES | YES | 16 | FIXED POINT | YES | - | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | - | - | - | 1.32mm | 14mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX31VMN5C NXP USA Inc. | 671 | - | Datasheet | - | - | - | - | 473-LFBGA | - | - | 473-MAPBGA (19x19) | - | - | - | - | - | 0°C~70°C TA | Tray | 2008 | i.MX31 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | MCIMX31 | - | - | - | - | - | - | - | - | - | - | - | - | - | 532MHz | - | - | - | ARM1136JF-S | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.0V 2.5V 2.7V 3.0V | - | - | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | - | - | - | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 OMAP3525ECUS Texas Instruments | 7 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 2 weeks ago) | - | Surface Mount | 423-LFBGA, FCBGA | - | 423 | - | L2 Cache, ROM, SRAM | - | - | - | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | - | Active | 4 (72 Hours) | 423 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | - | 0.65mm | 600MHz | - | OMAP3525 | 423 | - | - | - | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.35V | 985mV | 112kB | - | - | 64kB | MICROPROCESSOR, RISC | - | ARM® Cortex®-A8 | - | - | - | - | - | 32b | - | - | ARM | - | - | - | - | - | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | - | - | - | - | LCD | - | - | 1.4mm | - | 16mm | 16mm | 960μm | No | - | ROHS3 Compliant | Lead Free | ||
 MCIMX6X1AVK08AB NXP USA Inc. | 115 |
| Datasheet | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | - | 14 | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.65mm | - | - | - | - | S-PBGA-B400 | - | 1.5V | - | - | 1.275V | - | - | - | - | - | - | 200MHz, 800MHz | - | MULTIFUNCTION PERIPHERAL | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | 15 | - | YES | - | 32 | - | - | 144K | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | - | - | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | - | 1.3mm | 14mm | - | - | - | - | ROHS3 Compliant | - | ||
 N80C188XL20 Intel | 1410 | - | Datasheet | - | - | - | Surface Mount | LCC | - | - | - | - | - | 70°C | - | - | - | Bulk | - | - | e0 | - | - | - | 68 | 3A991.A.2 | Tin/Lead (Sn/Pb) | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | J BEND | - | 5V | 1.27mm | 20MHz | - | - | 68 | S-PQCC-J68 | Not Qualified | - | 5V | COMMERCIAL | - | 5V | - | - | - | - | - | - | - | MICROPROCESSOR | - | - | - | - | 90mA | 16 | 20 μs | - | - | 20 | - | NO | YES | 8 | FIXED POINT | NO | 0 | - | - | - | - | - | - | - | - | - | 5 | - | - | - | - | 2 | - | - | 4.83mm | 24.2316mm | 24.2316mm | - | - | - | Non-RoHS Compliant | - | ||
 T1040NSE7PQB NXP USA Inc. | 2338 |
| Datasheet | 18 Weeks | - | - | - | 780-FBGA, FCBGA | - | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ T1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4GHz | - | - | - | PowerPC e5500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1Gbps (12) | 4 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC860PZQ50D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | - | 50MHz | - | 32 | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | Non-RoHS Compliant | - | ||
 MC7447AVU1267LB NXP USA Inc. | In Stock | - | Datasheet | 26 Weeks | - | - | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC74xx | e2 | - | Obsolete | 1 (Unlimited) | 360 | 3A991 | TIN COPPER/TIN SILVER | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | - | 40 | MC7447 | - | S-CBGA-B360 | - | 1.35V | - | - | 1.25V | - | - | - | - | - | - | 1.267GHz | - | MICROPROCESSOR, RISC | - | PowerPC G4 | - | 167MHz | - | 32 | - | - | - | 36 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V | - | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | - | - | 2.8mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
MPC860SRVR50D4R2 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TA | Tape & Reel (TR) | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | - | 50MHz | - | 32 | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
 MC8641DVJ1500KE NXP USA Inc. | 2166 |
| Datasheet | 12 Weeks | - | - | - | 1023-BCBGA, FCCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2001 | MPC86xx | - | - | Active | 3 (168 Hours) | - | 3A991.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | - | - | - | - | S-CBGA-B1023 | - | 1.15V | - | - | 1.05V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | - | PowerPC e600 | - | - | - | 32 | - | - | - | 16 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR, DDR2 | - | DUART, HSSI, I2C, RapidIO | - | - | - | - | - | - | - | - | - | 2.77mm | 33mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6QP6AVT8AA NXP USA Inc. | 2375 | - | Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | 7 | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6QP | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | 1.5V | - | - | 1.225V | - | - | - | - | - | - | 852MHz | - | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | 16 | - | YES | - | 64 | - | - | 512000 | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
T1042NSE7PQB NXP USA Inc. | 2453 | - | Datasheet | 18 Weeks | - | - | - | 780-FBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ T1 | - | - | Active | 3 (168 Hours) | 780 | 5A002.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | - | - | S-PBGA-B780 | - | 1.03V | - | - | 0.97V | - | - | - | - | - | - | 1.4GHz | - | MICROPROCESSOR, RISC | - | PowerPC e5500 | - | 133.3MHz | - | 32 | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | - | - | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | SATA 3Gbps (2) | - | 2.07mm | 23mm | - | - | - | - | ROHS3 Compliant | - | ||
 P1013NXN2HFB NXP USA Inc. | 2273 |
| Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | P1013 | - | S-PBGA-B689 | - | 1.05V | - | - | 0.95V | - | - | - | - | - | - | 1.055GHz | - | MICROPROCESSOR | - | PowerPC e500v2 | - | 133MHz | - | 32 | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | - | - | - | - | LCD | - | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM9G46B-CU Microchip Technology | 2000 |
| Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 324-TFBGA | - | 324 | - | FLASH, ROM | 160 | - | - | Yes | -40°C~85°C TA | Tray | 2004 | SAM9G | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | 400MHz | - | AT91SAM9G46 | - | - | - | - | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, IrDA, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | 64kB | Internal | - | 64kB | - | - | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | - | - | - | 32b | 6 | - | ARM | - | - | - | - | - | - | 1.8V 3.3V | - | 10/100Mbps | 1 Core 32-Bit | No | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | 4 | - | - | LCD, Touchscreen | - | - | - | - | - | - | - | - | No SVHC | ROHS3 Compliant | - | ||
 OMAP3530DCBB72 Texas Instruments | 92 | - | Datasheet | - | - | - | Surface Mount | 515-VFBGA, FCBGA | - | 515 | - | L2 Cache, ROM, SRAM | - | - | - | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | - | no | Obsolete | 3 (168 Hours) | 515 | - | - | - | - | BOTTOM | BALL | - | 1.8V | 0.4mm | 720MHz | - | OMAP3530 | 515 | - | - | - | - | - | - | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 208kB | - | - | 64kB | MICROPROCESSOR, RISC | 32 | ARM® Cortex®-A8 | - | - | - | 32 | - | 32b | 12 | 26 | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | - | - | - | - | LCD | - | - | - | 0.9mm | - | - | - | No | Unknown | ROHS3 Compliant | Contains Lead |