What is the Packing Method

The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

What is the Construction

Construction in electronic components refers to the design and materials used in the manufacturing of the components. It encompasses the physical structure, arrangement, and integration of various parts like substrates, conductors, and insulators. The construction impacts the performance, reliability, and thermal properties of the component, influencing how it interacts with electrical signals and other components in a circuit. Different construction techniques can also affect the size, weight, and cost of the electronic component.

What is the Reach Compliance Code

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

What is the Thermal Support Device Type

The parameter "Thermal Support Device Type" in electronic components refers to the type of device or mechanism used to support and manage the thermal characteristics of the component. This parameter is crucial in ensuring that the electronic component operates within its specified temperature range to prevent overheating and potential damage. The thermal support device type can include features such as heat sinks, thermal pads, fans, or other cooling solutions designed to dissipate heat effectively. Selecting the appropriate thermal support device type is essential for maintaining the reliability and longevity of the electronic component in various applications.

Home /Fans, Thermal Management /Thermal - Heat Sinks /573400D00010 /

Aavid Thermalloy 573400D00010

Name: 573400D00010
Brand: Aavid Thermalloy
SKU: 8-573400D00010
Availability: InStock
Rating: 4.7 (46 reviews)

Manufacturer No:

573400D00010

Manufacturer:

Aavid Thermalloy

Utmel No:

8-573400D00010

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ECAD Model:

Description:

Heat Sink

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573400D00010 information

Specifications

Aavid Thermalloy 573400D00010 technical specifications, attributes, parameters and parts with similar specifications to Aavid Thermalloy 573400D00010.

Type
Parameter
Weight
3.7 g
Manufacturer Part Number
573400D00010
Manufacturer
Aavid Thermalloy
Part Life Cycle Code
Transferred
Ihs Manufacturer
AAVID THERMALLOY LLC
Risk Rank
7.17
Packing Method
The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.
TAPE AND REEL
Construction
Construction in electronic components refers to the design and materials used in the manufacturing of the components. It encompasses the physical structure, arrangement, and integration of various parts like substrates, conductors, and insulators. The construction impacts the performance, reliability, and thermal properties of the component, influencing how it interacts with electrical signals and other components in a circuit. Different construction techniques can also affect the size, weight, and cost of the electronic component.
FIN
Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
compliant
Thermal Support Device Type
The parameter "Thermal Support Device Type" in electronic components refers to the type of device or mechanism used to support and manage the thermal characteristics of the component. This parameter is crucial in ensuring that the electronic component operates within its specified temperature range to prevent overheating and potential damage. The thermal support device type can include features such as heat sinks, thermal pads, fans, or other cooling solutions designed to dissipate heat effectively. Selecting the appropriate thermal support device type is essential for maintaining the reliability and longevity of the electronic component in various applications.
HEAT SINK
Width
12.7 mm
Height
10.2 mm
Length
31 mm

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