Aavid Thermalloy 675901F00000

The parameter "Body Material" in electronic components refers to the material used to construct the physical body or casing of the component. This material plays a crucial role in determining the component's durability, thermal conductivity, electrical insulation properties, and resistance to environmental factors such as moisture, heat, and mechanical stress. Common body materials for electronic components include plastics, ceramics, metals, and composites. Selecting the appropriate body material is essential to ensure the reliable performance and longevity of the electronic component in various operating conditions.

Construction in electronic components refers to the design and materials used in the manufacturing of the components. It encompasses the physical structure, arrangement, and integration of various parts like substrates, conductors, and insulators. The construction impacts the performance, reliability, and thermal properties of the component, influencing how it interacts with electrical signals and other components in a circuit. Different construction techniques can also affect the size, weight, and cost of the electronic component.

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

The parameter "Thermal Support Device Type" in electronic components refers to the type of device or mechanism used to support and manage the thermal characteristics of the component. This parameter is crucial in ensuring that the electronic component operates within its specified temperature range to prevent overheating and potential damage. The thermal support device type can include features such as heat sinks, thermal pads, fans, or other cooling solutions designed to dissipate heat effectively. Selecting the appropriate thermal support device type is essential for maintaining the reliability and longevity of the electronic component in various applications.

Fin orientation in electronic components refers to the positioning of the fins or heat sinks attached to the component for thermal management purposes. These fins are designed to dissipate heat generated during operation to prevent overheating and ensure optimal performance. The orientation of the fins can impact the efficiency of heat dissipation, as well as the overall thermal performance of the component. Proper fin orientation is crucial for maintaining the component's temperature within safe operating limits and maximizing its lifespan. Manufacturers often provide guidelines on the recommended fin orientation for their components to ensure effective heat dissipation.