Advanced Thermal Solutions Inc. ATS-HP-F7L100S70W-016

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The attachment method in electronic components refers to the technique used to connect a component to a circuit board or assembly. This can include methods such as soldering, bonding, or using connectors. The choice of attachment method can affect the reliability, performance, and manufacturability of the electronic device. Different methods may be suited for specific applications based on factors like mechanical stress, thermal conductivity, and ease of assembly.

The parameter "Height Off Base (Height of Fin)" in electronic components refers to the distance between the base of the component and the top of any fins or protrusions on the component. This measurement is important for determining the overall dimensions and clearance requirements of the component within a circuit or system. It helps in ensuring proper fit and alignment of the component during installation and assembly. Manufacturers provide this specification to assist designers and engineers in selecting the appropriate components for their applications based on the available space and mechanical constraints.

Wick Type in electronic components refers to a type of material or structure used for absorbing and transferring heat away from a component or area. This is commonly seen in heat sinks or thermal management systems where efficient heat dissipation is crucial for maintaining the optimal operating temperature of electronic devices. The wick type material is designed to have high thermal conductivity and a large surface area to effectively draw heat away from the source and dissipate it into the surrounding environment. By using a wick type material, heat can be efficiently managed to prevent overheating and ensure the reliable performance of electronic components.

The parameter "Working Fluid" in electronic components refers to the fluid that transfers heat within a thermal management system. It is crucial in applications like cooling systems, where it absorbs heat from electronic components and dissipates it, maintaining optimal operating temperatures. The choice of working fluid can affect the efficiency, reliability, and performance of electronic devices, influencing factors such as thermal conductivity, heat capacity, and phase change characteristics. Common working fluids include water, oils, and refrigerants, each selected based on specific thermal requirements and environmental considerations.

Power - Cooling refers to the thermal management aspect of electronic components, emphasizing the need to dissipate heat generated during operation. It involves assessing the amount of heat produced relative to the power consumption to ensure optimal performance and longevity of the components. Effective cooling solutions, such as heatsinks, fans, or liquid cooling systems, are critical for maintaining safe operating temperatures and preventing thermal-related failures in electronic devices.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.