Alliance Memory, Inc. AS4C64M16D2-25BINTR
Alliance Memory, Inc. AS4C64M16D2-25BINTR
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Alliance Memory, Inc. AS4C64M16D2-25BINTR

Memory IC Memory IC

Manufacturer No:

AS4C64M16D2-25BINTR

Utmel No:

101-AS4C64M16D2-25BINTR

Package:

84-TFBGA

Datasheet:

AS4C64M16D2

ECAD Model:

Description:

Memory IC 1 Gb kb

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  • Vacuum packagingStep2:Vacuum packaging
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AS4C64M16D2-25BINTR information

Specifications
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Product Details
Alliance Memory, Inc. AS4C64M16D2-25BINTR technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS4C64M16D2-25BINTR.
  • Type
    Parameter
  • Factory Lead Time
    8 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    84-TFBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    84
  • Memory Types
    Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~95°C TC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2013
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    84
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.7V~1.9V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.8V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8mm
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.8V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1Gb 64M x 16
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    400MHz
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    400ps
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    DRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    16b
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    64MX16
  • Output Characteristics

    Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

    3-STATE
  • Memory Width

    Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.

    16
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    15ns
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    13b
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    1 Gb
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.01A
  • I/O Type

    "I/O Type" in electronic components refers to the type of input/output interface that the component uses to communicate with other devices or systems. This parameter specifies whether the component uses analog or digital signals for input and output operations. Analog signals are continuous and can have an infinite number of values, while digital signals are discrete and have only two possible values (0 or 1).Understanding the I/O Type of an electronic component is crucial for ensuring compatibility and proper communication with other components in a circuit or system. It helps determine the type of signals that the component can send and receive, as well as the protocols and standards that need to be followed for successful data exchange.In summary, the I/O Type parameter of electronic components defines the nature of the signals used for input and output operations, whether they are analog or digital, and plays a key role in establishing seamless communication within electronic systems.

    COMMON
  • Refresh Cycles

    Refresh cycles refer to the process of refreshing data stored in electronic components, such as dynamic random-access memory (DRAM). DRAM cells store data in the form of electrical charges, which can leak over time due to the nature of the technology. To prevent data loss or corruption, DRAM requires periodic refreshing of the stored information. The refresh cycle involves reading and then immediately rewriting the data back to the same location, ensuring that the charge is restored to its original state. The frequency of refresh cycles is typically specified by the manufacturer and is an important parameter to consider when designing systems that rely on DRAM for data storage.

    8192
  • Sequential Burst Length

    Sequential Burst Length is a parameter in electronic components, particularly in memory devices, that refers to the number of data words that can be accessed in a continuous sequence within a single burst operation. It specifies the maximum number of consecutive data words that can be read or written in a burst mode without having to issue additional commands. The Sequential Burst Length is important for optimizing data transfer efficiency and performance in memory systems, as it determines the amount of data that can be transferred in a single burst cycle. It is typically specified in terms of the number of data words or bytes that can be accessed sequentially during a burst operation.

    48
  • Interleaved Burst Length

    Interleaved Burst Length is a parameter in electronic components, particularly in memory modules, that refers to the number of data words that can be transferred in a single burst operation. It determines how many data words can be accessed consecutively before the memory controller needs to issue another command. The Interleaved Burst Length is typically specified in terms of the number of data words or bytes that can be transferred in a burst. A larger Interleaved Burst Length allows for more efficient data transfer and can improve overall system performance by reducing the number of command overheads required for accessing data.

    48
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for Alliance Memory, Inc. AS4C64M16D2-25BINTR.

AS4C64M16D2-25BINTR Overview

It comes in a Tape & Reel (TR). It is available in 84-TFBGA case. The memory size of the chip is 1Gb 64M x 16 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -40°C~95°C TC, this device is capable of lots of demanding applications. It is supplied votage within 1.7V~1.9V. Its recommended mounting type is Surface Mount. 84 terminations are planted on the chip. This ic memory chip is designed to be supplied with 1.8V. The memory has a clock frequency rotation within 400MHz. This memory device is enclosed in a 84-pin package. The operating supply voltage of this memory chip is noted to be 1.8V. This device has COMMON-bit memory mapped I/O port addresses.

AS4C64M16D2-25BINTR Features

Package / Case: 84-TFBGA
84 Pins
Operating Supply Voltage:1.8V
I/O Type: COMMON

AS4C64M16D2-25BINTR Applications

There are a lot of Alliance Memory, Inc.
AS4C64M16D2-25BINTR Memory applications.


  • Cache memory
  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications