Alliance Memory, Inc. AS7C31025B-10TJCN
Alliance Memory, Inc. AS7C31025B-10TJCN
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Alliance Memory, Inc. AS7C31025B-10TJCN

Memory IC Memory IC

Manufacturer No:

AS7C31025B-10TJCN

Utmel No:

101-AS7C31025B-10TJCN

Package:

32-BSOJ (0.300, 7.62mm Width)

Datasheet:

AS7C31025B

ECAD Model:

Description:

Memory IC 1 Mb kb

Quantity:

Unit Price: $3.721589

Ext Price: $3.72

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 33

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $3.721589

    $3.72

  • 10

    $3.510933

    $35.11

  • 100

    $3.312201

    $331.22

  • 500

    $3.124718

    $1,562.36

  • 1000

    $2.947847

    $2,947.85

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  • Vacuum packagingStep2:Vacuum packaging
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AS7C31025B-10TJCN information

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Product Details
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Alliance Memory, Inc. AS7C31025B-10TJCN technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS7C31025B-10TJCN.
  • Type
    Parameter
  • Factory Lead Time
    8 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    32-BSOJ (0.300, 7.62mm Width)
  • Number of Pins
    32
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    32-SOJ
  • Memory Types
    Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    2003
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    70°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0°C
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    3V~3.6V
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    Parallel
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    3.6V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    3V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1Mb 128K x 8
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    10ns
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    SRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    10ns
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    17b
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    1 Mb
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Alliance Memory, Inc. AS7C31025B-10TJCN.

AS7C31025B-10TJCN Overview

Case Tube is available. An embedded 32-BSOJ (0.300, 7.62mm Width) case surrounds memory ics. It is estimated that the memory size on the chip is 1Mb 128K x 8. As with most mainstream devices, this one uses SRAM-format memory. Due to its wide temperature range of 0°C~70°C TA, this device is well suited to a wide range of applications that require high performance. With 3V~3.6V as the supply voltage, it is capable of handling memory ics. It is recommended to mount it in the Surface Mount mounting type. The ic memory chip comes in a package with 32 pins that allows it to be connected to a computer. It is noted that the operating supply voltage of this memory is 3.3V. Several ports on this chip are used to access one memory address for reading and writing. In order for this device to function properly, its operating temperature must not be less than 0°C. The temperature should not exceed 70°C degrees Celsius. This memory ics should not be operated with a voltage below 3V volts at the minimum. There shall be a voltage limit of 3.6V for its operation.

AS7C31025B-10TJCN Features

Package / Case: 32-BSOJ (0.300, 7.62mm Width)
32 Pins
Operating Supply Voltage:3.3V

AS7C31025B-10TJCN Applications

There are a lot of Alliance Memory, Inc.
AS7C31025B-10TJCN Memory applications.


  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
The three parts on the right have similar specifications to Alliance Memory, Inc. & AS7C31025B-10TJCN.
AS7C31025B-10TJCN Relevant information

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