Amphenol PT06SP-18-30P(355)

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The shrinkage ratio in electronic components refers to the ratio of the original size of a component to its reduced size after a specific process, such as heat treatment or molding. This parameter is commonly used in the manufacturing of components like heat shrink tubing or molded plastic parts. The shrinkage ratio is important to consider to ensure that the final dimensions of the component meet the required specifications after the shrinking process. It is typically expressed as a percentage or a decimal value, indicating how much the component will shrink in size relative to its original dimensions.

Common polyolefin materials have a recommended shrink temperature of around 9°C, although other materials offer shrink temperatures, notably Teflon, as high as 25°C.

In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

Recovered Wall Thickness refers to the thickness of the insulation material that remains on an electronic component after the recovery process, typically involving heat application. It is a critical measurement that ensures the electrical integrity and performance of the component by providing adequate insulation and protection against environmental factors. This parameter also influences the overall durability and reliability of the component in various applications.