Amphenol Aerospace Operations LMD-4003-S

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Module Capacity in electronic components refers to the maximum amount of data or information that can be stored or processed within a specific module. It is a crucial parameter that determines the capability and performance of the electronic component. The module capacity is typically measured in terms of storage capacity (such as memory size in bytes or bits) or processing capacity (such as clock speed or operations per second). A higher module capacity indicates that the electronic component can handle larger amounts of data or perform more complex tasks efficiently. It is important to consider the module capacity when selecting electronic components for specific applications to ensure optimal performance and functionality.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.