Amphenol Industrial Operations MS3101E24-28S

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

The "Shell Material" parameter in electronic components refers to the material used to encase or cover the internal components of the device. This material is chosen based on various factors such as durability, heat resistance, electrical insulation properties, and environmental considerations. Common shell materials include plastics, metals, and ceramics, each offering different levels of protection and performance characteristics. The choice of shell material can impact the overall reliability, safety, and functionality of the electronic component in different operating conditions.

The parameter "Insert Material" in electronic components refers to the specific material used to create the insert portions of connectors or other components that facilitate assembly or enhance performance. This material is chosen for its electrical, thermal, and mechanical properties, which can influence the overall functionality and reliability of the component in its intended application. Common insert materials include plastics, ceramics, and metals, each selected based on the requirements of the environment in which the component will operate.

The parameter "Body Material" in electronic components refers to the material used to construct the physical body or casing of the component. This material plays a crucial role in determining the component's durability, thermal conductivity, electrical insulation properties, and resistance to environmental factors such as moisture, heat, and mechanical stress. Common body materials for electronic components include plastics, ceramics, metals, and composites. Selecting the appropriate body material is essential to ensure the reliable performance and longevity of the electronic component in various operating conditions.

Backshell Material, Plating refers to the material and plating used in the backshell of electronic components. The backshell is a protective covering or housing that is typically located at the rear end of a connector or cable assembly. The material and plating used in the backshell are chosen based on factors such as durability, conductivity, corrosion resistance, and compatibility with the surrounding environment. Common materials used for backshells include aluminum, stainless steel, and plastic, while plating options may include nickel, zinc, or gold to provide additional protection and improve electrical performance. The choice of backshell material and plating is crucial in ensuring the reliability and longevity of electronic components in various applications.

RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

MIL Conformance refers to the compliance of electronic components with military standards set by the Department of Defense. These standards define rigorous requirements for reliability, performance, and durability under extreme conditions. Components that meet MIL Conformance are often used in defense, aerospace, and other critical applications where failure is not an option. Adherence to these standards ensures that the components can withstand harsh environments, such as extreme temperatures, vibrations, and humidity.

DIN Conformance refers to the compliance of an electronic component with the standards set by the Deutsches Institut für Normung (DIN), which is the German Institute for Standardization. DIN standards cover a wide range of technical specifications and requirements for various products, including electronic components. When a component is labeled as DIN-conformant, it means that it meets the specific criteria outlined by DIN for factors such as dimensions, materials, performance, and safety. Ensuring DIN conformance helps to guarantee interoperability, quality, and reliability of electronic components in various applications and industries. Manufacturers often adhere to DIN standards to demonstrate the quality and reliability of their products to customers and to ensure compatibility with other DIN-compliant devices.

IEC Conformance refers to the compliance of electronic components with standards set by the International Electrotechnical Commission (IEC). These standards ensure that the components meet specific safety, performance, and interoperability criteria. Adhering to IEC conformance helps manufacturers produce reliable and compatible products, facilitating international trade and promoting consumer safety. Components that conform to IEC standards are often preferred in global markets due to their quality assurance and regulatory acceptance.

In electronic components, the "Filter Feature" parameter refers to the capability of a component to filter or block certain frequencies of signals while allowing others to pass through. Filters are used to remove unwanted noise or interference from a signal, ensuring that only the desired frequencies are transmitted or received. The filter feature can be implemented using various techniques such as capacitors, inductors, resistors, or active components like operational amplifiers. Different types of filters, such as low-pass, high-pass, band-pass, and band-stop filters, are designed to cater to specific frequency ranges and applications. Overall, the filter feature plays a crucial role in maintaining signal integrity and improving the performance of electronic circuits.

In electronic components, "Mixed Contacts" refers to a type of contact arrangement where different types of contacts are used within the same component. This can include a combination of different contact materials, such as gold-plated contacts for signal transmission and silver-plated contacts for power connections. Mixed contacts can also refer to a combination of different contact styles, such as pin contacts and socket contacts within the same component.The use of mixed contacts allows for optimized performance and reliability in electronic components by leveraging the specific advantages of each contact type. For example, gold-plated contacts offer excellent conductivity and corrosion resistance, while silver-plated contacts provide high current-carrying capacity. By incorporating mixed contacts, manufacturers can tailor the component to meet the specific requirements of the application, ensuring efficient and reliable operation.

In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

Shielding in electronic components refers to the practice of enclosing or surrounding sensitive electronic circuits or components with a conductive material to protect them from electromagnetic interference (EMI) or radio frequency interference (RFI). The shielding material acts as a barrier that blocks or absorbs unwanted electromagnetic signals, preventing them from affecting the performance of the electronic device. Shielding can be achieved using materials such as metal enclosures, conductive coatings, or shielding tapes. Proper shielding is essential in electronic design to ensure the reliable operation of electronic devices in environments where electromagnetic interference is present.

Ingress Protection rating (or just IP rating), is an international standard (IEC 60529) used to rate the degree of protection or sealing effectiveness in electrical enclosures against intrusion of objects, water, dust or accidental contact. It corresponds to the European standard EN 60529.

In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

Military Standard in electronic components refers to a set of guidelines and specifications established by the military for the design, manufacturing, and testing of electronic devices used in military applications. These standards ensure that the components meet specific requirements for reliability, durability, performance, and environmental conditions. Components that meet military standards are often more rugged and capable of withstanding harsh operating conditions such as extreme temperatures, vibrations, and electromagnetic interference. Adhering to military standards helps to ensure the quality and consistency of electronic components used in critical military systems and applications.

Shell Finish in electronic components refers to the surface treatment or coating applied to the outer shell or casing of the component. This finish is designed to provide protection against environmental factors such as moisture, dust, and corrosion, as well as to enhance the component's appearance. Common types of shell finishes include nickel plating, anodizing, powder coating, and epoxy resin coating. The choice of shell finish depends on the specific requirements of the component, such as the operating environment, durability needs, and aesthetic considerations.

The parameter "Shell Size - Insert" in electronic components refers to the physical size of the connector shell or housing that holds the insert or contact arrangement within the component. The shell size is typically specified by a numerical designation that corresponds to a specific size and configuration of the connector. This parameter is important for ensuring compatibility and proper fit between different components or devices that use the same type of connector. Manufacturers provide detailed specifications for shell size to help users select the appropriate connector for their specific application requirements.

Mating Information in electronic components refers to the specifications and details related to how a particular component connects or interfaces with other components or systems. This information typically includes details such as the type of connectors, pin configurations, voltage and current ratings, signal compatibility, and physical dimensions required for proper mating and connection. Understanding the mating information is crucial for ensuring compatibility and proper functioning of electronic components within a system or circuit. Manufacturers provide detailed mating information in datasheets to help engineers and designers select and integrate components effectively.

Contact Gender in electronic components refers to the physical characteristics of the electrical contacts within a connector or terminal block. It indicates whether the contact is male or female, which determines how the connectors can be mated together. Male contacts typically have protruding pins or plugs, while female contacts have receptacles or sockets to receive the male contacts. Matching the correct contact genders is crucial for ensuring proper electrical connections and preventing damage to the components. Manufacturers often specify the contact gender of their components to facilitate compatibility and ease of use in electronic systems.

In electronic components, the term "Backshell Type" refers to a protective covering or enclosure that is typically used at the rear end of a connector or cable assembly. The backshell is designed to provide strain relief, environmental protection, and shielding for the connection interface. It helps to secure the connection and prevent damage from mechanical stress, moisture, dust, and electromagnetic interference.Backshells come in various types and designs, such as straight, 45-degree, 90-degree, or custom angles, depending on the specific application requirements. They can be made of metal, plastic, or other materials, and may feature additional components like cable clamps, grommets, or sealing mechanisms to enhance the overall performance and reliability of the connection.Choosing the right backshell type is crucial in ensuring the longevity and functionality of electronic systems, especially in harsh environments or high-vibration settings. Proper selection and installation of backshells can help maintain signal integrity, prevent signal loss, and extend the lifespan of the connected components.

The parameter "Contact Style" in electronic components refers to the specific design and arrangement of the contact points that enable electrical connection in various devices. It dictates how components interface with each other, affecting factors such as reliability, durability, and performance. Different contact styles can include configurations like pin, socket, blade, or surface mount, each designed to cater to specific applications and requirements in circuit assembly.

The parameter "Body/Shell Style" in electronic components refers to the physical design or shape of the outer casing or enclosure of the component. It is an important characteristic that helps in identifying and categorizing different types of components based on their form factor. The body/shell style can vary greatly depending on the specific component and its intended use, ranging from simple rectangular shapes to more complex designs with specific features for mounting, connecting, or protecting the internal components. Understanding the body/shell style of electronic components is crucial for proper installation, compatibility, and overall functionality within electronic circuits and systems.

In the context of electronic components, "Plating" refers to a process of depositing a thin layer of metal onto a substrate material. This plating is often used to enhance the component's performance, durability, and conductivity. The plating material can vary depending on the specific requirements of the component, with common choices including gold, silver, tin, and nickel. Plating can also be used for corrosion resistance, solderability, and to improve the overall appearance of the component. Overall, plating plays a crucial role in ensuring the reliability and functionality of electronic components in various applications.

Wire Gauge (Max) refers to the maximum size of wire that can be accommodated by a particular electronic component, such as a connector or terminal. It indicates the largest diameter of wire that can be securely connected to the component without causing damage or compromising the electrical connection. This parameter is important to consider when selecting components for a project to ensure compatibility with the wire sizes being used. Exceeding the maximum wire gauge could lead to poor connections, overheating, or other issues that may affect the performance and safety of the electronic system.

Wire Gauge (Min) refers to the minimum thickness or diameter of the wire that can be used with a particular electronic component or device. It is an important parameter to consider when designing or selecting components for a circuit, as using a wire that is too thin may not be able to handle the required current, leading to overheating or even failure. The Wire Gauge (Min) specification ensures that the wire used is capable of carrying the necessary current without causing any issues. It is typically specified in American Wire Gauge (AWG) or metric units, depending on the manufacturer or region.

Body Plating in electronic components refers to a process where a thin layer of metal is applied to the body of the component for various purposes such as improving electrical conductivity, corrosion resistance, and mechanical strength. This plating is typically done using techniques like electroplating or chemical deposition. The choice of plating material can vary depending on the specific requirements of the component and the application it is intended for. Overall, body plating plays a crucial role in enhancing the performance and durability of electronic components in various electronic devices and systems.

Cable Opening in electronic components refers to the physical opening or port through which a cable can be connected to the component. This opening is designed to accommodate the specific type and size of cable that is intended to be used with the component. The cable opening is an important feature as it allows for the secure and proper connection of the cable to the component, ensuring reliable data or power transmission. It is essential to match the cable opening size and type with the corresponding cable to prevent any compatibility issues and to maintain the integrity of the connection.

In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

The parameter "Ratings" in electronic components refers to the specified limits that define the maximum operational capabilities of a component. These ratings include voltage, current, power, temperature, and frequency, determining the conditions under which the component can function safely and effectively. Exceeding these ratings can lead to failure, damage, or unsafe operation, making it crucial for designers to adhere to them during component selection and usage.