Amphenol RF 132134-10

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

a substance that is a poor conductor of electricity, but an efficient supporter of electrostatic field s.

The parameter "Body Material" in electronic components refers to the material used to construct the physical body or casing of the component. This material plays a crucial role in determining the component's durability, thermal conductivity, electrical insulation properties, and resistance to environmental factors such as moisture, heat, and mechanical stress. Common body materials for electronic components include plastics, ceramics, metals, and composites. Selecting the appropriate body material is essential to ensure the reliable performance and longevity of the electronic component in various operating conditions.

Center Contact Plating refers to the metal coating applied to the central contact of an electronic component, such as connectors or sockets. This plating is crucial for ensuring good electrical conductivity and minimizing resistance at the point of contact. It also provides protection against corrosion and wear, which can affect the component's performance over time. The choice of plating material, such as gold or nickel, can impact the durability and reliability of the connection.

The parameter "Center Contact Material" in electronic components refers to the material used for the central conductive part of connectors, such as RF connectors. This material is crucial for ensuring effective electrical conductivity and minimizing signal loss. Common materials include gold, silver, copper, and nickel, each offering different levels of conductivity, corrosion resistance, and mechanical properties. The choice of center contact material can significantly impact the performance and reliability of the connector in various applications.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

MIL Conformance refers to the compliance of electronic components with military standards set by the Department of Defense. These standards define rigorous requirements for reliability, performance, and durability under extreme conditions. Components that meet MIL Conformance are often used in defense, aerospace, and other critical applications where failure is not an option. Adherence to these standards ensures that the components can withstand harsh environments, such as extreme temperatures, vibrations, and humidity.

DIN Conformance refers to the compliance of an electronic component with the standards set by the Deutsches Institut für Normung (DIN), which is the German Institute for Standardization. DIN standards cover a wide range of technical specifications and requirements for various products, including electronic components. When a component is labeled as DIN-conformant, it means that it meets the specific criteria outlined by DIN for factors such as dimensions, materials, performance, and safety. Ensuring DIN conformance helps to guarantee interoperability, quality, and reliability of electronic components in various applications and industries. Manufacturers often adhere to DIN standards to demonstrate the quality and reliability of their products to customers and to ensure compatibility with other DIN-compliant devices.

IEC Conformance refers to the compliance of electronic components with standards set by the International Electrotechnical Commission (IEC). These standards ensure that the components meet specific safety, performance, and interoperability criteria. Adhering to IEC conformance helps manufacturers produce reliable and compatible products, facilitating international trade and promoting consumer safety. Components that conform to IEC standards are often preferred in global markets due to their quality assurance and regulatory acceptance.

In electronic components, the "Filter Feature" parameter refers to the capability of a component to filter or block certain frequencies of signals while allowing others to pass through. Filters are used to remove unwanted noise or interference from a signal, ensuring that only the desired frequencies are transmitted or received. The filter feature can be implemented using various techniques such as capacitors, inductors, resistors, or active components like operational amplifiers. Different types of filters, such as low-pass, high-pass, band-pass, and band-stop filters, are designed to cater to specific frequency ranges and applications. Overall, the filter feature plays a crucial role in maintaining signal integrity and improving the performance of electronic circuits.

In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

Connector Style in electronic components refers to the physical design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the shape, size, and layout of the connector, as well as the method of attachment and the number of pins or contacts it has. Different connector styles are used for various applications, such as board-to-board connections, cable-to-board connections, or wire-to-board connections. The connector style plays a crucial role in determining the compatibility and functionality of electronic devices, as it ensures proper signal transmission and power delivery between interconnected components.

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

to the number of a times a physical connector can “mate” or connect to it's counterpart.

Contact termination in electronic components refers to the method used to connect the component to a circuit or system. It is the point where the component's electrical connection is terminated or connected to the external circuit. Common contact termination methods include soldering, wire bonding, press-fit connectors, and surface mount technology (SMT). The choice of contact termination method depends on factors such as the type of component, the application requirements, and the manufacturing process. Proper contact termination is crucial for ensuring reliable electrical connections and overall performance of the electronic component.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.