Analog Devices LTC4307IDD#TRPBF
Analog Devices LTC4307IDD#TRPBF
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Analog Devices LTC4307IDD#TRPBF

Signal Buffers, Repeaters, Splitters Reel Signal Buffers, Repeaters, Splitters

Manufacturer No:

LTC4307IDD#TRPBF

Manufacturer:

Analog Devices

Utmel No:

153-LTC4307IDD#TRPBF

Package:

DFN-8

ECAD Model:

Description:

Surface Mount Reel Signal Buffers, Repeaters, Splitters 2.3V ~ 5.5V V 10 pF pF

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LTC4307IDD#TRPBF information

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Product Details
Analog Devices LTC4307IDD#TRPBF technical specifications, attributes, parameters and parts with similar specifications to Analog Devices LTC4307IDD#TRPBF.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    DFN-8
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    8-DFN (3x3)
  • Number of Terminals
    8
  • Factory Pack QuantityFactory Pack Quantity
    2500
  • Mounting Styles
    SMD/SMT
  • Interface Type
    I2C
  • Manufacturer
    Analog Devices Inc.
  • Brand
    Analog Devices
  • RoHS
    Details
  • Package
    Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    LTC4307
  • Mfr
    Analog Devices Inc.
  • Product Status
    Active
  • Package Description
    HVSON,
  • Package Style
    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
  • Moisture Sensitivity Levels
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Manufacturer Package Code
    05-08-1698
  • Operating Temperature-Min
    -40 °C
  • Supply Voltage-Nom
    3.3 V
  • Reflow Temperature-Max (s)
    30
  • Supply Voltage-Min
    2.3 V
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    LTC4307IDD#TRPBF
  • Package Code
    HVSON
  • Package Shape
    SQUARE
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    ANALOG DEVICES INC
  • Supply Voltage-Max
    5.5 V
  • Risk Rank
    5.3
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    LTC4307
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    No
  • Type
    Buffer, Accelerator
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Applications

    The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

    I²C - Hotswap
  • Subcategory
    Interface ICs
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.3V ~ 5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • Output

    In electronic components, the parameter "Output" typically refers to the signal or data that is produced by the component and sent to another part of the circuit or system. The output can be in the form of voltage, current, frequency, or any other measurable quantity depending on the specific component. The output of a component is often crucial in determining its functionality and how it interacts with other components in the circuit. Understanding the output characteristics of electronic components is essential for designing and troubleshooting electronic circuits effectively.

    2-Wire Bus
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PDSO-N8
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Brand Name
    Analog Devices Inc
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Number of Channels
    2
  • Current - Supply

    Current - Supply is a parameter in electronic components that refers to the maximum amount of electrical current that the component can provide to the circuit it is connected to. It is typically measured in units of amperes (A) and is crucial for determining the power handling capability of the component. Understanding the current supply rating is important for ensuring that the component can safely deliver the required current without overheating or failing. It is essential to consider this parameter when designing circuits to prevent damage to the component and ensure proper functionality of the overall system.

    8mA
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    0.8 mm
  • Input

    In electronic components, "Input" refers to the signal or data that is provided to a device or system for processing or manipulation. It is the information or command that is received by the component to initiate a specific function or operation. The input can come from various sources such as sensors, other electronic devices, or user interactions. It is crucial for the proper functioning of the component as it determines how the device will respond or behave based on the input received. Understanding and managing the input parameters is essential in designing and using electronic components effectively.

    2-Wire Bus
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Signal Buffers, Repeaters
  • Interface IC Type

    The parameter "Interface IC Type" in electronic components refers to the type of integrated circuit (IC) that is used to facilitate communication between different electronic devices or subsystems. This IC is responsible for managing the exchange of data and control signals between the devices, ensuring proper communication and coordination. The specific type of interface IC used can vary depending on the requirements of the system, such as serial communication (e.g., UART, SPI, I2C), parallel communication, or specialized interfaces like USB or Ethernet. Choosing the appropriate interface IC type is crucial for ensuring compatibility, reliability, and efficiency in electronic systems.

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER
  • Data Rate (Max)

    Data Rate (Max) refers to the maximum rate at which data can be transferred or processed within an electronic component or device. It is typically measured in bits per second (bps) or megabits per second (Mbps). This parameter is important for determining the speed and efficiency of data transmission or processing in various electronic applications such as computer systems, networking devices, and memory modules. A higher data rate indicates that the component is capable of handling larger volumes of data at a faster pace, leading to improved performance and responsiveness in electronic systems. It is crucial to consider the Data Rate (Max) specification when selecting electronic components to ensure compatibility and optimal functionality for specific applications.

    400kHz
  • Delay Time

    The amount of time by which the arrival of a signal is retarded after transmission through physical equipment or systems.

    -
  • Output Current Flow Direction

    Output Current Flow Direction refers to the orientation of current flowing out of a component or circuit. It indicates whether the current is being sourced from the component or sent to another component in the circuit. This parameter is crucial for understanding how electronic components interact within a circuit and ensures correct connectivity and functionality in circuit design. The direction can affect the operation and performance of the overall system.

    SOURCE
  • Capacitance - Input

    Capacitance - Input is a parameter that describes the input capacitance of an electronic component, such as a transistor or an integrated circuit. It represents the amount of charge that the input of the component can store when a voltage is applied to it. This capacitance affects the speed and performance of the component, as it can influence the time it takes for the input signal to be processed. A higher input capacitance can result in slower response times and may require additional circuitry to mitigate its effects. It is an important parameter to consider when designing and analyzing electronic circuits to ensure proper functionality and performance.

    10 pF
  • Product

    In the context of electronic components, the parameter "Product" typically refers to the specific item or device being discussed or analyzed. It can refer to a physical electronic component such as a resistor, capacitor, transistor, or integrated circuit. The product parameter may also encompass more complex electronic devices like sensors, displays, microcontrollers, or communication modules.Understanding the product parameter is crucial in electronics as it helps identify the characteristics, specifications, and functionality of the component or device in question. This information is essential for selecting the right components for a circuit design, troubleshooting issues, or comparing different products for a particular application. Manufacturers often provide detailed product datasheets that outline key specifications, performance characteristics, and application guidelines to assist engineers and designers in utilizing the component effectively.

    Buffers
  • Signal Conditioning

    In electronics, signal conditioning is the manipulation of an analog signal in such a way that it meets the requirements of the next stage for further processing.

    -
  • Product Category

    a particular group of related products.

    Interface - Signal Buffers, Repeaters
  • Width
    3 mm
  • Length
    3 mm
0 Similar Products Remaining
Download datasheets and manufacturer documentation for Analog Devices LTC4307IDD#TRPBF.

LTC4307IDD#TRPBF Overview

A convenient transportation package of power buffer is provided in DFN-8.Currently available in Reel packages for power buffer.A universal mout that is easy to adapt.The type Buffer, Accelerator is typical.In order to function, this op amp buffer requires 2.3V ~ 5.5V voltage.The output quality is maintained by collaborating between 2 channels.As a result, it facilitates input of 2-Wire Bus.For optimal performance, set the operating temperature to -40°C ~ 85°C.It targets applications such as I²C - Hotswap and others.During reflow, 260 is the peak temperature.From the power buffer's 8 pins, we can determine its pinout.2-Wire Bus is the output format.In other words, it is a 8mA op amp buffer.There are other Interface ICs's in the industry that play a significant role, like the power buffer.LTC4307 is the splitter.

LTC4307IDD#TRPBF Features

2 channels.
Mainly used in I²C - Hotswap.
A standard Interface ICs.

LTC4307IDD#TRPBF Applications

There are a lot of Analog Devices
LTC4307IDD#TRPBF Signal Buffers, Repeaters, Splitters applications.


  • Add/Drop Muxes
  • Digital Crossconnects
  • Network Switches/Routers
  • Backplane Interconnect
  • Clock Distribution
  • Protection Switching
  • Loopback
  • Clock Distribution
  • Servers
  • Industrial PCs