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pid_33792524_ltc4440ampms8e-523pbf-analog-devices-datasheet-20912934.pdf  Pinout Diagram_1
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Analog Devices LTC4440AMPMS8E-5#PBF

Gate Drivers ICs Free Hanging (In-Line) Bulk Active Gate Drivers ICs

Manufacturer No:

LTC4440AMPMS8E-5#PBF

Manufacturer:

Analog Devices

Utmel No:

153-LTC4440AMPMS8E-5#PBF

Package:

8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad

ECAD Model:

Description:

Free Hanging (In-Line) Bulk Active Gate Drivers ICs Non-Inverting 1 80 V V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad

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LTC4440AMPMS8E-5#PBF information

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Product Details
Analog Devices LTC4440AMPMS8E-5#PBF technical specifications, attributes, parameters and parts with similar specifications to Analog Devices LTC4440AMPMS8E-5#PBF.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Free Hanging (In-Line)
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Mounting Feature

    a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

    --
  • Contact Shape

    Contact shape in electronic components refers to the physical geometry of the interface where electrical connections are made. It plays a critical role in determining the quality and reliability of the connection, impacting factors such as resistance, current density, and heat dissipation. Various shapes, such as flat, cylindrical, or custom profiles, influence the contact area, enabling designers to optimize performance for specific applications. The contact shape also affects the mechanical stability of the connection, influencing wear and longevity.

    Circular
  • Shell Material

    The "Shell Material" parameter in electronic components refers to the material used to encase or cover the internal components of the device. This material is chosen based on various factors such as durability, heat resistance, electrical insulation properties, and environmental considerations. Common shell materials include plastics, metals, and ceramics, each offering different levels of protection and performance characteristics. The choice of shell material can impact the overall reliability, safety, and functionality of the electronic component in different operating conditions.

    Zinc Die Cast
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    8-MSOP-EP
  • Insert Material

    The parameter "Insert Material" in electronic components refers to the specific material used to create the insert portions of connectors or other components that facilitate assembly or enhance performance. This material is chosen for its electrical, thermal, and mechanical properties, which can influence the overall functionality and reliability of the component in its intended application. Common insert materials include plastics, ceramics, and metals, each selected based on the requirements of the environment in which the component will operate.

    Polyamide (PA66), Nylon 6/6
  • Number of Terminals
    8
  • Lead Free Status / RoHS Status
    --
  • Contact Sizes
    2.0mm (2), 3.6mm (4)
  • Operating Temp Range
    -55C to 150C
  • Package
    Tube
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    LTC4440
  • Mfr
    Analog Devices Inc.
  • Product Status
    Active
  • Logic voltage-VIL, VIH
    1.2V, 1.6V
  • Driver Configuration
    High-Side
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 150 C
  • Supply Voltage-Max
    80 V
  • Unit Weight
    0.004480 oz
  • Minimum Operating Temperature
    - 55 C
  • Factory Pack QuantityFactory Pack Quantity
    50
  • Supply Voltage-Min
    3.2 V
  • Mounting Styles
    SMD/SMT
  • Manufacturer
    Analog Devices Inc.
  • Brand
    Analog Devices
  • Input Voltage-Max
    100 V
  • Input Voltage-Min
    3.2 V
  • RoHS
    Details
  • Package Description
    MSOP-8
  • Package Style
    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
  • Moisture Sensitivity Levels
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Manufacturer Package Code
    05-08-1662
  • Supply Voltage-Nom
    6 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Rohs Code
    Yes
  • Manufacturer Part Number
    LTC4440AMPMS8E-5#PBF
  • Turn-on Time
    0.08 µs
  • Package Code
    HTSSOP
  • Package Shape
    SQUARE
  • Part Life Cycle Code
    Active
  • Turn-off Time
    0.08 µs
  • Ihs Manufacturer
    ANALOG DEVICES INC
  • Risk Rank
    2.07
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -20°C ~ 130°C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    MotionGrade™ M40 C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    No
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    --
  • Connector Type

    Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

    Plug Housing
  • Type
    For Female Sockets
  • Number of Positions
    6 (2 + 4 Power)
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Fastening Type

    There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

    Threaded
  • Subcategory
    PMIC - Power Management ICs
  • Contact Type

    Contact Type in electronic components refers to the specific design and configuration of the electrical contacts used to establish connections between components or devices. The contact type determines how the electrical signals are transmitted between the components, and it can vary based on factors such as the application requirements, signal type, and environmental conditions. Common contact types include pin contacts, socket contacts, surface mount contacts, and wire-to-board contacts. Understanding the contact type is crucial for ensuring proper connectivity and reliable performance in electronic systems.

    Crimp
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    Si
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    4V ~ 15V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Orientation

    In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

    Keyed
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Shielding

    Shielding in electronic components refers to the practice of enclosing or surrounding sensitive electronic circuits or components with a conductive material to protect them from electromagnetic interference (EMI) or radio frequency interference (RFI). The shielding material acts as a barrier that blocks or absorbs unwanted electromagnetic signals, preventing them from affecting the performance of the electronic device. Shielding can be achieved using materials such as metal enclosures, conductive coatings, or shielding tapes. Proper shielding is essential in electronic design to ensure the reliable operation of electronic devices in environments where electromagnetic interference is present.

    Shielded
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Number of Functions
    1
  • Ingress Protection

    Ingress Protection rating (or just IP rating), is an international standard (IEC 60529) used to rate the degree of protection or sealing effectiveness in electrical enclosures against intrusion of objects, water, dust or accidental contact. It corresponds to the European standard EN 60529.

    IP67 - Dust Tight, Waterproof
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • Shell Finish

    Shell Finish in electronic components refers to the surface treatment or coating applied to the outer shell or casing of the component. This finish is designed to provide protection against environmental factors such as moisture, dust, and corrosion, as well as to enhance the component's appearance. Common types of shell finishes include nickel plating, anodizing, powder coating, and epoxy resin coating. The choice of shell finish depends on the specific requirements of the component, such as the operating environment, durability needs, and aesthetic considerations.

    Nickel
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • Shell Size - Insert

    The parameter "Shell Size - Insert" in electronic components refers to the physical size of the connector shell or housing that holds the insert or contact arrangement within the component. The shell size is typically specified by a numerical designation that corresponds to a specific size and configuration of the connector. This parameter is important for ensuring compatibility and proper fit between different components or devices that use the same type of connector. Manufacturers provide detailed specifications for shell size to help users select the appropriate connector for their specific application requirements.

    M40-6
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PDSO-G8
  • Number of Outputs
    1 Output
  • Housing Color

    Housing color in electronic components refers to the color of the protective casing or enclosure that surrounds the component. It can play a role in visual identification, aiding in easy recognition during assembly or maintenance. Additionally, the housing color may also have implications for heat dissipation, aesthetic considerations, or regulatory compliance depending on the application or industry standards.

    Silver
  • Brand Name
    Analog Devices Inc
  • Note
    Contacts Not Included
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    1.1 A
  • Shell Size, MIL

    The parameter "Shell Size, MIL" in electronic components refers to the physical size of the component's outer shell or housing, measured in thousandths of an inch (mil). It is a standardized measurement used to ensure compatibility and interchangeability of components within a specific series or family. The shell size typically includes dimensions such as diameter, length, and overall shape of the component, and is important for determining how the component will fit into a system or assembly. Manufacturers provide shell size information to help users select the appropriate components for their specific application requirements.

    --
  • Input Type

    Input type in electronic components refers to the classification of the signal or data that a component can accept for processing or conversion. It indicates whether the input is analog, digital, or a specific format such as TTL or CMOS. Understanding input type is crucial for ensuring compatibility between different electronic devices and circuits, as it determines how signals are interpreted and interacted with.

    Non-Inverting
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    1.1 mm
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    10 ns
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Gate Drivers
  • Includes

    Includes is a parameter in electronic components that refers to the additional features or components that are included with the main product. This could include accessories, cables, software, or any other items that come packaged with the main electronic component. The "Includes" parameter is important for consumers to know exactly what they will be receiving when they purchase the product, and it can also help them determine the overall value and functionality of the product. Manufacturers often list the included items in the product description or packaging to provide transparency and help customers make informed purchasing decisions.

    --
  • Rise / Fall Time (Typ)

    The parameter "Rise / Fall Time (Typ)" in electronic components refers to the time it takes for a signal to transition from a specified low level to a specified high level (rise time) or from a high level to a low level (fall time). It is typically measured in nanoseconds or picoseconds and is an important characteristic in determining the speed and performance of a component, such as a transistor or integrated circuit. A shorter rise/fall time indicates faster signal switching and can impact the overall speed and efficiency of a circuit. Designers often consider this parameter when selecting components for high-speed applications to ensure proper signal integrity and timing.

    10ns, 7ns
  • Interface IC Type

    The parameter "Interface IC Type" in electronic components refers to the type of integrated circuit (IC) that is used to facilitate communication between different electronic devices or subsystems. This IC is responsible for managing the exchange of data and control signals between the devices, ensuring proper communication and coordination. The specific type of interface IC used can vary depending on the requirements of the system, such as serial communication (e.g., UART, SPI, I2C), parallel communication, or specialized interfaces like USB or Ethernet. Choosing the appropriate interface IC type is crucial for ensuring compatibility, reliability, and efficiency in electronic systems.

    BUFFER OR INVERTER BASED MOSFET DRIVER
  • Channel Type

    In electronic components, the parameter "Channel Type" refers to the type of channel through which electrical signals or current flow within the component. This parameter is commonly associated with field-effect transistors (FETs) and other semiconductor devices. The channel type can be categorized as either N-channel or P-channel, depending on the polarity of the majority charge carriers (electrons or holes) that carry the current within the channel. N-channel devices have an electron-conducting channel, while P-channel devices have a hole-conducting channel. Understanding the channel type is crucial for proper circuit design and component selection to ensure compatibility and optimal performance.

    Single
  • Number of Drivers
    1
  • Output Peak Current Limit-Nom

    Output Peak Current Limit-Nom is a parameter in electronic components that specifies the maximum current that can be delivered by the output under normal operating conditions. This limit is typically set to protect the component from damage due to excessive current flow. It ensures that the component operates within its safe operating limits and prevents overheating or other potential issues. Designers and engineers use this parameter to ensure proper functioning and reliability of the electronic system in which the component is used.

    1.1 A
  • Gate Type

    In electronic components, the term "Gate Type" typically refers to the type of logic gate used in digital circuits. A logic gate is a fundamental building block of digital circuits that performs a specific logical operation based on the input signals it receives. Common types of logic gates include AND, OR, NOT, NAND, NOR, XOR, and XNOR gates.The Gate Type parameter specifies the specific logic function that the gate performs, such as AND, OR, or NOT. Different gate types have different truth tables that define their behavior based on the input signals. By selecting the appropriate gate type for a given application, designers can implement various logical functions and operations in digital circuits.Understanding the gate type is essential for designing and analyzing digital circuits, as it determines how the circuit processes and manipulates binary data. Choosing the right gate type is crucial for ensuring the correct functionality and performance of the digital system being designed.

    N-Channel MOSFET
  • Current - Peak Output (Source, Sink)

    The parameter "Current - Peak Output (Source, Sink)" in electronic components refers to the maximum amount of current that the component can either supply (source) or sink (absorb) under peak conditions. This parameter is important for understanding the capability of the component to handle sudden surges or spikes in current without being damaged. The peak output current is typically specified in datasheets and is crucial for designing circuits that require high current handling capabilities. It is essential to consider this parameter to ensure the component operates within its safe operating limits and to prevent potential damage or malfunction.

    1.1A, 1.1A
  • High Side Driver

    A High Side Driver is an electronic component used in power management applications to control the switching of high-side power devices such as MOSFETs or IGBTs. It is designed to drive the gate or base of the power device to turn it on or off, allowing current to flow through the load or cutting off the current flow. High Side Drivers are commonly used in automotive, industrial, and consumer electronics to control various loads such as motors, solenoids, and heaters. They provide isolation between the control circuitry and the high-side power device, ensuring safe and reliable operation of the system.

    YES
  • High Side Voltage - Max (Bootstrap)

    The parameter "High Side Voltage - Max (Bootstrap)" in electronic components refers to the maximum voltage that can be applied to the high side of a bootstrap circuit. Bootstrap circuits are commonly used in power electronics to drive high-side MOSFETs or IGBTs efficiently. This parameter is crucial for ensuring the proper operation and reliability of the bootstrap circuit, as exceeding the maximum voltage can lead to component failure or malfunction. Designers must carefully consider this specification when selecting components and designing circuits to prevent damage and ensure optimal performance.

    80 V
  • Product

    In the context of electronic components, the parameter "Product" typically refers to the specific item or device being discussed or analyzed. It can refer to a physical electronic component such as a resistor, capacitor, transistor, or integrated circuit. The product parameter may also encompass more complex electronic devices like sensors, displays, microcontrollers, or communication modules.Understanding the product parameter is crucial in electronics as it helps identify the characteristics, specifications, and functionality of the component or device in question. This information is essential for selecting the right components for a circuit design, troubleshooting issues, or comparing different products for a particular application. Manufacturers often provide detailed product datasheets that outline key specifications, performance characteristics, and application guidelines to assist engineers and designers in utilizing the component effectively.

    MOSFET Gate Drivers
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Coupling Nut
  • Product Category

    a particular group of related products.

    Gate Drivers
  • Width
    3 mm
  • Length
    3 mm
  • Material Flammability Rating

    The Material Flammability Rating is a parameter used to indicate the flammability characteristics of materials used in electronic components. It is typically measured according to standards such as UL94, which classifies materials into different categories based on their flammability properties. The rating helps in assessing the fire safety of electronic devices and components, as materials with higher flammability ratings are more resistant to ignition and combustion. Manufacturers often specify the Material Flammability Rating of their components to ensure compliance with safety regulations and standards. It is important to consider this parameter when designing and selecting electronic components to minimize fire hazards and ensure the overall safety of the end product.

    UL94 V-0
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Download datasheets and manufacturer documentation for Analog Devices LTC4440AMPMS8E-5#PBF.

LTC4440AMPMS8E-5#PBF Overview

For greater flexibility, its 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad package is used.Bulk represents the package.Configuration is based on 1 drivers.Free Hanging (In-Line) is the way in which it is mounted.In the absence of a 4V ~ 15V supply voltage, its superiority can be demonstrated.Gate type N-Channel MOSFET is designed for it.This device can operate at temperatures up to -20°C ~ 130°C.Non-Inverting is used as the input type.Mosfet driver is equipped wMosfet driverh an interface chip BUFFER OR INVERTER BASED MOSFET DRIVER.There are several useful electronic components in this subcategory of PMIC - Power Management ICs.The board has 8 component pins.Maximum (Bootstrap) voltage can be up to 80 V.For its basis, there are 1 Output outputs integrated.1.1 A is the maximum output current supported by the device.There are several gate drivers in the MotionGrade™ M40 C series, including this one.In order to develop its basis, 8 terminals are used.

LTC4440AMPMS8E-5#PBF Features

Embedded in the Bulk package
1 drivers
Employing a gate type of N-Channel MOSFET
High-side voltage - Max (Bootstrap) of 80 V
Operating with the supply voltage of MotionGrade™ M40 C

LTC4440AMPMS8E-5#PBF Applications

There are a lot of Analog Devices
LTC4440AMPMS8E-5#PBF gate drivers applications.


  • Portable computers
  • High-speed communications
  • RGB applications
  • Broadcast equipment
  • Active filtering
  • Head-up and Head mounted displays
  • High current laser/LED systems
  • LCD/LCoS/DLP portable and embedded pico projectors
  • Multicolor LED/laser displays
  • Smart Phones