Analog Devices MAX4533CAP

Multiplexers ICs SPDT 250ns, 150ns Analog Switches

Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

The "Shell Material" parameter in electronic components refers to the material used to encase or cover the internal components of the device. This material is chosen based on various factors such as durability, heat resistance, electrical insulation properties, and environmental considerations. Common shell materials include plastics, metals, and ceramics, each offering different levels of protection and performance characteristics. The choice of shell material can impact the overall reliability, safety, and functionality of the electronic component in different operating conditions.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

The parameter "Insert Material" in electronic components refers to the specific material used to create the insert portions of connectors or other components that facilitate assembly or enhance performance. This material is chosen for its electrical, thermal, and mechanical properties, which can influence the overall functionality and reliability of the component in its intended application. Common insert materials include plastics, ceramics, and metals, each selected based on the requirements of the environment in which the component will operate.

Backshell Material, Plating refers to the material and plating used in the backshell of electronic components. The backshell is a protective covering or housing that is typically located at the rear end of a connector or cable assembly. The material and plating used in the backshell are chosen based on factors such as durability, conductivity, corrosion resistance, and compatibility with the surrounding environment. Common materials used for backshells include aluminum, stainless steel, and plastic, while plating options may include nickel, zinc, or gold to provide additional protection and improve electrical performance. The choice of backshell material and plating is crucial in ensuring the reliability and longevity of electronic components in various applications.

"Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

The parameter "Current Rating (Amps)" in electronic components refers to the maximum amount of electrical current that the component can safely handle without being damaged. It is typically measured in amperes (A) and is an important specification to consider when designing or selecting components for a circuit. Exceeding the current rating of a component can lead to overheating, malfunction, or even failure of the component. It is crucial to ensure that the current rating of a component matches the requirements of the circuit to prevent any potential issues and ensure reliable operation.

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

Shielding in electronic components refers to the practice of enclosing or surrounding sensitive electronic circuits or components with a conductive material to protect them from electromagnetic interference (EMI) or radio frequency interference (RFI). The shielding material acts as a barrier that blocks or absorbs unwanted electromagnetic signals, preventing them from affecting the performance of the electronic device. Shielding can be achieved using materials such as metal enclosures, conductive coatings, or shielding tapes. Proper shielding is essential in electronic design to ensure the reliable operation of electronic devices in environments where electromagnetic interference is present.

Ingress Protection rating (or just IP rating), is an international standard (IEC 60529) used to rate the degree of protection or sealing effectiveness in electrical enclosures against intrusion of objects, water, dust or accidental contact. It corresponds to the European standard EN 60529.

Shell Finish in electronic components refers to the surface treatment or coating applied to the outer shell or casing of the component. This finish is designed to provide protection against environmental factors such as moisture, dust, and corrosion, as well as to enhance the component's appearance. Common types of shell finishes include nickel plating, anodizing, powder coating, and epoxy resin coating. The choice of shell finish depends on the specific requirements of the component, such as the operating environment, durability needs, and aesthetic considerations.

The parameter "Shell Size - Insert" in electronic components refers to the physical size of the connector shell or housing that holds the insert or contact arrangement within the component. The shell size is typically specified by a numerical designation that corresponds to a specific size and configuration of the connector. This parameter is important for ensuring compatibility and proper fit between different components or devices that use the same type of connector. Manufacturers provide detailed specifications for shell size to help users select the appropriate connector for their specific application requirements.

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

The parameter "Shell Size, MIL" in electronic components refers to the physical size of the component's outer shell or housing, measured in thousandths of an inch (mil). It is a standardized measurement used to ensure compatibility and interchangeability of components within a specific series or family. The shell size typically includes dimensions such as diameter, length, and overall shape of the component, and is important for determining how the component will fit into a system or assembly. Manufacturers provide shell size information to help users select the appropriate components for their specific application requirements.

Max Supply Current refers to the maximum amount of electrical current that a component can draw from its power supply under normal operating conditions. It is a critical parameter that ensures the component operates reliably without exceeding its thermal limits or damaging internal circuitry. Exceeding this current can lead to overheating, performance degradation, or failure of the component. Understanding this parameter is essential for designing circuits that provide adequate power while avoiding overload situations.

"Throw Configuration" is a term commonly used in the context of switches and relays in electronic components. It refers to the number of positions or states that the switch or relay can be set to. For example, a single-throw (ST) configuration means the switch has only one position, while a double-throw (DT) configuration means the switch has two positions.The throw configuration is important because it determines the versatility and functionality of the switch or relay. Different applications may require different throw configurations to control the flow of current or signals effectively. Understanding the throw configuration of a component is crucial for proper installation and operation within an electronic circuit.

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

Cable Opening in electronic components refers to the physical opening or port through which a cable can be connected to the component. This opening is designed to accommodate the specific type and size of cable that is intended to be used with the component. The cable opening is an important feature as it allows for the secure and proper connection of the cable to the component, ensuring reliable data or power transmission. It is essential to match the cable opening size and type with the corresponding cable to prevent any compatibility issues and to maintain the integrity of the connection.

Supply Type in electronic components refers to the classification of power sources used to operate the component. It indicates whether the component requires DC or AC power, and if DC, specifies the voltage levels such as low, medium, or high. Different supply types can affect the performance, compatibility, and application of the component in electronic circuits. Understanding the supply type is crucial for proper component selection and integration into electronic designs.

A Dual power supply is a regular direct current power supply. It can provide a positive as well as negative voltage. It ensures stable power supply to the device as well as it helps to prevent system damage.

The "-3dB bandwidth" of an electronic component refers to the frequency range over which the component's output signal power is reduced by 3 decibels (dB) compared to its maximum output power. This parameter is commonly used to describe the frequency response of components such as amplifiers, filters, and other signal processing devices. The -3dB point is significant because it represents the half-power point, where the output signal power is reduced to half of its maximum value. Understanding the -3dB bandwidth is important for designing and analyzing electronic circuits to ensure that signals are accurately processed within the desired frequency range.

The "On-State Resistance (Max)" parameter in electronic components refers to the maximum resistance exhibited by the component when it is in the fully conducting state. This resistance is typically measured when the component is carrying the maximum specified current. A lower on-state resistance indicates better conductivity and efficiency of the component when it is in the on-state. It is an important parameter to consider when selecting components for applications where low power dissipation and high efficiency are critical factors.

The parameter "Min Dual Supply Voltage" in electronic components refers to the minimum voltage required for the proper operation of a device that uses dual power supplies. Dual power supplies typically consist of a positive and a negative voltage source. The "Min Dual Supply Voltage" specification ensures that both the positive and negative supply voltages are within a certain range to guarantee the device functions correctly. It is important to adhere to this parameter to prevent damage to the component and ensure reliable performance.

High-level Output Current IOH The current flowing into the output at a specified high- level voltage. Low-level Output Current IOL The current flowing into the output at a specified low- level output voltage.

A Multiplexer/Demultiplexer Circuit is an electronic component used in digital circuits to select one of several input signals and route it to a single output. A multiplexer, also known as a "mux," is used to combine multiple input signals into a single output, while a demultiplexer, also known as a "demux," is used to take a single input and route it to one of several possible outputs. These circuits are commonly used in data transmission, communication systems, and digital signal processing applications to efficiently manage and control the flow of data. Multiplexers and demultiplexers play a crucial role in optimizing the use of resources and improving the overall performance of electronic systems.

Current - Leakage (IS(off)) (Max) refers to the maximum amount of current that flows through a device when it is in its off state, meaning it is not conducting or not intended to be active. This parameter is crucial in determining the efficiency of electronic components, especially in battery-operated devices, as higher leakage currents can lead to increased power consumption and reduced battery life. It is typically measured in microamperes (µA) or milliamperes (mA) and helps engineers assess the suitability of a component for low-power applications.

Channel capacitance (CS(off), CD(off)) in electronic components refers to the capacitance associated with the channel of a field-effect transistor (FET) when it is turned off. CS(off) represents the capacitance between the source and the gate of the FET, while CD(off) represents the capacitance between the drain and the gate. These capacitances play a crucial role in determining the high-frequency performance and switching characteristics of the FET. Understanding and controlling these capacitances is essential for optimizing the performance of electronic circuits, especially in high-speed applications where minimizing parasitic capacitances is critical for achieving desired signal integrity and efficiency.

establishes connections between links, on demand and as available, in order to establish an end-to-end circuit between devices.

The parameter "Switch Time (Ton, Toff) (Max)" in electronic components refers to the maximum time it takes for a device to transition between its on and off states. Ton represents the turn-on time, which is the time taken for the device to switch from the off state to the on state, while Toff represents the turn-off time, which is the time taken for the device to switch from the on state to the off state. This parameter is crucial in determining the speed and efficiency of the device's switching operation. A shorter switch time generally indicates faster switching speeds and better performance of the electronic component.

A Charge injection in analog switches and multiplexers is a level change caused by stray capacitance associated with the NMOS and PMOS transistors that make up the analog switch.

Crosstalk is a phenomenon in electronic components where signals unintentionally interact with each other, leading to interference or noise. It occurs when signals from one circuit or channel unintentionally couple into another nearby circuit or channel. This interference can result in signal degradation, data errors, or even complete failure of the electronic system. Crosstalk is a common issue in high-speed digital circuits, communication systems, and other electronic devices where multiple signals are present in close proximity. Design techniques such as proper signal routing, shielding, and signal isolation are often employed to minimize crosstalk and ensure reliable operation of electronic components.

Voltage - Supply, Single (V+) refers to the positive voltage supply needed for an electronic component to operate. It indicates the range of voltage levels that can be applied to the component from a single power source. This parameter is crucial for determining compatibility with other components in a circuit and ensuring proper functionality. It typically defines the minimum and maximum voltage limits within which the device can safely and effectively operate.

The Drain to Source Resistance, often denoted as RDS(on), is a crucial parameter in electronic components, particularly in field-effect transistors (FETs) such as MOSFETs. It represents the resistance between the drain and source terminals when the FET is in its on-state, conducting current. A lower RDS(on) value indicates better conductivity and efficiency, as it results in less power dissipation and heat generation in the component. Designers often aim to minimize RDS(on) to improve the performance and overall efficiency of electronic circuits, especially in power applications where minimizing losses is critical.

The parameter "Voltage - Supply, Dual (V±)" refers to the range of dual supply voltages required for the operation of an electronic component. This specification indicates that the component can operate with both positive and negative voltage levels, typically represented as V+ for the positive voltage and V- for the negative voltage. It is commonly used in analog devices and operational amplifiers to facilitate signal processing that requires a reference point at ground level, allowing for both upwards and downwards signal variations. A typical example would be V+ = +15V and V- = -15V, indicating the component can operate effectively within that voltage range.

In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

Contact Finish Thickness - Mating is a parameter in electronic components that refers to the thickness of the plating or finish on the contact surfaces of a connector or terminal that come into direct contact with mating components. This parameter is crucial for ensuring proper electrical conductivity and mechanical stability during mating and unmating processes. The contact finish thickness affects the overall reliability and performance of the connection by influencing factors such as contact resistance, wear resistance, and corrosion resistance. Manufacturers specify this parameter to ensure compatibility and optimal performance in various applications.

The Material Flammability Rating is a parameter used to indicate the flammability characteristics of materials used in electronic components. It is typically measured according to standards such as UL94, which classifies materials into different categories based on their flammability properties. The rating helps in assessing the fire safety of electronic devices and components, as materials with higher flammability ratings are more resistant to ignition and combustion. Manufacturers often specify the Material Flammability Rating of their components to ensure compliance with safety regulations and standards. It is important to consider this parameter when designing and selecting electronic components to minimize fire hazards and ensure the overall safety of the end product.

The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.