Analog Devices Inc. AD8396ACPZ-RL

Driver 2/0 Drivers/Receivers 16 Pin 16 Terminations Drivers Interface ICs

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

The center distance from one pole to the next.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

a count of all of the component leads (or pins)

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

the maximum rate of output voltage change per unit time.

In electronic components, the parameter "Architecture" refers to the overall design and structure of the component. It encompasses the arrangement of internal components, the layout of circuitry, and the physical form of the component. The architecture of an electronic component plays a crucial role in determining its functionality, performance, and compatibility with other components in a system. Different architectures can result in variations in power consumption, speed, size, and other key characteristics of the component. Designers often consider the architecture of electronic components carefully to ensure optimal performance and integration within a larger system.

The parameter "Average Bias Current-Max (IIB)" in electronic components refers to the maximum average bias current that the component can handle without exceeding its specified operating limits. Bias current is the current that flows through a component when it is in its quiescent state or when it is not actively processing a signal. Exceeding the maximum average bias current can lead to overheating, reduced performance, or even damage to the component. Therefore, it is important to ensure that the bias current does not exceed the specified maximum value to maintain the reliability and longevity of the electronic component.

Low-offset is a parameter used to describe the level of offset voltage in electronic components, particularly in operational amplifiers. Offset voltage refers to the small voltage difference that exists between the input terminals of the amplifier when the input voltage is zero. A low-offset value indicates that this voltage difference is minimal, which is desirable for accurate signal processing and amplification. Components with low-offset specifications are preferred in applications where precision and accuracy are critical, such as in instrumentation and measurement systems. Minimizing offset voltage helps reduce errors and ensures the faithful reproduction of input signals by the amplifier.

Frequency compensation is implemented by modifying the gain and phase characteristics of the amplifier's open loop output or of its feedback network, or both, in such a way as to avoid the conditions leading to oscillation. This is usually done by the internal or external use of resistance-capacitance networks.

The parameter "Supply Voltage Limit-Max" in electronic components refers to the maximum voltage that the component can safely handle without getting damaged. This specification is crucial for ensuring the reliable operation and longevity of the component within a given electrical system. Exceeding the maximum supply voltage limit can lead to overheating, electrical breakdown, or permanent damage to the component. It is important to carefully adhere to this limit when designing and operating electronic circuits to prevent potential failures and ensure the overall system's performance and safety.

Low-bias in electronic components refers to a design or configuration that minimizes the amount of bias current flowing through the component. Bias current is a small, steady current that is used to establish the operating point of a component, such as a transistor or amplifier. By reducing the bias current to a low level, the component can operate with lower power consumption and potentially lower distortion. Low-bias components are often used in applications where power efficiency and signal fidelity are important, such as in audio amplifiers or battery-powered devices. Overall, the low-bias parameter indicates the ability of the component to operate efficiently and accurately with minimal bias current.

the use of very small electric generators and prime movers or devices to convert heat or motion to electricity, for use close to the generator.

The parameter "Bias Current-Max (IIB) @25C" in electronic components refers to the maximum input bias current that the component can handle at a specified temperature of 25 degrees Celsius. Bias current is the current flowing into the input terminal of a device when no signal is applied. This parameter is important because excessive bias current can affect the performance and stability of the component, leading to potential issues such as distortion or offset errors in the output signal. By specifying the maximum bias current allowed at a certain temperature, manufacturers provide users with important information to ensure proper operation and reliability of the component in their circuit designs.

A programmable power supply provides remote control capability of the output voltage(s) via an analog control signal controlled by keypad or rotary switch from the front panel of the power supply or via a computer interface such as RS232, GPIB, or USB.

The parameter "Input Offset Voltage-Max" in electronic components refers to the maximum allowable difference in voltage between the input terminals of an operational amplifier or other analog circuitry before the output is affected. It is a measure of the device's ability to maintain precise and accurate signal processing. A higher Input Offset Voltage-Max value indicates a greater potential for error in the output signal due to input voltage differences. Designers must consider this parameter when selecting components to ensure the desired level of accuracy and performance in their circuits.

Wideband refers to a characteristic of electronic components or systems that can operate over a broad frequency range. It indicates the ability of the component to handle a wide spectrum of frequencies without significant loss of performance. In applications such as amplifiers, antennas, and filters, wideband components are essential for transmitting and receiving signals across various frequencies, making them versatile for different communication standards and technologies.

Power in electronic components refers to the rate at which electrical energy is transferred or converted by a device. It is typically measured in watts and can be calculated using the formula Power equals voltage multiplied by current. In circuits, power can represent the energy consumed by devices such as resistors, or the energy output by sources like batteries. Understanding power is crucial for ensuring components operate within safe limits and for designing efficient electronic systems.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.