Analog Devices Inc. ADG659YRU-REEL7

Multiplexers ICs 5V SP4T 115ns, 45ns Analog Switches 16 Pins

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

The center distance from one pole to the next.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

a count of all of the component leads (or pins)

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

Analog IC - Other Type is a parameter used to categorize electronic components that are integrated circuits (ICs) designed for analog signal processing but do not fall into more specific subcategories such as amplifiers, comparators, or voltage regulators. These ICs may include specialized analog functions such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), voltage references, or signal conditioning circuits. They are typically used in various applications where precise analog signal processing is required, such as in audio equipment, instrumentation, communication systems, and industrial control systems. Manufacturers provide detailed specifications for these components to help engineers select the most suitable IC for their specific design requirements.

"Throw Configuration" is a term commonly used in the context of switches and relays in electronic components. It refers to the number of positions or states that the switch or relay can be set to. For example, a single-throw (ST) configuration means the switch has only one position, while a double-throw (DT) configuration means the switch has two positions.The throw configuration is important because it determines the versatility and functionality of the switch or relay. Different applications may require different throw configurations to control the flow of current or signals effectively. Understanding the throw configuration of a component is crucial for proper installation and operation within an electronic circuit.

The parameter "Voltage - Supply, Single/Dual (±)" in electronic components refers to the power supply voltage required for the proper operation of the component. This parameter indicates whether the component requires a single power supply voltage (e.g., 5V) or a dual power supply voltage (e.g., ±15V). For components that require a single power supply voltage, only one voltage level is needed for operation. On the other hand, components that require a dual power supply voltage need both positive and negative voltage levels to function correctly.Understanding the voltage supply requirements of electronic components is crucial for designing and integrating them into circuits to ensure proper functionality and prevent damage due to incorrect voltage levels.

Supply Current-Max (Isup) refers to the maximum amount of current that an electronic component can draw from its power supply during operation. It represents the peak current demand of the device under normal operating conditions and is critical for ensuring that the power supply can adequately support the component's needs without risking damage or malfunction. This parameter is essential for designing circuits and selecting appropriate power supply units to prevent overloading and ensure reliable performance.

The parameter "Neg Supply Voltage-Nom (Vsup)" in electronic components refers to the nominal negative supply voltage that the component requires to operate within its specified performance characteristics. This parameter indicates the minimum voltage level that must be provided to the component's negative supply pin for proper functionality. It is important to ensure that the negative supply voltage provided to the component does not exceed the maximum specified value to prevent damage or malfunction. Understanding and adhering to the specified negative supply voltage requirements is crucial for the reliable operation of the electronic component in a circuit.

A Dual power supply is a regular direct current power supply. It can provide a positive as well as negative voltage. It ensures stable power supply to the device as well as it helps to prevent system damage.

The "-3dB bandwidth" of an electronic component refers to the frequency range over which the component's output signal power is reduced by 3 decibels (dB) compared to its maximum output power. This parameter is commonly used to describe the frequency response of components such as amplifiers, filters, and other signal processing devices. The -3dB point is significant because it represents the half-power point, where the output signal power is reduced to half of its maximum value. Understanding the -3dB bandwidth is important for designing and analyzing electronic circuits to ensure that signals are accurately processed within the desired frequency range.

The "On-State Resistance (Max)" parameter in electronic components refers to the maximum resistance exhibited by the component when it is in the fully conducting state. This resistance is typically measured when the component is carrying the maximum specified current. A lower on-state resistance indicates better conductivity and efficiency of the component when it is in the on-state. It is an important parameter to consider when selecting components for applications where low power dissipation and high efficiency are critical factors.

The parameter "Min Dual Supply Voltage" in electronic components refers to the minimum voltage required for the proper operation of a device that uses dual power supplies. Dual power supplies typically consist of a positive and a negative voltage source. The "Min Dual Supply Voltage" specification ensures that both the positive and negative supply voltages are within a certain range to guarantee the device functions correctly. It is important to adhere to this parameter to prevent damage to the component and ensure reliable performance.

A Multiplexer/Demultiplexer Circuit is an electronic component used in digital circuits to select one of several input signals and route it to a single output. A multiplexer, also known as a "mux," is used to combine multiple input signals into a single output, while a demultiplexer, also known as a "demux," is used to take a single input and route it to one of several possible outputs. These circuits are commonly used in data transmission, communication systems, and digital signal processing applications to efficiently manage and control the flow of data. Multiplexers and demultiplexers play a crucial role in optimizing the use of resources and improving the overall performance of electronic systems.

Off-state Isolation-Nom is a parameter used to measure the level of isolation between two electronic components or circuits when one of them is in the off state. It indicates the ability of the component to prevent unwanted signals or interference from passing through when it is not actively conducting. The parameter is typically expressed in decibels (dB) and is an important consideration in designing and selecting components for applications where isolation between different parts of a circuit is critical to prevent crosstalk or interference. Higher values of Off-state Isolation-Nom indicate better isolation performance, leading to improved overall system reliability and performance.

Current - Leakage (IS(off)) (Max) refers to the maximum amount of current that flows through a device when it is in its off state, meaning it is not conducting or not intended to be active. This parameter is crucial in determining the efficiency of electronic components, especially in battery-operated devices, as higher leakage currents can lead to increased power consumption and reduced battery life. It is typically measured in microamperes (µA) or milliamperes (mA) and helps engineers assess the suitability of a component for low-power applications.

Channel capacitance (CS(off), CD(off)) in electronic components refers to the capacitance associated with the channel of a field-effect transistor (FET) when it is turned off. CS(off) represents the capacitance between the source and the gate of the FET, while CD(off) represents the capacitance between the drain and the gate. These capacitances play a crucial role in determining the high-frequency performance and switching characteristics of the FET. Understanding and controlling these capacitances is essential for optimizing the performance of electronic circuits, especially in high-speed applications where minimizing parasitic capacitances is critical for achieving desired signal integrity and efficiency.

On-state Resistance Match-Nom refers to the nominal or standard value of the on-state resistance for a specific electronic component, such as a transistor or a MOSFET, when it is in its "on" state. This parameter indicates how much resistance the component presents to current flow during its conducting phase, which affects power dissipation and efficiency. Matching this value across multiple devices is crucial for ensuring consistent performance in applications where several components operate together.

establishes connections between links, on demand and as available, in order to establish an end-to-end circuit between devices.

The parameter "Switch Time (Ton, Toff) (Max)" in electronic components refers to the maximum time it takes for a device to transition between its on and off states. Ton represents the turn-on time, which is the time taken for the device to switch from the off state to the on state, while Toff represents the turn-off time, which is the time taken for the device to switch from the on state to the off state. This parameter is crucial in determining the speed and efficiency of the device's switching operation. A shorter switch time generally indicates faster switching speeds and better performance of the electronic component.

A Charge injection in analog switches and multiplexers is a level change caused by stray capacitance associated with the NMOS and PMOS transistors that make up the analog switch.

Channel-to-Channel Matching (ΔRon) refers to the variation in the on-resistance of multiple channels within a multi-channel electronic component, such as a multiplexer or a switch. It is a measure of how closely the on-resistance values of different channels match each other. The lower the ΔRon value, the better the matching between channels, which is important for ensuring consistent performance across all channels in a system. Channel-to-Channel Matching is critical in applications where precise and uniform signal processing is required, such as in instrumentation, audio equipment, and communication systems. Manufacturers provide specifications for ΔRon to help designers select components that meet their performance requirements.

In electronic components, "Switching" refers to the process of turning a device on or off, or changing its state from one condition to another. This parameter is crucial in determining the speed and efficiency of a component's operation. It is often measured in terms of switching time, which is the time taken for a device to transition from one state to another. The switching characteristics of a component play a significant role in its overall performance and reliability in electronic circuits.

Switch-off Time-Max is a parameter in electronic components that refers to the maximum time it takes for a device to turn off completely after a control signal is applied to switch it off. This parameter is crucial in determining the response time and efficiency of the component in various applications. A shorter switch-off time-max indicates a faster response and better performance of the component. It is important to consider this parameter when designing circuits or systems where precise timing and control are required.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.