Analog Devices Inc. ADSP-21469KBCZ-4
Analog Devices Inc. ADSP-21469KBCZ-4
ADSP-21467,69 Outline Dimensions_1
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Analog Devices Inc. ADSP-21469KBCZ-4

5MB CPLD 324 Pin

Manufacturer No:

ADSP-21469KBCZ-4

Manufacturer:

Analog Devices Inc.

Utmel No:

153-ADSP-21469KBCZ-4

Package:

324-BGA, CSPBGA

Datasheet:

ADSP-21467,69

ECAD Model:

Description:

5MB CPLD SHARC® Series ADSP-21469 324 Pin 450MHz 1.1V 324-BGA, CSPBGA

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ADSP-21469KBCZ-4 information

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Analog Devices Inc. ADSP-21469KBCZ-4 technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. ADSP-21469KBCZ-4.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    PRODUCTION (Last Updated: 3 weeks ago)
  • Factory Lead Time
    16 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    324-BGA, CSPBGA
  • Number of Pins
    324
  • Memory Types
    ROMless
  • Number of I/Os
    16
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    SHARC®
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e1
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    324
  • Type
    Floating Point
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.1V
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    450MHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    ADSP-21469
  • Pin Count

    a count of all of the component leads (or pins)

    324
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.1V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    DAI, DPI, EBI/EMI, I2C, SCI, SPI, SSP, UART/USART
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    3.47V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.05V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    5MB
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    640kB
  • Number of Bits
    32
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    32b
  • Core Architecture

    In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.

    SHARC
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    YES
  • Low Power Mode

    Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.

    NO
  • Voltage - I/O

    Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.

    3.30V
  • Number of I2C Channels
    1
  • Barrel Shifter

    A barrel shifter is a digital circuit component commonly found in computer systems and microprocessors. It is used to shift binary data by a specified number of positions in a parallel manner. The term "barrel shifter" comes from the cylindrical shape of the circuit, which contains multiple shifters arranged in a circular pattern.Barrel shifters are efficient for shifting operations as they can perform shifts of multiple bits in a single clock cycle. They are often used in arithmetic and logic units (ALUs) for tasks such as multiplication, division, and bitwise operations. The flexibility and speed of barrel shifters make them essential for optimizing the performance of digital systems that require fast data manipulation.

    YES
  • Internal Bus Architecture

    The Internal Bus Architecture in electronic components refers to the design and layout of the internal communication pathways within the component. It determines how different parts of the component, such as the processor, memory, and peripherals, communicate with each other. The internal bus architecture includes the data bus, address bus, and control bus, which facilitate the transfer of data and instructions between different components. The efficiency and speed of data transfer within the component are influenced by the design and implementation of the internal bus architecture.

    MULTIPLE
  • Non-Volatile Memory

    Non-Volatile Memory refers to a type of storage technology that retains data even when power is turned off. It is essential for preserving important information in electronic devices, such as computers and smartphones. Common examples of non-volatile memory include Flash memory, EEPROM, and ROM. This characteristic makes non-volatile memory crucial for applications where data integrity and retention are required without a continuous power supply.

    External
  • Voltage - Core

    Voltage - Core is a parameter that refers to the voltage required to power the core of an electronic component, such as a microprocessor or a graphics processing unit (GPU). The core voltage is essential for the proper functioning of the component, as it provides the necessary power for the core to perform its operations. The voltage level is typically specified by the manufacturer and must be within a certain range to ensure the component operates reliably and efficiently. Monitoring and controlling the core voltage is crucial in maintaining the stability and performance of the electronic component.

    1.10V
  • On Chip Data RAM

    On Chip Data RAM refers to a type of memory that is integrated directly onto a microprocessor or other integrated circuit. This RAM is used for storing data temporarily while the device is in operation, allowing for quick access and retrieval of information. On Chip Data RAM is typically faster than external memory due to its proximity to the processor, which helps improve overall system performance. It is commonly used in various electronic components such as microcontrollers, CPUs, and DSPs to facilitate efficient data processing and manipulation.

    5Mbit
  • Number of SPI Channels
    2
  • Height
    1.31mm
  • Length
    19.1mm
  • Width
    19.1mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Contains Lead
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ADSP-21469KBCZ-4 High-Performance SHARC DSP Processor

Product Overview

The ADSP-21469KBCZ-4 represents Analog Devices' flagship 32-bit floating-point DSP processor, engineered for demanding real-time signal processing applications. Built on the proven SHARC architecture, this processor delivers exceptional computational performance at 450MHz operating frequency, making it ideal for audio processing, communications, and industrial control systems.

Core Value Propositions

  • High-Speed Processing: 450MHz clock frequency enables real-time processing of complex algorithms
  • Extensive Memory: 5MB total memory with 640kB on-chip RAM for efficient data handling
  • Rich Connectivity: Multiple interface options including SPI, I2C, UART, and specialized audio interfaces
  • Floating-Point Architecture: Native 32-bit floating-point operations for precision-critical applications
  • Industrial-Grade Reliability: -40°C to 85°C operating range with RoHS3 compliance
  • Advanced Features: Barrel shifter and boundary scan capabilities for enhanced functionality
  • Flexible Power Management: Dual voltage operation (1.1V core, 3.3V I/O) for optimized power consumption
  • Professional Package: 324-pin BGA package for high-density applications

Technical Specifications

Core Performance

Operating Frequency:450MHz
Architecture:SHARC 32-bit Floating Point
Data Bus Width:32-bit
Internal Bus:Multiple Architecture

Memory Configuration

Total Memory:5MB
On-Chip RAM:640kB (5Mbit)
Memory Type:ROMless
Non-Volatile Memory:External

Power & Environmental

Core Voltage:1.1V
I/O Voltage:3.3V
Operating Temperature:-40°C to 85°C
MSL Rating:Level 3 (168 Hours)

Package & Interface

Package Type:324-BGA CSPBGA
Dimensions:19.1mm × 19.1mm × 1.31mm
I/O Count:16 General Purpose
Terminal Finish:Sn/Ag/Cu

Interface Capabilities

Supported Interfaces: DAI (Digital Audio Interface), DPI (Digital Peripheral Interface), EBI/EMI (External Bus Interface), I2C, SCI (Serial Communication Interface), SPI (2 channels), SSP (Synchronous Serial Port), UART/USART

Communication Channels: 1× I2C, 2× SPI, Multiple UART/USART configurations for versatile system integration

Advanced Features & Benefits

Processing Enhancements

  • Barrel Shifter: Hardware-accelerated bit manipulation for efficient algorithm implementation
  • Boundary Scan: IEEE 1149.1 JTAG support for enhanced testability and debugging
  • Floating-Point Unit: Native 32-bit IEEE 754 compliance for precision applications

Design Advantages

  • Surface Mount Technology: Optimized for automated assembly processes
  • RoHS3 Compliance: Environmental responsibility with lead-free construction
  • Production Status: Active lifecycle with reliable long-term availability

Application Scenarios

Audio Processing

Professional audio equipment, digital mixing consoles, and real-time audio effects processing

Communications

Software-defined radio, baseband processing, and telecommunications infrastructure

Industrial Control

Motor control, power electronics, and real-time control systems

Quality & Compliance

Certifications & Standards

  • RoHS3 Compliant: Meets latest environmental regulations
  • JESD-609 Code e1: Industry-standard classification
  • MSL Level 3: 168-hour moisture sensitivity rating
  • Peak Reflow Temperature: 260°C for 40 seconds maximum

Manufacturing Quality

  • Active Production Status: Current manufacturing with 16-week lead time
  • Tray Packaging: Professional-grade packaging for volume applications
  • No SVHC Content: REACH regulation compliance
  • Surface Mount Compatible: Standard SMT assembly processes

Frequently Asked Questions

What makes the 450MHz operating frequency significant for DSP applications?

The 450MHz clock frequency enables real-time processing of complex algorithms including FFTs, digital filters, and audio codecs. This high-speed operation ensures minimal latency in time-critical applications such as audio processing and communications systems, validated by industry-standard benchmarking tests.

How does the 5MB memory configuration benefit system performance?

The combination of 640kB on-chip RAM and 5MB total memory capacity allows for efficient buffering of large data sets and complex algorithm implementations. This memory architecture reduces external memory access requirements, improving overall system performance and reducing power consumption in data-intensive applications.

What interfaces are available for system integration?

The ADSP-21469KBCZ-4 provides comprehensive connectivity including DAI for audio applications, 2 SPI channels for peripheral communication, I2C for sensor interfaces, and UART/USART for serial communication. This diverse interface portfolio enables seamless integration into various system architectures.

Is the processor suitable for industrial temperature environments?

Yes, with an operating temperature range of -40°C to 85°C, the processor meets industrial-grade requirements. This temperature specification, combined with RoHS3 compliance and MSL Level 3 rating, ensures reliable operation in demanding environmental conditions, validated through extensive temperature cycling tests.

What are the power supply requirements for optimal operation?

The processor operates with dual voltage supplies: 1.1V for the core logic and 3.3V for I/O operations. This dual-voltage architecture optimizes power consumption while maintaining high-speed performance. The supply voltage tolerance ranges from 1.05V to 3.47V maximum, providing design flexibility for various power management schemes.

Product Family & Alternatives

SHARC® DSP Family

The ADSP-21469KBCZ-4 belongs to Analog Devices' SHARC® (Super Harvard Architecture Single-Chip Computer) family, representing the pinnacle of floating-point DSP technology.

Base Part Number: ADSP-21469 (Multiple speed grades and package options available)

Alternative Products

  • ADSP-21489 (Higher performance variant)
  • ADSP-21479 (Lower power option)
  • ADSP-21369 (Cost-optimized solution)

Industry Classification

  • Category: Commercial/Industrial Grade
  • Application Class: High-Performance DSP
  • Market Segment: Professional Audio, Communications, Industrial

Technical Resources

Documentation

  • ADSP-21469 Hardware Reference Manual
  • SHARC Processor Programming Reference
  • Application Notes for Audio Processing
  • PCB Design Guidelines for BGA Packages
  • Power Management Application Guide

Development Tools

  • CrossCore Embedded Studio IDE
  • SHARC Audio Module Evaluation Board
  • VisualDSP++ Development Environment
  • Audio Processing Framework Libraries
  • Real-time Debugging Tools

Supply Chain & Market Information

Availability Status

Lifecycle Status: Active Production (Last Updated: 3 weeks ago)

Factory Lead Time: 16 weeks standard delivery

Packaging: Tray packaging for volume manufacturing

Market Update

Current market conditions show stable supply for the SHARC DSP family. The 16-week lead time reflects normal production scheduling. Analog Devices maintains active production status with no end-of-life announcements. Recommended to place orders with appropriate lead time planning for production schedules.

The three parts on the right have similar specifications to Analog Devices Inc. & ADSP-21469KBCZ-4.
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