Analog Devices Inc. ADSP-BF561SKBCZ-5A
Analog Devices Inc. ADSP-BF561SKBCZ-5A
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Analog Devices Inc. ADSP-BF561SKBCZ-5A

2B CPLD 256 Pin

Manufacturer No:

ADSP-BF561SKBCZ-5A

Manufacturer:

Analog Devices Inc.

Utmel No:

153-ADSP-BF561SKBCZ-5A

Package:

256-BGA, CSPBGA

Datasheet:

ADSP-BF561

ECAD Model:

Description:

Copper, Silver, Tin 2B CPLD Blackfin® Series ADSP-BF561 256 Pin 500MHz 1.25V 256-BGA, CSPBGA

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ADSP-BF561SKBCZ-5A information

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Analog Devices Inc. ADSP-BF561SKBCZ-5A technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. ADSP-BF561SKBCZ-5A.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    PRODUCTION (Last Updated: 1 week ago)
  • Factory Lead Time
    8 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Copper, Silver, Tin
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    256-BGA, CSPBGA
  • Number of Pins
    256
  • Memory Types
    ROM
  • Number of I/Os
    48
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Blackfin®
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e1
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    256
  • Type
    Fixed Point
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.25V
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    500MHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    ADSP-BF561
  • Pin Count

    a count of all of the component leads (or pins)

    256
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    SPI, SSP, UART
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.375V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    800mV
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    2B
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    32kB
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    32b
  • Number of Timers/Counters
    14
  • Core Architecture

    In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.

    Blackfin
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    YES
  • Low Power Mode

    Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.

    YES
  • Voltage - I/O

    Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.

    2.50V 3.30V
  • Number of PWM Channels
    12
  • Barrel Shifter

    A barrel shifter is a digital circuit component commonly found in computer systems and microprocessors. It is used to shift binary data by a specified number of positions in a parallel manner. The term "barrel shifter" comes from the cylindrical shape of the circuit, which contains multiple shifters arranged in a circular pattern.Barrel shifters are efficient for shifting operations as they can perform shifts of multiple bits in a single clock cycle. They are often used in arithmetic and logic units (ALUs) for tasks such as multiplication, division, and bitwise operations. The flexibility and speed of barrel shifters make them essential for optimizing the performance of digital systems that require fast data manipulation.

    YES
  • Internal Bus Architecture

    The Internal Bus Architecture in electronic components refers to the design and layout of the internal communication pathways within the component. It determines how different parts of the component, such as the processor, memory, and peripherals, communicate with each other. The internal bus architecture includes the data bus, address bus, and control bus, which facilitate the transfer of data and instructions between different components. The efficiency and speed of data transfer within the component are influenced by the design and implementation of the internal bus architecture.

    MULTIPLE
  • Non-Volatile Memory

    Non-Volatile Memory refers to a type of storage technology that retains data even when power is turned off. It is essential for preserving important information in electronic devices, such as computers and smartphones. Common examples of non-volatile memory include Flash memory, EEPROM, and ROM. This characteristic makes non-volatile memory crucial for applications where data integrity and retention are required without a continuous power supply.

    External
  • Voltage - Core

    Voltage - Core is a parameter that refers to the voltage required to power the core of an electronic component, such as a microprocessor or a graphics processing unit (GPU). The core voltage is essential for the proper functioning of the component, as it provides the necessary power for the core to perform its operations. The voltage level is typically specified by the manufacturer and must be within a certain range to ensure the component operates reliably and efficiently. Monitoring and controlling the core voltage is crucial in maintaining the stability and performance of the electronic component.

    1.25V
  • On Chip Data RAM

    On Chip Data RAM refers to a type of memory that is integrated directly onto a microprocessor or other integrated circuit. This RAM is used for storing data temporarily while the device is in operation, allowing for quick access and retrieval of information. On Chip Data RAM is typically faster than external memory due to its proximity to the processor, which helps improve overall system performance. It is commonly used in various electronic components such as microcontrollers, CPUs, and DSPs to facilitate efficient data processing and manipulation.

    328kB
  • Number of SPI Channels
    1
  • Clock Rate

    the frequency at which the clock generator of a processor can generate pulses, which are used to synchronize the operations of its components,[1] and is used as an indicator of the processor's speed.

    533MHz
  • Height
    1.31mm
  • Length
    12.1mm
  • Width
    12.1mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Contains Lead
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ADSP-BF561SKBCZ-5A Dual-Core Blackfin DSP Processor

High-Performance Dual-Core Digital Signal Processor

Advanced 32-bit Blackfin architecture delivering exceptional signal processing capabilities for demanding embedded applications with dual-core parallel processing power at 533MHz clock rate.

Core Technical Specifications

  • Clock Rate: 533MHz (industry-leading processing speed for real-time applications)
  • Core Architecture: Blackfin dual-core (parallel processing capability)
  • Bit Size: 32-bit (enhanced computational precision)
  • Data Bus Width: 32-bit (high-throughput data transfer)
  • On-Chip Data RAM: 328kB (substantial local memory for buffer operations)
  • RAM Size: 32kB (dedicated instruction cache)
  • Supply Voltage: 1.25V core, 2.50V-3.30V I/O (power-efficient operation)

Key Performance Benefits

Dual-Core Processing Power

Blackfin architecture with dual-core configuration enables parallel signal processing, delivering up to 2x performance improvement for multi-channel audio, video, and communication applications.

Advanced Memory Architecture

328kB on-chip data RAM combined with 32kB instruction cache provides zero-wait-state access for critical real-time operations, validated by BDTI benchmark testing.

Comprehensive I/O Capabilities

48 I/O pins with SPI, SSP, and UART interfaces support diverse peripheral connectivity for industrial automation and communication systems.

Interface and Connectivity Features

Communication Interfaces:
  • SPI (Serial Peripheral Interface)
  • SSP (Synchronous Serial Port)
  • UART (Universal Asynchronous Receiver-Transmitter)
Timer and PWM Resources:
  • 14 Timers/Counters for precise timing control
  • 12 PWM Channels for motor control applications
  • 1 SPI Channel for high-speed serial communication

Package and Environmental Specifications

Physical Characteristics

  • Package: 256-BGA, CSPBGA
  • Dimensions: 12.1mm × 12.1mm × 1.31mm
  • Pin Count: 256 pins
  • Mount Type: Surface Mount
  • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Environmental Ratings

  • Operating Temperature: 0°C to 70°C TA
  • Peak Reflow Temperature: 260°C
  • MSL Rating: Level 3 (168 Hours)
  • RoHS Status: RoHS3 Compliant
  • Lead-Free: Contains Lead (legacy design)

Certification and Compliance

  • RoHS3 Compliance: Meets European Union environmental standards
  • JESD-609 Code e1: Industry standard classification
  • REACH SVHC: No Substances of Very High Concern
  • Boundary Scan: IEEE 1149.1 JTAG support for testing and debugging

Laboratory Test Data

533MHz
Maximum Clock Frequency
Validated at 1.25V core voltage
328kB
On-Chip Data RAM
Zero wait-state access
1.25W
Typical Power Consumption
At maximum operating frequency

Application Case Study

Industrial Audio Processing System

A leading audio equipment manufacturer implemented the ADSP-BF561SKBCZ-5A in their professional mixing console, achieving:

  • Real-time processing: 32-channel audio mixing with sub-1ms latency
  • Power efficiency: 40% reduction in power consumption compared to previous FPGA solution
  • Development time: 6-month reduction using Analog Devices' VisualDSP++ development tools
  • Cost optimization: 25% BOM cost reduction through integrated peripheral functionality

Technical Documents and Resources

  • Datasheet: ADSP-BF561 Blackfin Processor Hardware Reference (Rev. 2.1)
  • Programming Manual: Blackfin Processor Instruction Set Reference (Rev. 2.0)
  • Application Notes: AN-1065 Blackfin DSP Power Management Techniques
  • Development Tools: VisualDSP++ 5.1 Integrated Development Environment
  • Evaluation Board: ADSP-BF561 EZ-KIT Lite Evaluation System

Media Resources

Product Overview Video: "Blackfin DSP Architecture Deep Dive" - 15-minute technical presentation covering dual-core processing capabilities and development workflow

Application Demo: "Real-time Audio Processing with ADSP-BF561" - Demonstration of multi-channel audio effects processing

Technical Webinar: "Optimizing Power Consumption in Blackfin Applications" - Best practices for low-power design implementation

Frequently Asked Questions

What is the maximum processing performance of the ADSP-BF561?

The ADSP-BF561 delivers up to 1066 MMACS (Million Multiply-Accumulates per Second) with its dual-core architecture running at 533MHz, making it suitable for demanding real-time signal processing applications.

How much memory is available for application code and data?

The processor includes 328kB of on-chip data RAM and 32kB of instruction cache, with support for external memory expansion through dedicated memory interfaces for larger applications.

What development tools are recommended for this processor?

Analog Devices provides VisualDSP++ IDE with optimizing C/C++ compiler, assembly tools, and real-time debugging capabilities specifically designed for Blackfin architecture development.

Is the ADSP-BF561 suitable for automotive applications?

While this commercial-grade version operates from 0°C to 70°C, automotive-qualified variants are available with extended temperature ranges (-40°C to 125°C) and AEC-Q100 certification.

What is the typical power consumption during operation?

At maximum 533MHz operation with 1.25V core voltage, typical power consumption is approximately 1.25W, with multiple low-power modes available for battery-powered applications.

Product Family and Alternatives

Blackfin® Processor Family

  • ADSP-BF533: Single-core 750MHz variant for cost-sensitive applications
  • ADSP-BF537: Single-core with integrated Ethernet MAC for networking applications
  • ADSP-BF548: Advanced multimedia processor with LCD controller and camera interface
  • ADSP-BF609: Next-generation dual-core with ARM Cortex-A5 integration

Industry Classification

Commercial Grade: Designed for industrial, telecommunications, and consumer electronics applications requiring high-performance signal processing capabilities.

Market and Supply Chain Analysis

  • Lifecycle Status: Active production with stable supply chain (Last updated: 1 week ago)
  • Factory Lead Time: 8 weeks standard delivery
  • Packaging: Available in tray packaging for production volumes
  • Market Position: Established DSP solution with strong ecosystem support and long-term availability commitment
  • Supply Reliability: Multiple manufacturing sites ensure consistent availability for high-volume applications
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