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having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

The parameter "Data Transfer Rate-Max" in electronic components refers to the maximum rate at which data can be transferred between different devices or components within a system. It is typically measured in bits per second (bps) or bytes per second (Bps) and indicates the peak speed at which data can be transmitted. This parameter is crucial for determining the overall performance and efficiency of a system, especially in applications where high-speed data transfer is essential, such as in networking equipment, storage devices, and communication systems. Manufacturers often specify the Data Transfer Rate-Max to help users understand the capabilities and limitations of the component when it comes to transferring data quickly and reliably.

The parameter "Host Data Transfer Rate-Max" refers to the maximum speed at which data can be transferred between a host system, typically a computer or server, and an electronic component, such as a storage device or network interface. This rate is usually measured in bits per second (bps) or bytes per second (Bps) and indicates the capability of the interface to handle data transfers efficiently. A higher data transfer rate allows for faster reading and writing of data, improving overall system performance and responsiveness.

The "Host Interface Standard" in electronic components refers to the specific protocol or set of rules that govern the communication between the component and the host device it is connected to. This standard defines how data is exchanged, commands are interpreted, and signals are transmitted between the two entities. Different types of electronic components, such as sensors, displays, or memory modules, may have different host interface standards depending on their intended use and compatibility requirements. Adhering to a common host interface standard ensures seamless interoperability and communication between various components and host devices in a system.