

Cypress CY7C425-20VC
Memory IC 55 mA mA Memory IC
Manufacturer No:
CY7C425-20VC
Tiny WHSLManufacturer:
Utmel No:
603-CY7C425-20VC
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Description:
5 V V Surface Mount 28 Pin Memory IC 9 kb kb 17.907 mm mm 55 mA mA 9 b b
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- TypeParameter
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Pins28
- Number of Terminals28
- RoHSY
- Schedule B8542320070
- Package Description0.300 INCH, SOJ-28
- Package StyleSMALL OUTLINE
- Moisture Sensitivity Levels1
- Number of Words Code1000
- Package Body MaterialPLASTIC/EPOXY
- Package Equivalence CodeSOJ28,.34
- Reflow Temperature-Max (s)NOT SPECIFIED
- Access Time-Max20 ns
- Operating Temperature-Max70 °C
- Rohs CodeNo
- Manufacturer Part NumberCY7C425-20VC
- Clock Frequency-Max (fCLK)33.33 MHz
- Number of Words1024 words
- Supply Voltage-Nom (Vsup)5 V
- Package CodeSOJ
- Package ShapeRECTANGULAR
- ManufacturerCypress Semiconductor
- Part Life Cycle CodeObsolete
- Ihs ManufacturerCYPRESS SEMICONDUCTOR CORP
- Risk Rank8.63
- Part Package CodeSOJ
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel, Tray Package - Size / Dimension
In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.
0.11in (2.8mm) L x 0.11in (2.8mm) W x 0.103in (2.6mm) H - Tolerance
In electronic components, "tolerance" refers to the acceptable deviation or variation from the specified or ideal value of a particular parameter, such as resistance, capacitance, or voltage. It indicates the range within which the actual value of the component can fluctuate while still being considered acceptable for use in a circuit. Tolerance is typically expressed as a percentage or a specific value and is important for ensuring the accuracy and reliability of electronic devices. Components with tighter tolerances are more precise but may also be more expensive. It is crucial to consider tolerance when selecting components to ensure proper functionality and performance of the circuit.
±0.05pF - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e0 - ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
TIN LEAD - Max Operating Temperature
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
70 °C - Min Operating Temperature
The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.
0 °C - Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
RETRANSMIT - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8542.32.00.71 - Capacitance
Capacitance is a fundamental electrical property of electronic components that describes their ability to store electrical energy in the form of an electric field. It is measured in farads (F) and represents the ratio of the amount of electric charge stored on a component to the voltage across it. Capacitors are passive components that exhibit capacitance and are commonly used in electronic circuits for various purposes such as filtering, energy storage, timing, and coupling. Capacitance plays a crucial role in determining the behavior and performance of electronic systems by influencing factors like signal propagation, frequency response, and power consumption.
620pF - SubcategoryFIFOs
- Technology
In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.
CMOS - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
J BEND - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
220 - Number of Functions1
- Terminal Pitch
The center distance from one pole to the next.
1.27 mm - Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
not_compliant - Pin Count
a count of all of the component leads (or pins)
28 - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
R-PDSO-J28 - Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Operating Supply Voltage
The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.
5 V - Supply Voltage-Max (Vsup)
The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.
5.5 V - Power Supplies
an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?
5 V - Temperature Grade
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
COMMERCIAL - Supply Voltage-Min (Vsup)
The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.
4.5 V - Voltage
Voltage is a measure of the electric potential difference between two points in an electrical circuit. It is typically represented by the symbol "V" and is measured in volts. Voltage is a crucial parameter in electronic components as it determines the flow of electric current through a circuit. It is responsible for driving the movement of electrons from one point to another, providing the energy needed for electronic devices to function properly. In summary, voltage is a fundamental concept in electronics that plays a key role in the operation and performance of electronic components.
50V - Max Supply Voltage
In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.
5.5 V - Min Supply Voltage
The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.
4.5 V - Element Configuration
The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.
Dual - Nominal Supply Current
Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.
55 mA - Operating Mode
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
ASYNCHRONOUS - Supply Current-Max
Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.
0.055 mA - Access Time
Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.
20 ns - Data Bus Width
The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.
9 b - Direction
In electronic components, the parameter "Direction" refers to the orientation or alignment in which the component is designed to operate effectively. This parameter is particularly important for components such as diodes, transistors, and capacitors, which have specific polarity or orientation requirements for proper functionality. For example, diodes allow current flow in one direction only, so their direction parameter indicates the correct orientation for current flow. Similarly, polarized capacitors have a positive and negative terminal, requiring proper alignment for correct operation. Understanding and adhering to the direction parameter is crucial for ensuring the reliable and efficient performance of electronic components in a circuit.
Unidirectional - Organization
In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.
1KX9 - Output Characteristics
Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.
3-STATE - Seated Height-Max
Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.
3.556 mm - Memory Width
Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.
9 - Density
In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.
9 kb - Standby Current-Max
Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.
0.005 A - Memory Density
Memory density in electronic components refers to the amount of data that can be stored in a given physical space or memory module. It is typically measured in bits or bytes per unit area, such as bits per square inch. Higher memory density means that more data can be stored in a smaller space, which is important for devices with limited physical size or power constraints. Memory density is a key factor in determining the capacity and performance of memory devices, such as RAM, ROM, and flash memory, and is a critical consideration in the design and manufacturing of electronic products.
9216 bit - Parallel/Serial
The parameter "Parallel/Serial" in electronic components refers to the method of data transmission or communication within the component. In parallel communication, multiple bits of data are transmitted simultaneously over multiple channels or wires. This allows for faster data transfer rates but requires more physical connections and can be more susceptible to signal interference.On the other hand, in serial communication, data is transmitted sequentially over a single channel or wire. While serial communication may have slower data transfer rates compared to parallel communication, it is more cost-effective, requires fewer connections, and is less prone to signal interference.The choice between parallel and serial communication depends on the specific requirements of the electronic component and the overall system design, balancing factors such as speed, cost, complexity, and reliability.
PARALLEL - Sync/Async
In the context of electronic components, the parameter "Sync/Async" refers to the synchronization mode of operation. Synchronous operation means that the component operates in coordination with an external clock signal. This ensures that data is transmitted or processed at specific intervals determined by the clock signal, allowing for precise timing and coordination between different components in a system.Asynchronous operation, on the other hand, means that the component does not rely on an external clock signal for its operation. Instead, it processes data at its own pace, which can lead to more flexibility but may also result in timing issues if not properly managed.The choice between synchronous and asynchronous operation depends on the specific requirements of the system and the desired level of coordination and timing precision.
Asynchronous - Word Size
Word "size" refers to the amount of data a CPU's internal data registers can hold and process at one time.
9 b - Memory IC Type
Memory IC Type refers to the specific type of integrated circuit (IC) used for storing data in electronic devices. Memory ICs are essential components in computers, smartphones, and other digital devices, as they provide temporary or permanent storage for data and instructions. Common types of memory ICs include dynamic random-access memory (DRAM), static random-access memory (SRAM), flash memory, and electrically erasable programmable read-only memory (EEPROM). Each type of memory IC has unique characteristics in terms of speed, capacity, power consumption, and data retention, making it suitable for different applications. Understanding the memory IC type is crucial for designing and selecting the appropriate memory solution for a specific electronic device or system.
OTHER FIFO - Bus Directional
Bus Directional is a parameter in electronic components that refers to the ability of a bus to transmit data bidirectionally, meaning it can send and receive data signals. In a bus system, multiple devices are connected to a common communication line, and the bus directional feature allows for efficient data transfer between these devices. This parameter is important for ensuring smooth and reliable communication within a system, as it enables devices to both send and receive data over the same bus line. Having a bus directional capability helps in simplifying the design of electronic systems and facilitates seamless data exchange between connected devices.
Unidirectional - Output Enable
Output Enable is a parameter in electronic components that refers to a control signal used to enable or disable the output of the component. When the Output Enable signal is active, the component will allow the output to function and provide the desired functionality. Conversely, when the Output Enable signal is inactive, the output will be disabled, preventing any signals or data from passing through the component. This feature is commonly used in integrated circuits, such as multiplexers, buffers, and memory devices, to control the flow of data and manage power consumption. By utilizing the Output Enable parameter, designers can effectively manage the operation of electronic components in a system.
NO - Cycle Time
Cycle time in electronic components refers to the duration it takes for a circuit or system to complete one full cycle of operation. It encompasses the time needed to perform a series of tasks, such as processing, data transfer, or signal propagation. Shorter cycle times lead to increased throughput and improved performance in digital systems, while longer cycle times may result in delays and reduced efficiency. Cycle time is a critical parameter in the design and evaluation of various electronic devices and systems, influencing their speed and responsiveness.
30 ns - Width7.5057 mm
- Length17.907 mm
- Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
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