Cypress Semiconductor Corp CY62256NLL-70PXC
Cypress Semiconductor Corp CY62256NLL-70PXC
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Cypress Semiconductor Corp CY62256NLL-70PXC

Memory IC MoBL® 1MHz MHz 50mA mA Memory IC

Manufacturer No:

CY62256NLL-70PXC

Utmel No:

603-CY62256NLL-70PXC

Package:

28-DIP (0.600, 15.24mm)

Datasheet:

CY62256N

ECAD Model:

Description:

5V V Through Hole MoBL® 28 Pin Memory IC MoBL® Series CY62256 256 kb kb 37.59mm mm 50mA mA 8b b

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In Stock : 6

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CY62256NLL-70PXC information

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Cypress Semiconductor Corp CY62256NLL-70PXC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CY62256NLL-70PXC.
  • Type
    Parameter
  • Factory Lead Time
    11 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    28-DIP (0.600, 15.24mm)
  • Number of Pins
    28
  • Memory Types
    Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    MoBL®
  • Published
    2002
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    28
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    4.5V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    1MHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    CY62256
  • Pin Count

    a count of all of the component leads (or pins)

    28
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    5V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256Kb 32K x 8
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    50mA
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    SRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    32KX8
  • Output Characteristics

    Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

    3-STATE
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    70ns
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    15b
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    256 kb
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.000005A
  • Access Time (Max)

    Access Time (Max) is a parameter in electronic components, particularly in memory devices such as RAM (Random Access Memory) and storage devices like hard drives and SSDs (Solid State Drives). It refers to the maximum amount of time it takes for the component to retrieve data after receiving a request. In simpler terms, it measures the speed at which data can be accessed from the component. A lower access time indicates faster performance, as the component can quickly retrieve and deliver data to the system. Manufacturers often specify the maximum access time in the component's datasheet to help users understand its performance capabilities.

    70 ns
  • I/O Type

    "I/O Type" in electronic components refers to the type of input/output interface that the component uses to communicate with other devices or systems. This parameter specifies whether the component uses analog or digital signals for input and output operations. Analog signals are continuous and can have an infinite number of values, while digital signals are discrete and have only two possible values (0 or 1).Understanding the I/O Type of an electronic component is crucial for ensuring compatibility and proper communication with other components in a circuit or system. It helps determine the type of signals that the component can send and receive, as well as the protocols and standards that need to be followed for successful data exchange.In summary, the I/O Type parameter of electronic components defines the nature of the signals used for input and output operations, whether they are analog or digital, and plays a key role in establishing seamless communication within electronic systems.

    COMMON
  • Sync/Async

    In the context of electronic components, the parameter "Sync/Async" refers to the synchronization mode of operation. Synchronous operation means that the component operates in coordination with an external clock signal. This ensures that data is transmitted or processed at specific intervals determined by the clock signal, allowing for precise timing and coordination between different components in a system.Asynchronous operation, on the other hand, means that the component does not rely on an external clock signal for its operation. Instead, it processes data at its own pace, which can lead to more flexibility but may also result in timing issues if not properly managed.The choice between synchronous and asynchronous operation depends on the specific requirements of the system and the desired level of coordination and timing precision.

    Asynchronous
  • Word Size

    Word "size" refers to the amount of data a CPU's internal data registers can hold and process at one time.

    8b
  • Standby Voltage-Min

    Standby Voltage-Min is a parameter in electronic components that refers to the minimum voltage required to maintain the standby mode of operation. Standby mode is a low-power state in which the device is still operational but consumes significantly less power compared to its active mode. The Standby Voltage-Min specification ensures that the component remains in standby mode and is ready to quickly transition to full operation when needed. It is important for ensuring energy efficiency and prolonging the battery life of devices that utilize standby modes.

    2V
  • Height
    5.08mm
  • Length
    37.59mm
  • Width
    13.97mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Product Description:

The CY62256NLL-70PXC is a 256Kb (32K x 8) synchronous static random access memory (SRAM) device from Cypress Semiconductor Corp. This IC is designed for high-performance applications requiring fast access times and low power consumption. With a maximum access time of 70ns, this device is ideal for use in embedded systems, industrial control systems, and other applications where fast data retrieval is crucial.

Features:

  • 256Kb (32K x 8) synchronous static random access memory (SRAM) device
  • Maximum access time of 70ns
  • 15-bit address bus width
  • 5V operating supply voltage
  • 50mA nominal supply current
  • 0°C to 70°C operating temperature range
  • 28-pin DIP package with nickel/palladium/gold (Ni/Pd/Au) terminal finish
  • Lead-free and RoHS3 compliant
  • Synchronous interface with asynchronous read and write operations

Applications:

  • Embedded systems
  • Industrial control systems
  • Automotive systems
  • Medical devices
  • Aerospace systems

Alternative Parts:

  • CY62256NLL-70PXC is an obsolete part, and alternative parts may be available. Please contact Cypress Semiconductor Corp. or a authorized distributor for more information.

Embedded Modules:

  • This device is commonly used in the following embedded modules:
    • Cypress Semiconductor Corp. PSoC 1 and PSoC 3 microcontrollers
    • Other Cypress Semiconductor Corp. microcontrollers and SoCs

Frequently Asked Questions (FAQs):

Q: What is the maximum access time of the CY62256NLL-70PXC? A: The maximum access time is 70ns.

Q: What is the operating supply voltage of the CY62256NLL-70PXC? A: The operating supply voltage is 5V.

Q: What is the nominal supply current of the CY62256NLL-70PXC? A: The nominal supply current is 50mA.

Q: What is the operating temperature range of the CY62256NLL-70PXC? A: The operating temperature range is 0°C to 70°C.

Q: Is the CY62256NLL-70PXC lead-free and RoHS3 compliant? A: Yes, the CY62256NLL-70PXC is lead-free and RoHS3 compliant.

Q: What is the package type of the CY62256NLL-70PXC? A: The package type is 28-pin DIP with nickel/palladium/gold (Ni/Pd/Au) terminal finish.

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