Diodes Incorporated 74AUP2G06FW3-7
Diodes Incorporated 74AUP2G06FW3-7
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Diodes Incorporated 74AUP2G06FW3-7

Gates & Inverters 280μm mm Gates & Inverters

Manufacturer No:

74AUP2G06FW3-7

Manufacturer:

Diodes Incorporated

Utmel No:

671-74AUP2G06FW3-7

Package:

6-XFDFN

Datasheet:

74AUP2G06

ECAD Model:

Description:

10.6 ns ns 19.8 ns ns 900μm mm Gates & Inverters 280μm mm Surface Mount Surface Mount 0.8V~3.6V V 500nA μA

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Unit Price: $0.148565

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74AUP2G06FW3-7 information

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Product Details
Product Comparison
Diodes Incorporated 74AUP2G06FW3-7 technical specifications, attributes, parameters and parts with similar specifications to Diodes Incorporated 74AUP2G06FW3-7.
  • Type
    Parameter
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    6-XFDFN
  • Number of Pins
    6
  • Logic Level-High
    1.6V ~ 2V
  • Logic Level-Low
    0.7V ~ 0.9V
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    74AUP
  • Published
    2014
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Discontinued
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    6
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.8V~3.6V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    2
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.3mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    0.8V
  • Number of Circuits
    2
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    10.6 ns
  • Quiescent Current

    The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.

    500nA
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    19.8 ns
  • Family

    In electronic components, the parameter "Family" typically refers to a categorization or classification system used to group similar components together based on their characteristics, functions, or applications. This classification helps users easily identify and select components that meet their specific requirements. The "Family" parameter can include various subcategories such as resistors, capacitors, diodes, transistors, integrated circuits, and more. Understanding the "Family" of an electronic component can provide valuable information about its compatibility, performance specifications, and potential uses within a circuit or system. It is important to consider the "Family" parameter when designing or troubleshooting electronic circuits to ensure proper functionality and compatibility with other components.

    AUP/ULP/V
  • Logic Function

    In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

    Inverter, Schmitt Trigger
  • Logic Type

    Logic Type in electronic components refers to the classification of circuits based on the logical operations they perform. It includes types such as AND, OR, NOT, NAND, NOR, XOR, and XNOR, each defining the relationship between binary inputs and outputs. The logic type determines how the inputs affect the output state based on specific rules of Boolean algebra. This classification is crucial for designing digital circuits and systems, enabling engineers to select appropriate components for desired functionalities.

    Inverter
  • Max Propagation Delay @ V, Max CL

    The parameter "Max Propagation Delay @ V, Max CL" in electronic components refers to the maximum amount of time it takes for a signal to propagate through the component from input to output when operating at a specific voltage (V) and driving a maximum specified load capacitance (CL). This parameter is crucial in determining the speed and performance of the component in a circuit. A shorter propagation delay indicates faster signal processing and better overall performance. Designers use this parameter to ensure that signals can be transmitted and received within the required timing constraints in their electronic systems.

    10.6ns @ 3.3V, 30pF
  • Schmitt Trigger Input

    The Schmitt Trigger is a logic input type that provides hysteresis or two different threshold voltage levels for rising and falling edge.

    No
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Open Drain
  • Height
    280μm
  • Length
    900μm
  • Width
    1mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Diodes Incorporated 74AUP2G06FW3-7.

Product Description

Description

The 74AUP2G06FW3-7 is a surface-mount, low-power logic inverter IC from Diodes Incorporated. This IC belongs to the AUP/ULP/V family and is designed to operate within a wide range of supply voltages, making it suitable for various low-power applications. The device features an open-drain configuration and is packaged in a compact 6-XFDFN package, ensuring efficient use of space in modern electronic designs.

Features

  • Open Drain Configuration: The IC features an open-drain configuration, which allows for flexible circuit design and reduced power consumption.
  • Low Power Consumption: With a quiescent current of 500nA, this IC is optimized for low-power applications.
  • High Temperature Range: The operating temperature range of -40°C to 125°C makes it suitable for use in a variety of environments.
  • Compact Package: The 6-XFDFN package ensures minimal footprint, ideal for space-constrained designs.
  • ROHS3 Compliant: The IC complies with ROHS3 standards, ensuring environmental sustainability.

Applications

  1. Primary Applications
  2. Logic Circuits: The primary application of this IC is in logic circuits where an inverter function is required. It can be used as a standalone inverter or as part of more complex logic circuits.
  3. Low-Power Systems: Due to its low power consumption, it is ideal for battery-powered devices or systems where power efficiency is crucial.

  4. Secondary Applications

  5. Digital Signal Processing: The IC can be used in digital signal processing applications where precise inversion of signals is necessary.
  6. Embedded Systems: Its compact size and low power consumption make it suitable for use in embedded systems where space and energy efficiency are critical.

Alternative Parts

While the 74AUP2G06FW3-7 is a discontinued part, alternative parts from Diodes Incorporated that can be considered include: - 74AUP2G06FW3-7 Replacement: For similar functionality and compatibility, consider using other low-power inverters from Diodes Incorporated such as the 74AUP2G06.

Embedded Modules

This component is commonly used in various embedded modules including: - Microcontroller Boards: It can be integrated into microcontroller boards like Arduino or Raspberry Pi for adding logic functionality. - System-on-Chip (SoC) Designs: The compact size and low power consumption make it suitable for inclusion in SoC designs where space and energy efficiency are paramount.

Conclusion

The 74AUP2G06FW3-7 is a reliable and efficient logic inverter IC designed for low-power applications. Although it has been discontinued, its features and specifications make it an excellent choice for various embedded systems and digital logic circuits. When selecting an alternative part, consider other low-power inverters from Diodes Incorporated for compatibility and functionality.

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