Diodes Incorporated AP21410FM-7
Diodes Incorporated AP21410FM-7
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Diodes Incorporated AP21410FM-7

PMIC P-Channel Tin Power Switches IC

Manufacturer No:

AP21410FM-7

Manufacturer:

Diodes Incorporated

Utmel No:

671-AP21410FM-7

Package:

6-UFDFN Exposed Pad

Usage Grade:

  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
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  • Aerospace
  • Industrial
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  • Automotive
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  • Aerospace
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  • Automotive
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  • Aerospace
  • Industrial
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  • Automotive
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  • Automotive
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  • Automotive
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  • Aerospace
  • Industrial
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  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
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  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
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  • Automotive
  • Military
  • Aerospace
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  • Automotive
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  • Industrial
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  • Industrial
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  • Industrial
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  • Automotive
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  • Industrial
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  • Automotive
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  • Industrial
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  • Industrial
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  • Industrial
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  • Industrial
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  • Industrial
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  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
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  • Aerospace
  • Industrial
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  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
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  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive

ECAD Model:

Description:

P-Channel Tin PMIC 6-UFDFN Exposed Pad

Quantity:

Unit Price: $0.163470

Ext Price: $0.16

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

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In Stock : 1904

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $0.163470

    $0.16

  • 10

    $0.154217

    $1.54

  • 100

    $0.145488

    $14.55

  • 500

    $0.137253

    $68.63

  • 1000

    $0.129484

    $129.48

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  • Vacuum packagingStep2:Vacuum packaging
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AP21410FM-7 information

Specifications
Documents & Media
Product Details
Diodes Incorporated AP21410FM-7 technical specifications, attributes, parameters and parts with similar specifications to Diodes Incorporated AP21410FM-7.
  • Type
    Parameter
  • Factory Lead Time
    18 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    6-UFDFN Exposed Pad
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2015
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    6
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Number of Functions
    1
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    X-PDSO-N6
  • Number of Outputs
    1
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    P-Channel
  • Max Output Current

    The maximum current that can be supplied to the load.

    200mA
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    5.5V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    2.7V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    On/Off
  • Output Configuration

    Output Configuration in electronic components refers to the arrangement or setup of the output pins or terminals of a device. It defines how the output signals are structured and how they interact with external circuits or devices. The output configuration can determine the functionality and compatibility of the component in a circuit design. Common types of output configurations include single-ended, differential, open-drain, and push-pull configurations, each serving different purposes and applications in electronic systems. Understanding the output configuration of a component is crucial for proper integration and operation within a circuit.

    High Side
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    Not Required
  • Switch Type

    Based on their characteristics, there are basically three types of switches: Linear switches, tactile switches and clicky switches.

    USB Switch
  • Ratio - Input:Output

    The parameter "Ratio - Input:Output" in electronic components refers to the relationship between the input and output quantities of a device or system. It is a measure of how the input signal or energy is transformed or converted into the output signal or energy. This ratio is often expressed as a numerical value or percentage, indicating the efficiency or effectiveness of the component in converting the input to the desired output. A higher ratio typically signifies better performance or higher efficiency, while a lower ratio may indicate losses or inefficiencies in the conversion process. Understanding and optimizing the input-output ratio is crucial in designing and evaluating electronic components for various applications.

    1:1
  • Voltage - Load

    Voltage - Load refers to the voltage across a load component in an electronic circuit when it is connected and operational. It represents the electrical potential difference that drives current through the load, which can be a resistor, motor, or other devices that consume electrical power. The voltage - load relationship is crucial for determining how much power the load will utilize and how it will affect the overall circuit performance. Properly managing voltage - load is essential for ensuring devices operate efficiently and safely within their specified limits.

    2.7V~5.5V
  • Fault Protection

    Protection against electric shock under. single fault conditions.

    Current Limiting (Fixed), Over Temperature, Reverse Current, UVLO
  • Output Peak Current Limit-Nom

    Output Peak Current Limit-Nom is a parameter in electronic components that specifies the maximum current that can be delivered by the output under normal operating conditions. This limit is typically set to protect the component from damage due to excessive current flow. It ensures that the component operates within its safe operating limits and prevents overheating or other potential issues. Designers and engineers use this parameter to ensure proper functioning and reliability of the electronic system in which the component is used.

    0.2A
  • Rds On (Typ)

    The parameter "Rds On (Typ)" in electronic components refers to the typical on-state resistance of a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) when it is fully conducting. This parameter indicates the resistance encountered by the current flowing through the MOSFET when it is in the on-state, which affects the power dissipation and efficiency of the component. A lower Rds On value indicates better conduction and lower power loss in the MOSFET. Designers often consider this parameter when selecting components for applications where minimizing power loss and maximizing efficiency are critical factors.

    95m Ω
  • Built-in Protections

    Built-in protections in electronic components refer to the safety features and mechanisms that are integrated into the component to prevent damage or malfunction in various situations. These protections are designed to safeguard the component from overvoltage, overcurrent, overheating, short circuits, and other potential hazards that could occur during operation. By having built-in protections, electronic components can operate more reliably and safely, extending their lifespan and reducing the risk of failure. These protections are essential for ensuring the overall performance and longevity of electronic devices and systems.

    OVER CURRENT; THERMAL; UNDER VOLTAGE
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Diodes Incorporated AP21410FM-7.

AP21410FM-7 Overview

As a result, it is packaged in the form of a Tape & Reel (TR).This package is included in 6-UFDFN Exposed Pad.Mounting type Surface Mount is selected for the LED driving board.A USB Switch switch type is owned by it.In order to guarantee reliable performance, the temperature should be set to -40°C~85°C TA.The LED driver is equipped with 1 outputs.In order to operate, it requires a voltage supply of Not Required.A maximum output voltage of P-Channel volts can be achieved by this LED driver.A total of 6 terminations have been recorded.Currently, the lighting driver has a total of 1 functions.This operation requires the maximum output current to be decreased to 200mA.Surface Mount is mounted in the way.In this LED driver, the maximum supply voltage is configured to be 5.5V (Vsup).For normal operation, the supply voltage (Vsup) should be kept above 2.7V.

AP21410FM-7 Features


AP21410FM-7 Applications

There are a lot of Diodes Incorporated
AP21410FM-7 Power Switches ICs applications.


  • PC Card Hot Swap
  • Storage Drives
  • Portable/Handheld Devices
  • Wireless/Networking Cards
  • Low Voltage I/O System Power
  • Hard Disk Drives
  • Solid-State Drives
  • Hot Swap
  • HDD and SSD
  • Hot Swap