Diodes Incorporated AP9101CAK-BHTRG1
Diodes Incorporated AP9101CAK-BHTRG1
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Diodes Incorporated AP9101CAK-BHTRG1

Manufacturer No:

AP9101CAK-BHTRG1

Manufacturer:

Diodes Incorporated

Utmel No:

671-AP9101CAK-BHTRG1

Package:

SC-74A, SOT-753

Datasheet:

AP9101C

ECAD Model:

Description:

MULTICELL BATT MANAGER SOT25

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The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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AP9101CAK-BHTRG1 information

Specifications
Documents & Media
Product Details
Diodes Incorporated AP9101CAK-BHTRG1 technical specifications, attributes, parameters and parts with similar specifications to Diodes Incorporated AP9101CAK-BHTRG1.
  • Type
    Parameter
  • Factory Lead Time
    23 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    SC-74A, SOT-753
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Function

    The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.

    Battery Protection
  • Analog IC - Other Type

    Analog IC - Other Type is a parameter used to categorize electronic components that are integrated circuits (ICs) designed for analog signal processing but do not fall into more specific subcategories such as amplifiers, comparators, or voltage regulators. These ICs may include specialized analog functions such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), voltage references, or signal conditioning circuits. They are typically used in various applications where precise analog signal processing is required, such as in audio equipment, instrumentation, communication systems, and industrial control systems. Manufacturers provide detailed specifications for these components to help engineers select the most suitable IC for their specific design requirements.

    POWER SUPPLY SUPPORT CIRCUIT
  • Fault Protection

    Protection against electric shock under. single fault conditions.

    Over Current, Over Voltage
  • Battery Chemistry

    A battery is a device that stores chemical energy, and converts it to electricity. This is known as electrochemistry and the system that underpins a battery is called an electrochemical cell. A battery can be made up of one or several (like in Volta's original pile) electrochemical cells.

    Lithium Ion/Polymer
  • Number of Cells
    1
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Diodes Incorporated AP9101CAK-BHTRG1.

AP9101CAK-BHTRG1 Overview

It belongs to package SC-74A, SOT-753. This system battery uses an analog integrated circuit (IC) called POWER SUPPLY SUPPORT CIRCUIT. There is a Tape & Reel (TR) case packaging. There is a space in between this electrical part and Surface Mount. There is a possibility of delivering functions Battery Protection. To best deliver its performance, the electronic part should be operated at a temperature of -40°C~85°C TA. In this electrical part, the battery chemistry includes Lithium Ion/Polymer.

AP9101CAK-BHTRG1 Features

Available in SC-74A, SOT-753 Package
Mounting Type: Surface Mount
Battery Chemistry : Lithium Ion/Polymer

AP9101CAK-BHTRG1 Applications

There are a lot of Diodes Incorporated
AP9101CAK-BHTRG1 Battery Management ICs applications.


  • Cell phone towers
  • A/C power substations
  • Internet infrastructure equipment
  • Aviation ground support systems
  • Tower communications
  • Weather stations
  • Distributed energy resources
  • Solar and wind-generating plants
  • Electric street sweepers
  • Shuttle robots