Diodes Incorporated PI3A412ZHEX
Diodes Incorporated PI3A412ZHEX
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Diodes Incorporated PI3A412ZHEX

Multiplexers ICs 3.3V SPDT 13ns, 38ns Analog Switches

Manufacturer No:

PI3A412ZHEX

Manufacturer:

Diodes Incorporated

Utmel No:

671-PI3A412ZHEX

Package:

16-WFQFN Exposed Pad

Datasheet:

PI3A412

ECAD Model:

Description:

13ns, 38ns SPDT 750mOhm QUAD Analog Switches BREAK-BEFORE-MAKE PI3A412 3.3V 16-WFQFN Exposed Pad

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In Stock : 21000

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PI3A412ZHEX information

Specifications
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Product Details
Diodes Incorporated PI3A412ZHEX technical specifications, attributes, parameters and parts with similar specifications to Diodes Incorporated PI3A412ZHEX.
  • Type
    Parameter
  • Factory Lead Time
    18 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    16-WFQFN Exposed Pad
  • Number of Pins
    16
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    12 ns
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    16
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Resistance

    Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

    750mOhm
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    MATTE TIN
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    500mW
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    4
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    PI3A412
  • Output

    In electronic components, the parameter "Output" typically refers to the signal or data that is produced by the component and sent to another part of the circuit or system. The output can be in the form of voltage, current, frequency, or any other measurable quantity depending on the specific component. The output of a component is often crucial in determining its functionality and how it interacts with other components in the circuit. Understanding the output characteristics of electronic components is essential for designing and troubleshooting electronic circuits effectively.

    SEPARATE OUTPUT
  • Number of Channels
    1
  • Number of Circuits
    4
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    4.2V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.8V
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    1μA
  • Max Supply Current

    Max Supply Current refers to the maximum amount of electrical current that a component can draw from its power supply under normal operating conditions. It is a critical parameter that ensures the component operates reliably without exceeding its thermal limits or damaging internal circuitry. Exceeding this current can lead to overheating, performance degradation, or failure of the component. Understanding this parameter is essential for designing circuits that provide adequate power while avoiding overload situations.

    1.5μA
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    20 ns
  • Supply Type

    Supply Type in electronic components refers to the classification of power sources used to operate the component. It indicates whether the component requires DC or AC power, and if DC, specifies the voltage levels such as low, medium, or high. Different supply types can affect the performance, compatibility, and application of the component in electronic circuits. Understanding the supply type is crucial for proper component selection and integration into electronic designs.

    Single
  • -3db Bandwidth

    The "-3dB bandwidth" of an electronic component refers to the frequency range over which the component's output signal power is reduced by 3 decibels (dB) compared to its maximum output power. This parameter is commonly used to describe the frequency response of components such as amplifiers, filters, and other signal processing devices. The -3dB point is significant because it represents the half-power point, where the output signal power is reduced to half of its maximum value. Understanding the -3dB bandwidth is important for designing and analyzing electronic circuits to ensure that signals are accurately processed within the desired frequency range.

    78MHz
  • On-State Resistance (Max)

    The "On-State Resistance (Max)" parameter in electronic components refers to the maximum resistance exhibited by the component when it is in the fully conducting state. This resistance is typically measured when the component is carrying the maximum specified current. A lower on-state resistance indicates better conductivity and efficiency of the component when it is in the on-state. It is an important parameter to consider when selecting components for applications where low power dissipation and high efficiency are critical factors.

    750mOhm
  • Multiplexer/Demultiplexer Circuit

    A Multiplexer/Demultiplexer Circuit is an electronic component used in digital circuits to select one of several input signals and route it to a single output. A multiplexer, also known as a "mux," is used to combine multiple input signals into a single output, while a demultiplexer, also known as a "demux," is used to take a single input and route it to one of several possible outputs. These circuits are commonly used in data transmission, communication systems, and digital signal processing applications to efficiently manage and control the flow of data. Multiplexers and demultiplexers play a crucial role in optimizing the use of resources and improving the overall performance of electronic systems.

    2:1
  • Off-state Isolation-Nom

    Off-state Isolation-Nom is a parameter used to measure the level of isolation between two electronic components or circuits when one of them is in the off state. It indicates the ability of the component to prevent unwanted signals or interference from passing through when it is not actively conducting. The parameter is typically expressed in decibels (dB) and is an important consideration in designing and selecting components for applications where isolation between different parts of a circuit is critical to prevent crosstalk or interference. Higher values of Off-state Isolation-Nom indicate better isolation performance, leading to improved overall system reliability and performance.

    65 dB
  • Channel Capacitance (CS(off), CD(off))

    Channel capacitance (CS(off), CD(off)) in electronic components refers to the capacitance associated with the channel of a field-effect transistor (FET) when it is turned off. CS(off) represents the capacitance between the source and the gate of the FET, while CD(off) represents the capacitance between the drain and the gate. These capacitances play a crucial role in determining the high-frequency performance and switching characteristics of the FET. Understanding and controlling these capacitances is essential for optimizing the performance of electronic circuits, especially in high-speed applications where minimizing parasitic capacitances is critical for achieving desired signal integrity and efficiency.

    20pF 20pF
  • On-state Resistance Match-Nom

    On-state Resistance Match-Nom refers to the nominal or standard value of the on-state resistance for a specific electronic component, such as a transistor or a MOSFET, when it is in its "on" state. This parameter indicates how much resistance the component presents to current flow during its conducting phase, which affects power dissipation and efficiency. Matching this value across multiple devices is crucial for ensuring consistent performance in applications where several components operate together.

    0.08Ohm
  • Switch Circuit

    establishes connections between links, on demand and as available, in order to establish an end-to-end circuit between devices.

    SPDT
  • Switch Time (Ton, Toff) (Max)

    The parameter "Switch Time (Ton, Toff) (Max)" in electronic components refers to the maximum time it takes for a device to transition between its on and off states. Ton represents the turn-on time, which is the time taken for the device to switch from the off state to the on state, while Toff represents the turn-off time, which is the time taken for the device to switch from the on state to the off state. This parameter is crucial in determining the speed and efficiency of the device's switching operation. A shorter switch time generally indicates faster switching speeds and better performance of the electronic component.

    13ns, 38ns
  • Charge Injection

    A Charge injection in analog switches and multiplexers is a level change caused by stray capacitance associated with the NMOS and PMOS transistors that make up the analog switch.

    50pC
  • Channel-to-Channel Matching (ΔRon)

    Channel-to-Channel Matching (ΔRon) refers to the variation in the on-resistance of multiple channels within a multi-channel electronic component, such as a multiplexer or a switch. It is a measure of how closely the on-resistance values of different channels match each other. The lower the ΔRon value, the better the matching between channels, which is important for ensuring consistent performance across all channels in a system. Channel-to-Channel Matching is critical in applications where precise and uniform signal processing is required, such as in instrumentation, audio equipment, and communication systems. Manufacturers provide specifications for ΔRon to help designers select components that meet their performance requirements.

    50m Ω
  • Switching

    In electronic components, "Switching" refers to the process of turning a device on or off, or changing its state from one condition to another. This parameter is crucial in determining the speed and efficiency of a component's operation. It is often measured in terms of switching time, which is the time taken for a device to transition from one state to another. The switching characteristics of a component play a significant role in its overall performance and reliability in electronic circuits.

    BREAK-BEFORE-MAKE
  • Switch-on Time-Max

    Switch-on Time-Max is a parameter in electronic components that refers to the maximum time it takes for a device to turn on completely after receiving a signal or command. This parameter is crucial in determining the responsiveness and efficiency of the component in various applications. A shorter switch-on time-max indicates a faster response time, which is important in applications where quick activation is required. Manufacturers provide this specification to help users understand the performance characteristics of the component and ensure it meets the requirements of their specific application.

    25ns
  • Switch-off Time-Max

    Switch-off Time-Max is a parameter in electronic components that refers to the maximum time it takes for a device to turn off completely after a control signal is applied to switch it off. This parameter is crucial in determining the response time and efficiency of the component in various applications. A shorter switch-off time-max indicates a faster response and better performance of the component. It is important to consider this parameter when designing circuits or systems where precise timing and control are required.

    15ns
  • Voltage - Supply, Single (V+)

    Voltage - Supply, Single (V+) refers to the positive voltage supply needed for an electronic component to operate. It indicates the range of voltage levels that can be applied to the component from a single power source. This parameter is crucial for determining compatibility with other components in a circuit and ensuring proper functionality. It typically defines the minimum and maximum voltage limits within which the device can safely and effectively operate.

    1.8V~4.2V
  • Length
    3mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    0.8mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Diodes Incorporated PI3A412ZHEX.

Product Description:

The PI3A412ZHEX is a surface-mount, 16-pin, 2:1 multiplexer/demultiplexer from Diodes Incorporated. This IC is designed to operate in a single-supply configuration, with a voltage range of 1.8V to 4.2V. It features a high-speed switching circuit with a maximum switch-on time of 25ns and a maximum switch-off time of 15ns. The device has a high on-state resistance match of 0.08Ω and an off-state isolation of 65dB.

Features:

  • High-speed switching circuit with a maximum switch-on time of 25ns and a maximum switch-off time of 15ns
  • High on-state resistance match of 0.08Ω
  • Off-state isolation of 65dB
  • Operating temperature range of -40°C to 85°C
  • RoHS3 compliant
  • Available in a 16-WFQFN exposed pad package

Applications:

  • Primary applications:
  • High-speed data acquisition systems
  • High-frequency signal processing systems
  • High-speed data transmission systems
  • Secondary applications:
  • Audio and video processing systems
  • Medical equipment
  • Industrial control systems

Alternative Parts:

  • PI3A412 (base part number)

Embedded Modules:

  • This component is used in various embedded systems, including:
  • Data acquisition systems
  • Signal processing systems
  • Communication systems

FAQs:

Q: What is the operating temperature range of the PI3A412ZHEX? A: The operating temperature range is -40°C to 85°C.

Q: What is the maximum supply current of the PI3A412ZHEX? A: The maximum supply current is 1.5μA.

Q: What is the maximum power dissipation of the PI3A412ZHEX? A: The maximum power dissipation is 500mW.

Q: Is the PI3A412ZHEX RoHS compliant? A: Yes, the PI3A412ZHEX is RoHS3 compliant.

Q: What is the package type of the PI3A412ZHEX? A: The package type is a 16-WFQFN exposed pad.

Q: What is the factory lead time for the PI3A412ZHEX? A: The factory lead time is 18 weeks.

Q: Is the PI3A412ZHEX radiation hardened? A: No, the PI3A412ZHEX is not radiation hardened.

Q: What is the switch circuit type of the PI3A412ZHEX? A: The switch circuit type is SPDT (Single Pole Double Throw).