Essentra Components N-7-BK

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

The parameter "Bundle Center to Mounting Center" in electronic components refers to the distance between the center of the bundle (such as a connector or a group of wires) and the mounting center of the component. This measurement is crucial for ensuring proper alignment and fit of the component within a system or assembly. It helps determine the positioning of the component relative to other elements in the design, ensuring that connections are made correctly and securely. Manufacturers provide this specification to assist designers and engineers in accurately integrating the component into their designs.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

In electronic components, "Screw Size" refers to the specific dimensions and characteristics of the screws used to secure the component in place. This parameter typically includes information such as the diameter, length, thread pitch, and head type of the screw required for installation. Choosing the correct screw size is crucial to ensure proper mounting and secure attachment of the electronic component within a device or system. Manufacturers often provide recommendations or specifications for the appropriate screw size to use with their components to ensure optimal performance and reliability.

The "Opening Size" parameter in electronic components refers to the physical dimensions of an opening or aperture within the component. This measurement typically specifies the size of the opening through which certain elements, such as light, air, or other materials, can pass. The opening size is crucial in determining the compatibility and functionality of the component within a larger system or circuit. It is important to consider the opening size when designing or selecting electronic components to ensure proper fit and performance.

The parameter "Panel Hole Size" in electronic components refers to the diameter of the hole required in a panel or enclosure to mount the component securely. This measurement is crucial for ensuring a proper fit and alignment during installation. It is important to match the panel hole size with the component's specifications to prevent any issues such as loose fitting or misalignment. Manufacturers provide this information to assist users in selecting the appropriate panel or enclosure for their electronic components. It is recommended to follow the specified panel hole size to maintain the integrity and functionality of the electronic component.

A measure of the distance between two surfaces of an object

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

The Material Flammability Rating is a parameter used to indicate the flammability characteristics of materials used in electronic components. It is typically measured according to standards such as UL94, which classifies materials into different categories based on their flammability properties. The rating helps in assessing the fire safety of electronic devices and components, as materials with higher flammability ratings are more resistant to ignition and combustion. Manufacturers often specify the Material Flammability Rating of their components to ensure compliance with safety regulations and standards. It is important to consider this parameter when designing and selecting electronic components to minimize fire hazards and ensure the overall safety of the end product.

The Flammability Rating of electronic components refers to the material's ability to resist catching fire or burning when exposed to heat or flames. It is an important safety consideration in electronic design and manufacturing, especially for components that may be used in environments where fire hazards are a concern. The rating is typically expressed using a standardized scale, such as UL94, which classifies materials based on their flammability characteristics. Components with higher flammability ratings are more resistant to ignition and contribute to overall fire safety in electronic devices. It is crucial to select components with appropriate flammability ratings to ensure the reliability and safety of electronic products.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.