pid_19725981_s9s08aw8ae0mldr-nxp-semiconductors-datasheet-83553155.pdf  Pinout Diagram_1
pid_19725981_s9s08aw8ae0mldr-nxp-semiconductors-datasheet-83553155.pdf  Pinout Diagram_1
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Freescale Semiconductor, Inc. (NXP Semiconductors) S9S08AW8AE0MLDR

Microcontroller

Manufacturer No:

S9S08AW8AE0MLDR

Utmel No:

909-S9S08AW8AE0MLDR

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-

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Microcontroller

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S9S08AW8AE0MLDR information

Specifications
Documents & Media
Product Details
Freescale Semiconductor, Inc. (NXP Semiconductors) S9S08AW8AE0MLDR technical specifications, attributes, parameters and parts with similar specifications to Freescale Semiconductor, Inc. (NXP Semiconductors) S9S08AW8AE0MLDR.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Operating Temperature (Max.)
    125°C
  • Operating Temperature (Min.)
    -40°C
  • RAM(byte)
    768
  • ROM(word)
    8192
  • Usage Level
    Automotive grade
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    44
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.A.2
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Pin Count

    a count of all of the component leads (or pins)

    44
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PQFP-G44
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    3/5V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    AUTOMOTIVE
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    40 MHz
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    18.5mA
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    8
  • Screening Level

    In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.

    AEC-Q100
  • ROM Programmability

    ROM Programmability refers to the ability of a Read-Only Memory (ROM) electronic component to be programmed or written with data or instructions during the manufacturing process. Unlike Random-Access Memory (RAM), ROM is non-volatile memory, meaning that the data stored in it is retained even when the power is turned off. ROM programmability allows manufacturers to pre-load specific data or instructions onto the ROM chip before it is integrated into a device, ensuring that the necessary information is readily available for the device's operation. This feature is commonly used in devices such as microcontrollers, embedded systems, and other electronic devices where specific data needs to be permanently stored and accessed.

    FLASH
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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Download datasheets and manufacturer documentation for Freescale Semiconductor, Inc. (NXP Semiconductors) S9S08AW8AE0MLDR.

S9S08AW8AE0MLDR Overview

During the manufacturing process, 44 terminations were applied to the IC chip. 8-bits are used in Microcontroller. 44 pins are counted on this board.

S9S08AW8AE0MLDR Features


S9S08AW8AE0MLDR Applications

There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors)
S9S08AW8AE0MLDR Microcontroller applications.


  • Equipment control
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  • Christmas lights
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