GCT SIM2055-6-0-18-00-A

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

Contact finish refers to the surface coating or treatment applied to the electrical contacts of electronic components. This finish is crucial for ensuring reliable electrical connections and preventing corrosion or oxidation of the contacts. Common contact finishes include gold, silver, tin, and nickel, each offering different levels of conductivity, durability, and resistance to environmental factors. The choice of contact finish depends on the specific application requirements, such as operating conditions, cost considerations, and compatibility with other components in the circuit. Selecting the appropriate contact finish is essential for maintaining the performance and longevity of electronic devices.

In the context of electronic components, the parameter "Card Type" typically refers to the physical form factor or shape of the component. It describes the specific design and layout of the component, which can vary depending on its intended use and compatibility with other components or systems. For example, common card types in electronics include PCI cards, SIM cards, and memory cards, each designed for specific functions and applications. Understanding the card type is important for ensuring proper installation, compatibility, and functionality within an electronic system.

The parameter "Insertion, Removal Method" in electronic components refers to the techniques and processes used to install or uninstall components within a circuit or system. This includes manual or automated methods, tools, and the design features of the components that facilitate their integration or extraction. Proper insertion and removal methods are critical to ensure reliable connections, minimize damage to components, and maintain the integrity of the overall system. Effective methods also consider factors like access, alignment, and the potential for mechanical stress during the process.

Contact Finish Thickness refers to the measurement of the layer of conductive material applied to the surfaces of electrical contacts in electronic components. This thickness is critical as it influences the electrical conductivity, solderability, wear resistance, and overall performance of the connection. The materials used for the contact finish can include gold, silver, or other metals, and the specified thickness is designed to ensure reliable operation over the component's lifespan.

Height Above Board is a parameter that refers to the distance between the bottom surface of an electronic component and the surface of the circuit board on which it is mounted. This measurement is important for determining the clearance and spacing requirements for the component to ensure proper assembly and functionality of the circuit board. It is typically specified in millimeters or inches and is crucial for ensuring that the component fits correctly on the board without interfering with other components or the overall design of the electronic system. Manufacturers provide this information in datasheets to help designers and engineers select the appropriate components for their applications.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.