GSI Technology GS81302TT07E-400I
GSI Technology GS81302TT07E-400I
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GSI Technology GS81302TT07E-400I

Memory IC GS81302TT07E Memory IC

Manufacturer No:

GS81302TT07E-400I

Manufacturer:

GSI Technology

Utmel No:

2984-GS81302TT07E-400I

Package:

BGA-165

Usage Grade:

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ECAD Model:

Description:

GS81302TT07E 165 Pin Memory IC GS81302TT07E Series 144 Mbit kb

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User Guide

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
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GS81302TT07E-400I information

Specifications
Product Details
GSI Technology GS81302TT07E-400I technical specifications, attributes, parameters and parts with similar specifications to GSI Technology GS81302TT07E-400I.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    BGA-165
  • Maximum Clock Rate
    400 MHz
  • Supplier Package
    FBGA
  • Data Rate Architecture
    DDR
  • Typical Operating Supply Voltage
    1.8000 V
  • Minimum Operating Supply Voltage
    1.7 V
  • Timing Type
    Synchronous
  • Number of Words
    16 MWords
  • Number of I/O Lines
    8 Bit
  • Maximum Operating Supply Voltage
    1.9 V
  • Mounting
    Surface Mount
  • Moisture Sensitive
    Yes
  • Maximum Clock Frequency
    400 MHz
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Supply Voltage-Max
    1.9 V
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    10
  • Supply Voltage-Min
    1.7 V
  • Mounting Styles
    SMD/SMT
  • Interface Type
    Parallel
  • Manufacturer
    GSI Technology
  • Brand
    GSI Technology
  • Tradename
    SigmaDDR-II+
  • Memory Types
    DDR-II
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40 to 100 °C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    GS81302TT07E
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Type
    SigmaDDR-II+ B2
  • Subcategory
    Memory & Data Storage
  • Pin Count

    a count of all of the component leads (or pins)

    165
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    144 Mbit
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    905 mA
  • Architecture

    In electronic components, the parameter "Architecture" refers to the overall design and structure of the component. It encompasses the arrangement of internal components, the layout of circuitry, and the physical form of the component. The architecture of an electronic component plays a crucial role in determining its functionality, performance, and compatibility with other components in a system. Different architectures can result in variations in power consumption, speed, size, and other key characteristics of the component. Designers often consider the architecture of electronic components carefully to ensure optimal performance and integration within a larger system.

    Pipelined
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    16 M x 8
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    23 Bit
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    SRAM
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    144 Mbit
  • Screening Level

    In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.

    Industrial
  • Product Category

    a particular group of related products.

    SRAM
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GS81302TT07E-400I Overview

It is available in a case with a Tray shape. As you can see, it is embedded in BGA-165 case. There is an 144 Mbit memory capacity on the chip. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. It has 165 pins indicating it has 165 memory locations. An address can be read and/or written to one memory address using 1 ports on the chip. Among the GS81302TT07E series of memory devices, this part is essential for its applications. This memory ics is capable of operating with an input current of 905 mA at max. Generally, this component is considered a type of Memory & Data Storage. Generally, this device is known as a SigmaDDR-II+ B2.

GS81302TT07E-400I Features

Package / Case: BGA-165

GS81302TT07E-400I Applications

There are a lot of GSI Technology
GS81302TT07E-400I Memory applications.


  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card
  • hard disk drive (HDD)