GSI Technology GS8644Z18E-250I
GSI Technology GS8644Z18E-250I
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GSI Technology GS8644Z18E-250I

Memory IC GS8644Z18E Memory IC

Manufacturer No:

GS8644Z18E-250I

Manufacturer:

GSI Technology

Utmel No:

2984-GS8644Z18E-250I

Package:

BGA-165

Usage Grade:

  • Military
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ECAD Model:

Description:

GS8644Z18E 165 Pin Memory IC GS8644Z18E Series 72 Mbit kb

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User Guide

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
GS8644Z18E-250I information

Specifications
Product Details
GSI Technology GS8644Z18E-250I technical specifications, attributes, parameters and parts with similar specifications to GSI Technology GS8644Z18E-250I.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    BGA-165
  • Maximum Clock Rate
    153.8@Flow-Through/250@Pipelined MHz
  • Supplier Package
    FBGA
  • Data Rate Architecture
    SDR
  • Typical Operating Supply Voltage
    2.5, 3.3 V
  • Minimum Operating Supply Voltage
    2.3, 3 V
  • Timing Type
    Synchronous
  • Number of Words
    4 MWords
  • Number of I/O Lines
    18 Bit
  • Maximum Operating Supply Voltage
    2.7, 3.6 V
  • Mounting
    Surface Mount
  • Moisture Sensitive
    Yes
  • Maximum Clock Frequency
    250 MHz
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Supply Voltage-Max
    3.6 V
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    15
  • Supply Voltage-Min
    2.3 V
  • Mounting Styles
    SMD/SMT
  • Interface Type
    Parallel
  • Manufacturer
    GSI Technology
  • Brand
    GSI Technology
  • Tradename
    NBT SRAM
  • Memory Types
    SDR
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40 to 85 °C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    GS8644Z18E
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Type
    NBT
  • Subcategory
    Memory & Data Storage
  • Pin Count

    a count of all of the component leads (or pins)

    165
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    72 Mbit
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    2
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    275 mA, 395 mA
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    6.5 ns
  • Architecture

    In electronic components, the parameter "Architecture" refers to the overall design and structure of the component. It encompasses the arrangement of internal components, the layout of circuitry, and the physical form of the component. The architecture of an electronic component plays a crucial role in determining its functionality, performance, and compatibility with other components in a system. Different architectures can result in variations in power consumption, speed, size, and other key characteristics of the component. Designers often consider the architecture of electronic components carefully to ensure optimal performance and integration within a larger system.

    Flow-Through/Pipelined
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    4 M x 18
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    22 Bit
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    SRAM
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    72 Mbit
  • Screening Level

    In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.

    Industrial
  • Product Category

    a particular group of related products.

    SRAM
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GS8644Z18E-250I Overview

In addition, memory ics is available in a Tray case as well. Embedded in the BGA-165 case, memory ics is a single file. On the chip, there is an 72 Mbit memory, which is the size of the chip's memory. Featuring an extended operating temperature range of -40 to 85 °C, this device allows it to be used in a variety of demanding applications. The memory device in question has 165 pins, thus indicating that it has 165 memory locations that can be accessed. 2 ports allow read/write access to one memory address in this chip. It is an important component of the GS8644Z18E series memory devices used in a variety of applications. In order to operate your device, you will need to provide a maximum supply current of 275 mA, 395 mA. Usually, this memory ics falls under the Memory & Data Storage component category. In general, this is a NBT device.

GS8644Z18E-250I Features

Package / Case: BGA-165

GS8644Z18E-250I Applications

There are a lot of GSI Technology
GS8644Z18E-250I Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card