

Infineon S26HS01GTGABHA023
Memory IC D*M Memory IC
Manufacturer No:
S26HS01GTGABHA023
Tiny WHSLManufacturer:
Utmel No:
1211-S26HS01GTGABHA023
Package:
24-VBGA
Description:
D*M Memory IC D*M Series
Quantity:
Unit Price: $23.546734
Ext Price: $23.55
Delivery:





Payment:











In Stock : 9
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$23.546734
$23.55
10
$22.213900
$222.14
100
$20.956510
$2,095.65
500
$19.770292
$9,885.15
1000
$18.651219
$18,651.22
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- TypeParameter
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Panel Mount, Through Hole, Right Angle - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
24-VBGA - Supplier Device Package
The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.
24-FBGA (8x8) - Dielectric Material
a substance that is a poor conductor of electricity, but an efficient supporter of electrostatic field s.
Polycyclohexylenedimethylene Terephthalate (PCT) - Shell Material, Finish
Shell Material, Finish refers to the type of material and the surface treatment used for the outer casing of electronic components, such as connectors and enclosures. The material can affect durability, conductivity, and electromagnetic shielding, while the finish relates to the surface texture and coatings that may enhance corrosion resistance, aesthetic appeal, or mechanical performance. Common materials include plastic, metal, and composites, with finishes that may vary from anodized aluminum to painted surfaces or protective coatings. This parameter is crucial for ensuring the component's functionality and longevity in its intended application.
Stainless Steel - Voltage, Rating-
- PackageBulk
- Base Product Number
"Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.
DEM9 - MfrITT Cannon, LLC
- Product StatusActive
- Contact MaterialsCopper Alloy
- Memory TypesNon-Volatile
- Factory Pack QuantityFactory Pack Quantity2500
- ManufacturerInfineon
- BrandInfineon Technologies
- RoHSDetails
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-55°C ~ 125°C - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
D*M - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Reel - Termination
Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.
Solder - Connector Type
Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.
Plug, Male Pins - Number of Positions9
- ColorBlack
- Number of Rows2
- SubcategoryMemory & Data Storage
- Contact Type
Contact Type in electronic components refers to the specific design and configuration of the electrical contacts used to establish connections between components or devices. The contact type determines how the electrical signals are transmitted between the components, and it can vary based on factors such as the application requirements, signal type, and environmental conditions. Common contact types include pin contacts, socket contacts, surface mount contacts, and wire-to-board contacts. Understanding the contact type is crucial for ensuring proper connectivity and reliable performance in electronic systems.
Signal - Current Rating (Amps)
The parameter "Current Rating (Amps)" in electronic components refers to the maximum amount of electrical current that the component can safely handle without being damaged. It is typically measured in amperes (A) and is an important specification to consider when designing or selecting components for a circuit. Exceeding the current rating of a component can lead to overheating, malfunction, or even failure of the component. It is crucial to ensure that the current rating of a component matches the requirements of the circuit to prevent any potential issues and ensure reliable operation.
7.5A - Technology
In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.
FLASH - NOR (SLC) - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
1.7V ~ 2V - Ingress Protection
Ingress Protection rating (or just IP rating), is an international standard (IEC 60529) used to rate the degree of protection or sealing effectiveness in electrical enclosures against intrusion of objects, water, dust or accidental contact. It corresponds to the European standard EN 60529.
- - Contact Finish
Contact finish refers to the surface coating or treatment applied to the electrical contacts of electronic components. This finish is crucial for ensuring reliable electrical connections and preventing corrosion or oxidation of the contacts. Common contact finishes include gold, silver, tin, and nickel, each offering different levels of conductivity, durability, and resistance to environmental factors. The choice of contact finish depends on the specific application requirements, such as operating conditions, cost considerations, and compatibility with other components in the circuit. Selecting the appropriate contact finish is essential for maintaining the performance and longevity of electronic devices.
Gold - Wire Gauge
a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.
- - Flange Feature
In electronic components, the term "Flange Feature" refers to a specific design element that involves a protruding rim or edge around the perimeter of the component. This flange feature serves multiple purposes, such as providing mechanical support, facilitating mounting or installation, enhancing stability, and improving heat dissipation. The flange feature can vary in size, shape, and material depending on the specific requirements of the component and its intended application. Overall, the presence of a flange feature in electronic components helps ensure proper functionality, durability, and ease of integration within electronic systems.
Housing/Shell (Unthreaded) - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
1Gbit - Connector Style
Connector Style in electronic components refers to the physical design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the shape, size, and layout of the connector, as well as the method of attachment and the number of pins or contacts it has. Different connector styles are used for various applications, such as board-to-board connections, cable-to-board connections, or wire-to-board connections. The connector style plays a crucial role in determining the compatibility and functionality of electronic devices, as it ensures proper signal transmission and power delivery between interconnected components.
D-Sub - Clock Frequency
Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.
200 MHz - Access Time
Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.
5.45 ns - Memory Format
Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.
FLASH - Memory Interface
An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.
HyperBus - Contact Form
A page on a website that allows users to communicate with the site owner. The page has fields for filling in name, address and type of comment. On most company websites, email and mailing addresses are also included; however, the contact form provides an immediate, convenient way for users to ask the company questions.
Machined - Shell Size, Connector Layout
The shell of a circular connector is a cylinder available in incremental sizes starting as small as . 375 diameter up to 3.25 diameter and larger.
1 (DE, E) - Write Cycle Time - Word, Page
Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.
1.7ms - Product Type
a group of products which fulfill a similar need for a market segment or market as a whole.
NOR Flash - Backset Spacing
Backset spacing refers to the distance between the edge of an electronic component and the substrate or board on which it is mounted. It is crucial for ensuring proper alignment and avoiding physical interference with other components or features on the board. Adequate backset spacing helps in managing thermal performance and allows for safe operation within the design specifications of the electronic system.
- - Features
In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.
- - Product Category
a particular group of related products.
NOR Flash - Memory Organization
Memory organization in electronic components refers to the way data is stored and accessed within the memory system. It includes the structure and arrangement of memory cells, addressing schemes, data organization, and access methods. The memory organization determines how data is stored in different memory locations, how it is retrieved, and how it is managed. Different types of memory, such as RAM, ROM, and cache memory, have specific memory organizations tailored to their intended functions and performance requirements. Overall, memory organization plays a crucial role in the efficiency and effectiveness of data storage and retrieval in electronic devices.
128M x 8 - Contact Finish Thickness
Contact Finish Thickness refers to the measurement of the layer of conductive material applied to the surfaces of electrical contacts in electronic components. This thickness is critical as it influences the electrical conductivity, solderability, wear resistance, and overall performance of the connection. The materials used for the contact finish can include gold, silver, or other metals, and the specified thickness is designed to ensure reliable operation over the component's lifespan.
- - Material Flammability Rating
The Material Flammability Rating is a parameter used to indicate the flammability characteristics of materials used in electronic components. It is typically measured according to standards such as UL94, which classifies materials into different categories based on their flammability properties. The rating helps in assessing the fire safety of electronic devices and components, as materials with higher flammability ratings are more resistant to ignition and combustion. Manufacturers often specify the Material Flammability Rating of their components to ensure compliance with safety regulations and standards. It is important to consider this parameter when designing and selecting electronic components to minimize fire hazards and ensure the overall safety of the end product.
UL94 V-0
SLE5532MFC31XHSA1
InfineonSLE5518MFC31ZZZA1
InfineonSLE5542M32XHSA3
InfineonCY15V108QSN-108BKXI
Infineon TechnologiesS80KS2563GABHM020
Infineon TechnologiesS80KS5123GABHM020
Infineon TechnologiesS80KS5123GABHV020
Infineon TechnologiesS25HS01GTFAMHI010
Infineon TechnologiesS26HS01GTGABHI030
Infineon TechnologiesS99AS016J0020
Infineon