pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_1
pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_1
pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_2
pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_3
pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_4
pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_5
pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_6
pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_7
pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_8
pid_36369521_s29cl016j0jqfm033-cypress-semiconductor-datasheet-68296043.pdf Outline Dimensions_9
feed

Infineon S29CL016J0JQFM033

Memory IC Military, MIL-DTL-38999 Series III, Tri-Start™ TV Memory IC

Manufacturer No:

S29CL016J0JQFM033

Manufacturer:

Infineon

Utmel No:

1211-S29CL016J0JQFM033

Package:

-

ECAD Model:

Description:

Military, MIL-DTL-38999 Series III, Tri-Start™ TV 80 Pin Memory IC Military, MIL-DTL-38999 Series III, Tri-Start™ TV Series 16 Mbit kb

Quantity:

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : Please Inquire

Please send RFQ , we will respond immediately.

United States

China

Canada

Japan

Russia

Germany

United Kingdom

Singapore

Italy

Hong Kong(China)

Taiwan(China)

France

Korea

Mexico

Netherlands

Malaysia

Austria

Spain

Switzerland

Poland

Thailand

Vietnam

India

United Arab Emirates

Afghanistan

Åland Islands

Albania

Algeria

American Samoa

Andorra

Angola

Anguilla

Antigua & Barbuda

Argentina

Armenia

Aruba

Australia

Azerbaijan

Bahamas

Bahrain

Bangladesh

Barbados

Belarus

Belgium

Belize

Benin

Bermuda

Bhutan

Bolivia

Bonaire, Sint Eustatius and Saba

Bosnia & Herzegovina

Botswana

Brazil

British Indian Ocean Territory

British Virgin Islands

Brunei

Bulgaria

Burkina Faso

Burundi

Cabo Verde

Cambodia

Cameroon

Cayman Islands

Central African Republic

Chad

Chile

Christmas Island

Cocos (Keeling) Islands

Colombia

Comoros

Congo

Congo (DRC)

Cook Islands

Costa Rica

Côte d’Ivoire

Croatia

Cuba

Curaçao

Cyprus

Czechia

Denmark

Djibouti

Dominica

Dominican Republic

Ecuador

Egypt

El Salvador

Equatorial Guinea

Eritrea

Estonia

Eswatini

Ethiopia

Falkland Islands

Faroe Islands

Fiji

Finland

French Guiana

French Polynesia

Gabon

Gambia

Georgia

Ghana

Gibraltar

Greece

Greenland

Grenada

Guadeloupe

Guam

Guatemala

Guernsey

Guinea

Guinea-Bissau

Guyana

Haiti

Honduras

Hungary

Iceland

Indonesia

Iran

Iraq

Ireland

Isle of Man

Israel

Jamaica

Jersey

Jordan

Kazakhstan

Kenya

Kiribati

Kosovo

Kuwait

Kyrgyzstan

Laos

Latvia

Lebanon

Lesotho

Liberia

Libya

Liechtenstein

Lithuania

Luxembourg

Macao(China)

Madagascar

Malawi

Maldives

Mali

Malta

Marshall Islands

Martinique

Mauritania

Mauritius

Mayotte

Micronesia

Moldova

Monaco

Mongolia

Montenegro

Montserrat

Morocco

Mozambique

Myanmar

Namibia

Nauru

Nepal

New Caledonia

New Zealand

Nicaragua

Niger

Nigeria

Niue

Norfolk Island

North Korea

North Macedonia

Northern Mariana Islands

Norway

Oman

Pakistan

Palau

Palestinian Authority

Panama

Papua New Guinea

Paraguay

Peru

Philippines

Pitcairn Islands

Portugal

Puerto Rico

Qatar

Réunion

Romania

Rwanda

Samoa

San Marino

São Tomé & Príncipe

Saudi Arabia

Senegal

Serbia

Seychelles

Sierra Leone

Sint Maarten

Slovakia

Slovenia

Solomon Islands

Somalia

South Africa

South Sudan

Sri Lanka

St Helena, Ascension, Tristan da Cunha

St. Barthélemy

St. Kitts & Nevis

St. Lucia

St. Martin

St. Pierre & Miquelon

St. Vincent & Grenadines

Sudan

Suriname

Svalbard & Jan Mayen

Sweden

Syria

Tajikistan

Tanzania

Timor-Leste

Togo

Tokelau

Tonga

Trinidad & Tobago

Tunisia

Turkey

Turkmenistan

Turks & Caicos Islands

Tuvalu

U.S. Outlying Islands

U.S. Virgin Islands

Uganda

Ukraine

Uruguay

Uzbekistan

Vanuatu

Vatican City

Venezuela

Wallis & Futuna

Yemen

Zambia

Zimbabwe

User Guide

Purchase & Inquiry
Package
Shipping Information
Shopping Manual
Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
S29CL016J0JQFM033 information

Specifications
Documents & Media
Product Details
Infineon S29CL016J0JQFM033 technical specifications, attributes, parameters and parts with similar specifications to Infineon S29CL016J0JQFM033.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Panel Mount
  • Mounting Feature

    a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

    Bulkhead - Front Side Nut
  • Contact Shape

    Contact shape in electronic components refers to the physical geometry of the interface where electrical connections are made. It plays a critical role in determining the quality and reliability of the connection, impacting factors such as resistance, current density, and heat dissipation. Various shapes, such as flat, cylindrical, or custom profiles, influence the contact area, enabling designers to optimize performance for specific applications. The contact shape also affects the mechanical stability of the connection, influencing wear and longevity.

    Circular
  • Shell Material

    The "Shell Material" parameter in electronic components refers to the material used to encase or cover the internal components of the device. This material is chosen based on various factors such as durability, heat resistance, electrical insulation properties, and environmental considerations. Common shell materials include plastics, metals, and ceramics, each offering different levels of protection and performance characteristics. The choice of shell material can impact the overall reliability, safety, and functionality of the electronic component in different operating conditions.

    Stainless Steel
  • Insert Material

    The parameter "Insert Material" in electronic components refers to the specific material used to create the insert portions of connectors or other components that facilitate assembly or enhance performance. This material is chosen for its electrical, thermal, and mechanical properties, which can influence the overall functionality and reliability of the component in its intended application. Common insert materials include plastics, ceramics, and metals, each selected based on the requirements of the environment in which the component will operate.

    --
  • Lead Free Status / RoHS Status
    --
  • Contact Sizes
    20
  • Supplier Package
    QFP
  • Typical Operating Supply Voltage
    3.3000 V
  • Timing Type
    Asynchronous/Synchronous
  • ECC Support
    No
  • Block Organization
    Asymmetrical
  • Interface Type
    Parallel
  • Number of Words
    512 kWords
  • Cell Type
    NOR
  • Mounting
    Surface Mount
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -65°C ~ 200°C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Military, MIL-DTL-38999 Series III, Tri-Start™ TV
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    --
  • Connector Type

    Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

    Receptacle Housing
  • Type
    For Female Sockets
  • Number of Positions
    3
  • Fastening Type

    There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

    Threaded
  • Contact Type

    Contact Type in electronic components refers to the specific design and configuration of the electrical contacts used to establish connections between components or devices. The contact type determines how the electrical signals are transmitted between the components, and it can vary based on factors such as the application requirements, signal type, and environmental conditions. Common contact types include pin contacts, socket contacts, surface mount contacts, and wire-to-board contacts. Understanding the contact type is crucial for ensuring proper connectivity and reliable performance in electronic systems.

    Crimp
  • Orientation

    In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

    A
  • Shielding

    Shielding in electronic components refers to the practice of enclosing or surrounding sensitive electronic circuits or components with a conductive material to protect them from electromagnetic interference (EMI) or radio frequency interference (RFI). The shielding material acts as a barrier that blocks or absorbs unwanted electromagnetic signals, preventing them from affecting the performance of the electronic device. Shielding can be achieved using materials such as metal enclosures, conductive coatings, or shielding tapes. Proper shielding is essential in electronic design to ensure the reliable operation of electronic devices in environments where electromagnetic interference is present.

    Shielded
  • Ingress Protection

    Ingress Protection rating (or just IP rating), is an international standard (IEC 60529) used to rate the degree of protection or sealing effectiveness in electrical enclosures against intrusion of objects, water, dust or accidental contact. It corresponds to the European standard EN 60529.

    Environment Resistant
  • Shell Finish

    Shell Finish in electronic components refers to the surface treatment or coating applied to the outer shell or casing of the component. This finish is designed to provide protection against environmental factors such as moisture, dust, and corrosion, as well as to enhance the component's appearance. Common types of shell finishes include nickel plating, anodizing, powder coating, and epoxy resin coating. The choice of shell finish depends on the specific requirements of the component, such as the operating environment, durability needs, and aesthetic considerations.

    Passivated
  • Pin Count

    a count of all of the component leads (or pins)

    80
  • Shell Size - Insert

    The parameter "Shell Size - Insert" in electronic components refers to the physical size of the connector shell or housing that holds the insert or contact arrangement within the component. The shell size is typically specified by a numerical designation that corresponds to a specific size and configuration of the connector. This parameter is important for ensuring compatibility and proper fit between different components or devices that use the same type of connector. Manufacturers provide detailed specifications for shell size to help users select the appropriate connector for their specific application requirements.

    9-98
  • Housing Color

    Housing color in electronic components refers to the color of the protective casing or enclosure that surrounds the component. It can play a role in visual identification, aiding in easy recognition during assembly or maintenance. Additionally, the housing color may also have implications for heat dissipation, aesthetic considerations, or regulatory compliance depending on the application or industry standards.

    Silver
  • Note
    Contacts Not Included
  • Shell Size, MIL

    The parameter "Shell Size, MIL" in electronic components refers to the physical size of the component's outer shell or housing, measured in thousandths of an inch (mil). It is a standardized measurement used to ensure compatibility and interchangeability of components within a specific series or family. The shell size typically includes dimensions such as diameter, length, and overall shape of the component, and is important for determining how the component will fit into a system or assembly. Manufacturers provide shell size information to help users select the appropriate components for their specific application requirements.

    A
  • Architecture

    In electronic components, the parameter "Architecture" refers to the overall design and structure of the component. It encompasses the arrangement of internal components, the layout of circuitry, and the physical form of the component. The architecture of an electronic component plays a crucial role in determining its functionality, performance, and compatibility with other components in a system. Different architectures can result in variations in power consumption, speed, size, and other key characteristics of the component. Designers often consider the architecture of electronic components carefully to ensure optimal performance and integration within a larger system.

    Sectored
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    19 Bit
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    16 Mbit
  • Includes

    Includes is a parameter in electronic components that refers to the additional features or components that are included with the main product. This could include accessories, cables, software, or any other items that come packaged with the main electronic component. The "Includes" parameter is important for consumers to know exactly what they will be receiving when they purchase the product, and it can also help them determine the overall value and functionality of the product. Manufacturers often list the included items in the product description or packaging to provide transparency and help customers make informed purchasing decisions.

    --
  • Screening Level

    In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.

    Extended Industrial
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    3, 3.6 V
  • Boot Block

    The "Boot Block" in electronic components refers to a specific section of memory that is typically used in flash memory devices. It is a small portion of memory that contains essential code and data required for the device to boot up or initialize properly. The Boot Block is usually located at the beginning of the memory space and is designed to be read-only to ensure its integrity and prevent accidental corruption.During the boot-up process, the microcontroller or processor accesses the Boot Block to execute the initial instructions needed to start the device. This section often contains bootloader code, configuration settings, and other critical information necessary for the device to function correctly. By isolating this essential data in a dedicated Boot Block, manufacturers can ensure the reliability and security of the boot process in electronic components.

    Yes
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Firewall Usage
  • Material Flammability Rating

    The Material Flammability Rating is a parameter used to indicate the flammability characteristics of materials used in electronic components. It is typically measured according to standards such as UL94, which classifies materials into different categories based on their flammability properties. The rating helps in assessing the fire safety of electronic devices and components, as materials with higher flammability ratings are more resistant to ignition and combustion. Manufacturers often specify the Material Flammability Rating of their components to ensure compliance with safety regulations and standards. It is important to consider this parameter when designing and selecting electronic components to minimize fire hazards and ensure the overall safety of the end product.

    --
0 Similar Products Remaining
Download datasheets and manufacturer documentation for Infineon S29CL016J0JQFM033.

S29CL016J0JQFM033 Overview

There is a Bulk case available. A wide operating temperature range makes this device ideal for a variety of demanding applications. Its recommended mounting type is Panel Mount. There are 80 pins on this memory device, which indicates it has 80 memory locations in it. In its target applications, this memory ics plays an important role as a member of the Military, MIL-DTL-38999 Series III, Tri-Start™ TV series of memory devices. Nonvolatile memory arrays require 3, 3.6 V programming voltage to change their state. It is generally referred to as a For Female Sockets device, which is what we call it.

S29CL016J0JQFM033 Features


S29CL016J0JQFM033 Applications

There are a lot of Infineon
S29CL016J0JQFM033 Memory applications.


  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
S29CL016J0JQFM033 Relevant information

Hot Sale
Related Categories
Similar Products
Related Products
Same Manufacturer Products
The following parts include "S29CL016J0JQFM033" in Infineon S29CL016J0JQFM033.
  • Part Number
  • Manufacturer
  • Package
  • Description