pid_40124436_s6j324cksmse20000-cypress-semiconductor-datasheet-158994926.pdf  Pinout Diagram_1
pid_40124436_s6j324cksmse20000-cypress-semiconductor-datasheet-158994926.pdf  Pinout Diagram_1
pid_40124436_s6j324cksmse20000-cypress-semiconductor-datasheet-158994926.pdf Outline Dimensions_1
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Infineon S6J324CKSMSE20000

Microcontroller 435 Series 2-SMD, No Lead

Manufacturer No:

S6J324CKSMSE20000

Manufacturer:

Infineon

Utmel No:

1211-S6J324CKSMSE20000

Package:

2-SMD, No Lead

ECAD Model:

Description:

2.112MB (2.112M x 8) FLASH ARM® Cortex®-R5F 32-Bit Single-Core Microcontroller 435 Series 12 MHz 2-SMD, No Lead

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Unit Price: $11.114228

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S6J324CKSMSE20000 information

Specifications
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Product Details
Infineon S6J324CKSMSE20000 technical specifications, attributes, parameters and parts with similar specifications to Infineon S6J324CKSMSE20000.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    2-SMD, No Lead
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    208-TQFP (28x28)
  • Package
    Tape & Reel (TR)
  • Mfr
    CTS-Frequency Controls
  • Product Status
    Active
  • Number of I/Os
    120
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    S6J324
  • Data Converters
    A/D 50x12b
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 105°C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    435
  • Size / Dimension

    In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

    0.197 L x 0.126 W (5.00mm x 3.20mm)
  • Type
    MHz Crystal
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    12 MHz
  • Frequency Stability

    the variation of output frequency of a crystal oscillator due to external conditions like temperature variation, voltage variation, output load variation, and frequency aging.

    ±30ppm
  • ESR (Equivalent Series Resistance)

    Equivalent Series Resistance (ESR) is a parameter that describes the internal resistance of a capacitor or an inductor in an electronic circuit. It represents the total resistance that is present in series with the ideal capacitance or inductance of the component. ESR is typically caused by factors such as the resistance of the conductive materials used in the component, the connections within the component, and the dielectric material used. A lower ESR value is desirable in electronic components as it indicates better performance and efficiency, especially in applications where high-frequency signals or rapid changes in voltage are involved. ESR is an important parameter to consider when selecting components for applications such as power supplies, filtering circuits, and signal processing.

    60 Ohms
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Load Capacitance

    the amount of capacitance measured or computed across the crystal terminals on the PCB. Frequency Tolerance. Frequency tolerance refers to the allowable deviation from nominal, in parts per million (PPM), at a specific temperature, usually +25°C.

    10pF
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    240MHz
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    512K x 8
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    Fundamental
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.15V ~ 5.5V
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-R5F
  • Frequency Tolerance

    the maximum allowable deviation from the nominal crystal frequency at a specified temperature, usually 25℃. The recommended frequency tolerance of the crystal over the manufacturing process is ±50 ppm.

    ±10ppm
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    DMA, I²S, LVD, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit Single-Core
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    2.112MB (2.112M x 8)
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    CANbus, CSIO, Ethernet, I²C, LINbus, SPI, UART/USART
  • EEPROM Size

    EEPROM Size refers to the amount of memory capacity available in an Electrically Erasable Programmable Read-Only Memory (EEPROM) chip. This parameter indicates the total storage space in bytes or bits that can be used to store data in a non-volatile manner. The EEPROM size determines the maximum amount of information that can be written, read, and erased from the memory chip. It is an important specification to consider when selecting an EEPROM for a particular application, as it directly impacts the amount of data that can be stored and accessed by the electronic component.

    -
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    0.197 L x 0.126 W (5.00mm x 3.20mm)
  • Ratings

    The parameter "Ratings" in electronic components refers to the specified limits that define the maximum operational capabilities of a component. These ratings include voltage, current, power, temperature, and frequency, determining the conditions under which the component can function safely and effectively. Exceeding these ratings can lead to failure, damage, or unsafe operation, making it crucial for designers to adhere to them during component selection and usage.

    -
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Download datasheets and manufacturer documentation for Infineon S6J324CKSMSE20000.

S6J324CKSMSE20000 Overview

2-SMD, No Lead-packages are available. Device mounting type Surface Mount is the type of mounting that the Microcontroller uses. There is a 32-Bit Single-Core core at the core of this MCU. There is a type of program memory called FLASH in the Microcontroller. There is a temperature range of -40°C ~ 105°C for this Microcontroller. An electrical component of this type belongs to the 435 series. This program memory has a size of 2.112MB (2.112M x 8), which indicates what the size of the program memory is. ARM® Cortex®-R5F Core processors are used in MCU. This device is extremely efficient when operated at a frequency of 12 MHz.

S6J324CKSMSE20000 Features

2-SMD, No Lead package
Mounting type of Surface Mount

S6J324CKSMSE20000 Applications

There are a lot of Infineon
S6J324CKSMSE20000 Microcontroller applications.


  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
S6J324CKSMSE20000 Relevant information

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