Integrated Device Technology (IDT) 74FCT16245ATPVG8

DUAL Buffers 48 Pins 8 Bit per Element SSOP

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

The center distance from one pole to the next.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

a count of all of the component leads (or pins)

An indicator of formal certification of qualifications.

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

the flight time of packets over the transmission link and is limited by the speed of light.

The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.

In electronic components, the parameter "Family" typically refers to a categorization or classification system used to group similar components together based on their characteristics, functions, or applications. This classification helps users easily identify and select components that meet their specific requirements. The "Family" parameter can include various subcategories such as resistors, capacitors, diodes, transistors, integrated circuits, and more. Understanding the "Family" of an electronic component can provide valuable information about its compatibility, performance specifications, and potential uses within a circuit or system. It is important to consider the "Family" parameter when designing or troubleshooting electronic circuits to ensure proper functionality and compatibility with other components.

In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

In electronic components, the parameter "Direction" refers to the orientation or alignment in which the component is designed to operate effectively. This parameter is particularly important for components such as diodes, transistors, and capacitors, which have specific polarity or orientation requirements for proper functionality. For example, diodes allow current flow in one direction only, so their direction parameter indicates the correct orientation for current flow. Similarly, polarized capacitors have a positive and negative terminal, requiring proper alignment for correct operation. Understanding and adhering to the direction parameter is crucial for ensuring the reliable and efficient performance of electronic components in a circuit.

Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

Logic IC Type refers to the type of integrated circuit (IC) that is specifically designed to perform logical operations. These ICs are commonly used in digital electronic devices to process and manipulate binary data according to predefined logic functions. The Logic IC Type parameter typically specifies the specific logic family or technology used in the IC, such as TTL (Transistor-Transistor Logic), CMOS (Complementary Metal-Oxide-Semiconductor), or ECL (Emitter-Coupled Logic). Understanding the Logic IC Type is important for selecting the appropriate IC for a given application, as different logic families have varying characteristics in terms of speed, power consumption, and noise immunity.

Max I(ol) refers to the maximum output current that a specific electronic component, such as a transistor or integrated circuit, can sink or source. This parameter is crucial in determining the capability of the component to drive external loads without being damaged. It is typically specified in the component's datasheet and is important for ensuring proper operation and reliability of the circuit in which the component is used. Designers must ensure that the output current requirements of the circuit do not exceed the specified "Max I(ol)" value to prevent overloading and potential failure of the component.

The parameter "Prop. Delay@Nom-Sup" in electronic components refers to the propagation delay at nominal supply voltage. Propagation delay is the time it takes for a signal to travel from the input of a component to the output, typically measured in nanoseconds or picoseconds. The nominal supply voltage is the standard operating voltage specified for the component.This parameter is important because it affects the overall speed and performance of the electronic circuit. A shorter propagation delay means faster signal processing and better overall performance. Designers need to consider the propagation delay at the nominal supply voltage when selecting components for their circuits to ensure proper functionality and meet performance requirements.

High-level Output Current IOH The current flowing into the output at a specified high- level voltage. Low-level Output Current IOL The current flowing into the output at a specified low- level output voltage.

The current into the output terminal with input conditions applied that, according to the product specification, will establish a low level at the output.

Control Type in electronic components refers to the method used to regulate or manipulate an electronic system's behavior or output. It can indicate whether the component operates in an analog or digital manner, and may include types such as on/off, proportional, or pulse-width modulation. Understanding the control type is crucial for determining how components interact with each other and the overall system's functionality.

In electronic components, "Translation" refers to the process of converting one form of data or signal into another form. This can involve converting analog signals to digital signals or vice versa, as well as converting between different communication protocols or interfaces. Translation is essential for enabling different components or systems to communicate and work together effectively. It ensures compatibility and interoperability between various devices in a system or network. Overall, translation plays a crucial role in facilitating the seamless exchange of information and signals within electronic systems.

Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.