Integrated Device Technology (IDT)  IDT74SSTUBH32865ABKG8
Integrated Device Technology (IDT)  IDT74SSTUBH32865ABKG8
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Integrated Device Technology (IDT) IDT74SSTUBH32865ABKG8

Specialty Logic 28 Bit 1.8V Specialty Logic IC 160 Pin

Manufacturer No:

IDT74SSTUBH32865ABKG8

Utmel No:

1179-IDT74SSTUBH32865ABKG8

Package:

BGA

ECAD Model:

Description:

28 Bit Specialty Logic IC 160 Pin 0.65mm 1.8V BGA

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IDT74SSTUBH32865ABKG8 information

Specifications
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Product Details
Integrated Device Technology (IDT) IDT74SSTUBH32865ABKG8 technical specifications, attributes, parameters and parts with similar specifications to Integrated Device Technology (IDT) IDT74SSTUBH32865ABKG8.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    BGA
  • Number of Pins
    160
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2006
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e1
  • Number of Terminations
    160
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    TIN SILVER COPPER
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    70°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0°C
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.8V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Pin Count

    a count of all of the component leads (or pins)

    160
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.9V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.7V
  • Number of Bits
    28
  • Family

    In electronic components, the parameter "Family" typically refers to a categorization or classification system used to group similar components together based on their characteristics, functions, or applications. This classification helps users easily identify and select components that meet their specific requirements. The "Family" parameter can include various subcategories such as resistors, capacitors, diodes, transistors, integrated circuits, and more. Understanding the "Family" of an electronic component can provide valuable information about its compatibility, performance specifications, and potential uses within a circuit or system. It is important to consider the "Family" parameter when designing or troubleshooting electronic circuits to ensure proper functionality and compatibility with other components.

    SSTU
  • Logic Function

    In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

    Buffer
  • Output Polarity

    Output polarity in electronic components refers to the orientation of the output signal in relation to the ground or reference voltage. It indicates whether the output voltage is positive or negative with respect to the ground. Positive output polarity means the signal is higher than the ground potential, while negative output polarity signifies that the signal is lower than the ground. This characteristic is crucial for determining compatibility with other components in a circuit and ensuring proper signal processing.

    TRUE
  • Logic IC Type

    Logic IC Type refers to the type of integrated circuit (IC) that is specifically designed to perform logical operations. These ICs are commonly used in digital electronic devices to process and manipulate binary data according to predefined logic functions. The Logic IC Type parameter typically specifies the specific logic family or technology used in the IC, such as TTL (Transistor-Transistor Logic), CMOS (Complementary Metal-Oxide-Semiconductor), or ECL (Emitter-Coupled Logic). Understanding the Logic IC Type is important for selecting the appropriate IC for a given application, as different logic families have varying characteristics in terms of speed, power consumption, and noise immunity.

    D FLIP-FLOP
  • Trigger Type

    Trigger Type in electronic components refers to the mechanism or method by which a device, such as a flip-flop or timer, responds to an input signal. It defines how the device transitions between states based on specific conditions, such as rising or falling edges of a signal, levels, or pulses. Different trigger types such as edge-triggered, level-triggered, or pulse-triggered influence the timing and behavior of the circuit, thereby determining how input signals affect the output in various applications.

    POSITIVE EDGE
  • Propagation Delay (tpd)

    Propagation delay (tpd) is a crucial parameter in electronic components, especially in digital circuits. It refers to the time taken for a signal to travel from the input of a component to its output. This delay is caused by various factors such as the internal circuitry, interconnections, and the physical properties of the component. Propagation delay is essential to consider in designing circuits to ensure proper timing and functionality. It is typically measured in nanoseconds or picoseconds and plays a significant role in determining the overall performance and speed of electronic systems.

    1.6 ns
  • fmax-Min

    fmax-Min refers to the frequency range that an electronic component or system can operate within. It represents the difference between the maximum frequency (fmax) and the minimum frequency (Min) limits of operation. This parameter is crucial in defining the bandwidth of the component, indicating how effectively it can transmit or receive signals over that range. A wider fmax-Min value typically signifies better performance for applications that require broad frequency response.

    410 MHz
  • Length
    13mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1.3mm
  • Width
    9mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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Download datasheets and manufacturer documentation for Integrated Device Technology (IDT) IDT74SSTUBH32865ABKG8.

IDT74SSTUBH32865ABKG8 Overview

Packages are made with Tape & Reel (TR).There is a copy of it in the BGA package.In order for the device to perform properly, a voltage of 1.8V is supplied.Memory features a storage capacity of 28 bits.There are 160 pins on all component boards.160 terminations reduce the likelihood of signals reflecting off the end of a transmission line.Mounted in the Surface Mount way.In order for it to be constructed, it needs 160 pins.In order for it to operate, an adequate supply voltage of 1.9V is required.The electronic part belongs to the family of SSTU which is known for its high quality and reliability.Its operating temperature should not exceed 70°C at all times, as this is critical.This is the most essential factor, since its operating temperature cannot be lower than 0°C.It is based on the logic IC type D FLIP-FLOP.

IDT74SSTUBH32865ABKG8 Features


IDT74SSTUBH32865ABKG8 Applications

There are a lot of Integrated Device Technology (IDT)
IDT74SSTUBH32865ABKG8 Specialty Logic ICs applications.


  • Desktop PC
  • Notebook
  • Pocket PC
  • Desktop radio
  • Clock radio
  • Tuner
  • Portable radio
  • Car radio
  • Satellite radio receiver
  • Shortwave receiver