Intel BD82QM57SLGZQ
Intel BD82QM57SLGZQ
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Intel BD82QM57SLGZQ

CMOS Controllers Interface ICs

Manufacturer No:

BD82QM57SLGZQ

Manufacturer:

Intel

Utmel No:

1234-BD82QM57SLGZQ

Package:

-

ECAD Model:

Description:

CMOS Controllers Interface ICs BOTTOM 1071 Pins 0.6 mm

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In Stock : 450

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BD82QM57SLGZQ information

Specifications
Product Details
Intel BD82QM57SLGZQ technical specifications, attributes, parameters and parts with similar specifications to Intel BD82QM57SLGZQ.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    1071
  • Number of Terminals
    1071
  • RoHS
    Compliant
  • Package Description
    27 X 25 MM, 0.60 MM PITCH, FCBGA-1071
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom
    1.05 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Supply Voltage-Min
    0.998 V
  • Rohs Code
    Yes
  • Manufacturer Part Number
    BD82QM57SLGZQ
  • Clock Frequency-Max
    14.318 MHz
  • Package Code
    HBGA
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Intel Corporation
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    INTEL CORP
  • Supply Voltage-Max
    1.1 V
  • Risk Rank
    5.81
  • Part Package Code
    BGA
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    108 °C
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    CMOS
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Terminal Pitch

    The center distance from one pole to the next.

    0.6 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    1071
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PBGA-B1071
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    2.358 mm
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    32
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    YES
  • External Data Bus Width

    The External Data Bus Width refers to the number of bits that can be transmitted simultaneously between a microprocessor and external components, such as memory or peripherals. It determines the amount of data that can be transferred in a single clock cycle. A wider data bus allows for faster data transfer rates and can improve overall system performance. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with larger widths generally offering higher throughput but requiring more complex circuitry. The External Data Bus Width is an important parameter to consider when designing or evaluating electronic components to ensure compatibility and optimal performance.

    32
  • Bus Compatibility

    Bus compatibility in electronic components refers to the ability of a device to communicate effectively with other devices on a shared data bus. This parameter is crucial in ensuring that different components can exchange information seamlessly and operate together without compatibility issues. It involves factors such as voltage levels, signal timing, and data protocols that need to be standardized for proper communication. Components with good bus compatibility can work together efficiently in a system, while those with poor compatibility may lead to communication errors or system malfunctions. Manufacturers often specify the bus compatibility of their components to help users ensure proper integration and functionality within their electronic systems.

    USB; PCI; I2C; LPC; PS/2
  • Width
    25 mm
  • Length
    27 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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BD82QM57SLGZQ Overview

To operate, 1071 pins are required. A maximum operating temperature of 108 °C°C provides stable operation. Having a pin count of 1071, it has a large number of connections.

BD82QM57SLGZQ Features


BD82QM57SLGZQ Applications

There are a lot of Intel
BD82QM57SLGZQ Controllers Interface ICs applications.


  • Dimmable LED Power Supply
  • Dimming Control Devices
  • Commercial LED Lighting
  • Smart LED Lighting
  • Portable Appliances
  • Battery-Operated Devices
  • Cellular Data Devices
  • Factory Automation and Process Controls
  • IrDA transmission control
  • Remote transmission formatter