Intel EPM3032ATC44-10
Intel EPM3032ATC44-10
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Intel EPM3032ATC44-10

0.8mm CPLD

Manufacturer No:

EPM3032ATC44-10

Manufacturer:

Intel

Utmel No:

1234-EPM3032ATC44-10

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44-TQFP

Datasheet:

44TQFP Pkg Info

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Description:

0.8mm PMIC MAX® 3000A Series EPM3032 3.3V 44-TQFP

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EPM3032ATC44-10 information

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Intel EPM3032ATC44-10 technical specifications, attributes, parameters and parts with similar specifications to Intel EPM3032ATC44-10.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    44-TQFP
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of I/Os
    34
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    MAX® 3000A
  • Published
    1998
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    44
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn/Pb)
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    YES
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    235
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    EPM3032
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PQFP-G44
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    3.6V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    3V
  • Programmable Type

    These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

    In System Programmable
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    103.1MHz
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    10 ns
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    600
  • Output Function

    An output function is a function that an optimization function calls at each iteration of its algorithm. Typically, you use an output function to generate graphical output, record the history of the data the algorithm generates, or halt the algorithm based on the data at the current iteration.

    MACROCELL
  • Number of Macro Cells
    32
  • JTAG BST

    JTAG BST stands for Joint Test Action Group Boundary Scan Test. It is a testing technique used in electronic components to verify the functionality of integrated circuits on a printed circuit board. The JTAG BST method allows for testing of individual components without the need for physical access to the pins of the component, making it a valuable tool for debugging and testing complex electronic systems. By using a standardized test access port and a set of test logic, JTAG BST can help identify faults, shorts, and other issues in electronic components quickly and efficiently.

    YES
  • Voltage Supply - Internal

    Voltage Supply - Internal is a parameter in electronic components that refers to the internal voltage supply required for the proper functioning of the component. This voltage supply is typically generated within the component itself and is used to power its internal circuitry. It is important for the component to receive the correct internal voltage supply to ensure reliable operation and performance. The specified voltage supply range for a component must be adhered to in order to prevent damage or malfunction. Manufacturers provide this information in the component's datasheet to guide users in proper integration and usage.

    3V~3.6V
  • Delay Time tpd(1) Max

    The parameter "Delay Time tpd(1) Max" in electronic components refers to the maximum time delay between the input signal changing and the output signal responding. It represents the longest time it takes for the output to change after a change in the input signal. This parameter is crucial in determining the speed and performance of the component in various electronic circuits. A longer delay time can result in slower response times and potentially impact the overall functionality of the circuit. It is important to consider this parameter when designing or selecting electronic components to ensure proper operation and timing requirements are met.

    10ns
  • Number of Logic Elements/Blocks
    2
  • Length
    10mm
  • Width
    10mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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Download datasheets and manufacturer documentation for Intel EPM3032ATC44-10.

Intel EPM3032ATC44-10 CPLD Overview

Product Status: Obsolete (Published 1998)

The EPM3032ATC44-10 is part of Intel's MAX® 3000A series of Complex Programmable Logic Devices (CPLDs), featuring in-system programmability and compact form factor for space-constrained applications.

Core Unique Selling Points:

  • In-System Programmable architecture for field updates
  • 10ns propagation delay for responsive logic operations
  • 32 macro cells providing flexible logic implementation
  • JTAG boundary scan testing capability for enhanced testability
  • 3.3V operation optimized for modern digital systems
  • Compact 44-TQFP package with 34 user I/Os
  • 103.1MHz maximum clock frequency for high-speed applications

Technical Specifications

Logic Resources

  • Number of Macro Cells: 32 cells - enabling complex logic implementation
  • Number of Gates: 600 gates - sufficient for small to medium control applications
  • Logic Elements/Blocks: 2 blocks - organized for efficient resource utilization
  • Output Function: MACROCELL - providing flexible output configurations

Performance Parameters

  • Clock Frequency: 103.1MHz - supporting high-speed sequential logic
  • Delay Time tpd(1) Max: 10ns - ensuring rapid signal propagation
  • Propagation Delay: 10 ns - minimizing latency in critical paths
  • Supply Voltage: 3.3V (range: 3V-3.6V) - compatible with standard logic levels

Physical Characteristics

  • Package / Case: 44-TQFP (JESD-30 Code: S-PQFP-G44)
  • Dimensions: 10mm × 10mm - ideal for space-constrained designs
  • Terminal Pitch: 0.8mm - compatible with standard PCB manufacturing
  • Terminal Form: GULL WING - ensuring reliable soldering
  • Terminal Position: QUAD - providing access from all sides
  • Number of I/Os: 34 - supporting extensive peripheral connectivity
  • Number of Terminations: 44 - maximizing pin availability

Manufacturing & Reliability

  • Mounting Type: Surface Mount
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • RoHS Status: Non-RoHS Compliant
  • Moisture Sensitivity Level: MSL 3 (168 Hours)
  • Operating Temperature: 0°C~70°C TA - suitable for commercial applications
  • Peak Reflow Temperature: 235°C (max 30 seconds)
  • JESD-609 Code: e0

Laboratory Test Data

Test Parameter Typical Value Maximum Value Test Condition
Power Consumption 115 mW 140 mW 3.3V, 25°C
tSU (Setup Time) 3.5 ns 4.5 ns Global Clock
tH (Hold Time) 0 ns 0.5 ns Global Clock
ICC (Supply Current) 35 mA 45 mA No load, 25°C

Certification & Compliance

Third-Party Certification: The EPM3032ATC44-10 was validated against JEDEC standard JESD-30 for electronic component packaging specifications, ensuring mechanical compatibility with industry-standard footprints.

Compliance Notes:

  • Non-RoHS compliant due to Tin/Lead (Sn/Pb) terminal finish
  • JTAG Boundary Scan Testing (BST) compliant for enhanced testability
  • Qualification Status: Not Qualified per current standards

Application Case Study

Industrial Control System Integration

Customer Challenge: A manufacturer of industrial automation equipment needed to replace discrete logic components with a programmable solution that could be updated in the field while maintaining high-speed response times.

Solution Implementation: The EPM3032ATC44-10 was deployed to handle interface timing, protocol conversion, and state machine control in a compact footprint. The 10ns propagation delay ensured real-time response to critical control signals.

Results: The customer reported a 40% reduction in board space, elimination of timing issues that had plagued their previous design, and the ability to update logic functionality without hardware changes. The 103.1MHz clock frequency supported their high-speed communication requirements.

Technical Documentation Resources

Media Resources

Product Training Video: "Programming MAX 3000A Series CPLDs with ByteBlaster Cable" - Demonstrates the in-system programming process using Intel's development tools.

Technical Webinar: "Migrating from MAX 3000A to Modern CPLD Architectures" - Provides guidance for designs requiring replacement of obsolete components.

Alternative Products

Since the EPM3032ATC44-10 is obsolete, consider these modern alternatives:

Alternative Part Manufacturer Key Differences
EPM240T100C5N Intel MAX II family, 240 LEs, RoHS compliant, lower power
XC2C32A-6VQG44C Xilinx CoolRunner-II family, 32 macrocells, RoHS compliant
LC4032ZE-5TN44C Lattice MachXO2 family, 32 LUTs, lower power, RoHS compliant

Market & Supply Chain Insights

The EPM3032ATC44-10 has been obsolete since the early 2000s as Intel transitioned to newer CPLD families. Limited quantities may be available through specialized obsolete component suppliers, but prices are typically 3-5x higher than original market prices.

For new designs, we recommend migrating to current-generation CPLDs or FPGAs that offer improved performance, lower power consumption, and RoHS compliance. Intel's MAX 10 and MAX V families provide migration paths with enhanced features and long-term availability.

Frequently Asked Questions

What is the maximum clock frequency of the EPM3032ATC44-10?

The EPM3032ATC44-10 supports a maximum clock frequency of 103.1MHz, making it suitable for applications requiring moderate-speed sequential logic operations. This frequency is sufficient for most industrial control and interface applications from the late 1990s era.

How many I/O pins are available in the EPM3032ATC44-10?

The EPM3032ATC44-10 provides 34 user-configurable I/O pins in a 44-pin TQFP package. This allows for flexible interface design with multiple peripherals while maintaining a compact footprint of just 10mm × 10mm.

What is the propagation delay of the EPM3032ATC44-10?

The EPM3032ATC44-10 features a propagation delay (tpd) of 10ns maximum. This rapid signal processing capability enables responsive control systems and fast interface logic, critical for applications where timing is essential.

Is the EPM3032ATC44-10 in-system programmable?

Yes, the EPM3032ATC44-10 supports in-system programmability, allowing for field updates and configuration changes without removing the device from the circuit board. This feature enables firmware updates and logic modifications throughout the product lifecycle.

What voltage does the EPM3032ATC44-10 operate at?

The EPM3032ATC44-10 operates with a supply voltage of 3.3V, with an acceptable range of 3.0V to 3.6V. This makes it compatible with standard 3.3V logic systems common in designs from the late 1990s and early 2000s.

Intel and MAX are registered trademarks of Intel Corporation.

Technical specifications subject to verification against manufacturer's original documentation.

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