Intel GT28F320C3BA110
Intel GT28F320C3BA110
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Intel GT28F320C3BA110

Memory IC 110GHz MHz Memory IC

Manufacturer No:

GT28F320C3BA110

Manufacturer:

Intel

Utmel No:

1234-GT28F320C3BA110

Package:

48-VFBGA

ECAD Model:

Description:

1.8/3.33/3.3V V 47 Pin Memory IC 10.85mm mm

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Unit Price: $8.217762

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GT28F320C3BA110 information

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Intel GT28F320C3BA110 technical specifications, attributes, parameters and parts with similar specifications to Intel GT28F320C3BA110.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    48-VFBGA
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Number of Pins
    47
  • Memory Types
    Non-Volatile
  • Published
    2002
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    47
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.B.1.A
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn/Pb)
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.51
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.7V~3.6V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.75mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    110GHz
  • Pin Count

    a count of all of the component leads (or pins)

    47
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    3.3V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.8/3.33/3.3V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    2.7V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    32Mb 2M x 16
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    2MX16
  • Memory Width

    Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.

    16
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    110ns
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.000005A
  • Memory Density

    Memory density in electronic components refers to the amount of data that can be stored in a given physical space or memory module. It is typically measured in bits or bytes per unit area, such as bits per square inch. Higher memory density means that more data can be stored in a smaller space, which is important for devices with limited physical size or power constraints. Memory density is a key factor in determining the capacity and performance of memory devices, such as RAM, ROM, and flash memory, and is a critical consideration in the design and manufacturing of electronic products.

    33554432 bit
  • Access Time (Max)

    Access Time (Max) is a parameter in electronic components, particularly in memory devices such as RAM (Random Access Memory) and storage devices like hard drives and SSDs (Solid State Drives). It refers to the maximum amount of time it takes for the component to retrieve data after receiving a request. In simpler terms, it measures the speed at which data can be accessed from the component. A lower access time indicates faster performance, as the component can quickly retrieve and deliver data to the system. Manufacturers often specify the maximum access time in the component's datasheet to help users understand its performance capabilities.

    110 ns
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    3V
  • Data Polling

    Data Polling is a process used in electronic components to retrieve data at regular intervals from a sensor or device. It involves checking or querying the device for updated information, ensuring that the most current data is accessible for processing or analysis. This technique is commonly used in systems where continuous monitoring is necessary, allowing for timely responses based on the latest data collected. Data Polling can impact system performance, as it may introduce delays or consume resources depending on the polling frequency and the efficiency of the implemented protocol.

    NO
  • Toggle Bit

    The toggle bit is a control mechanism in electronic components that allows a circuit to switch between two states, typically representing binary values of 0 and 1. It is commonly used in digital systems to change the status of a device or memory cell each time it is activated. The toggle bit maintains its state until it receives a new signal that alters its value, making it essential for operations such as counters and flip-flops. This functionality enables efficient data storage, retrieval, and manipulation in various electronic applications.

    NO
  • Command User Interface

    The term "Command User Interface" in electronic components refers to the method by which a user interacts with a device or system through issuing commands. This interface allows users to input instructions or requests to control the operation of the electronic component. The Command User Interface can take various forms, such as physical buttons, touchscreens, voice commands, or software-based interfaces. It plays a crucial role in enabling users to interact with and utilize the functionalities of electronic components effectively. The design and implementation of a Command User Interface are essential considerations in ensuring user-friendly and intuitive operation of electronic devices.

    YES
  • Number of Sectors/Size
    863
  • Sector Size

    Sector size in electronic components refers to the minimum unit of data that can be read or written to the storage device, such as a hard drive or solid-state drive. It represents the smallest amount of data that can be accessed at a time within a storage device. The sector size is typically measured in bytes, with common sizes being 512 bytes or 4 kilobytes.Having a larger sector size can improve the efficiency of data storage and retrieval processes, as it reduces the overhead associated with accessing and managing smaller units of data. However, the choice of sector size can also impact the overall performance and compatibility of the storage device with different systems and applications. It is important to consider the sector size when configuring storage devices and optimizing data access speeds.

    4K32K
  • Boot Block

    The "Boot Block" in electronic components refers to a specific section of memory that is typically used in flash memory devices. It is a small portion of memory that contains essential code and data required for the device to boot up or initialize properly. The Boot Block is usually located at the beginning of the memory space and is designed to be read-only to ensure its integrity and prevent accidental corruption.During the boot-up process, the microcontroller or processor accesses the Boot Block to execute the initial instructions needed to start the device. This section often contains bootloader code, configuration settings, and other critical information necessary for the device to function correctly. By isolating this essential data in a dedicated Boot Block, manufacturers can ensure the reliability and security of the boot process in electronic components.

    BOTTOM
  • Common Flash Interface

    Common Flash Interface is a standardized interface for accessing flash memory devices. It enables interoperability between different flash memory types and controllers, allowing for easier integration into various electronic systems. This parameter defines the electrical and protocol specifications needed for communication, facilitating faster data transfer and enhanced performance in applications such as embedded systems and consumer electronics.

    YES
  • Width
    7.286mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1mm
  • Length
    10.85mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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Download datasheets and manufacturer documentation for Intel GT28F320C3BA110.

GT28F320C3BA110 Overview

Tray-cases are available. There is a 48-VFBGA case embedded in it. 32Mb 2M x 16 is the chip's memory size. FLASH-format memory is used in this device, which is a mainstream design. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. The supply voltage can be up to 2.7V~3.6V. A Surface Mount mounting type is recommended for this product. The chip is terminated with 47 terminations. In total, this part supports 1 functions. Memory devices such as this one are designed to be powered by 3V and should be used as such. There are 47 pins on the package of the memory device. A memory device with 47 pins means that it contains 47 memory locations, indicating that it has 47 pins. Despite all the merits of this chip, it also has USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK to boost system performance. Power supplies for this memory chip are merely 1.8/3.33/3.3V . It is necessary to apply 3V programming voltage to certain nonvolatile memory arrays in order to change their state. There is a frequency of 110GHz for the data to be processed on this memory chip. As a result, this memory has 863 specific divisions of varying sizes.

GT28F320C3BA110 Features

Package / Case: 48-VFBGA
47 Pins
Additional Feature:USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK
Freguency at 110GHz
110GHz terminals

GT28F320C3BA110 Applications

There are a lot of Intel
GT28F320C3BA110 Memory applications.


  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
The three parts on the right have similar specifications to Intel & GT28F320C3BA110.
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