ISSI IS49RL18640-107EBLI
ISSI IS49RL18640-107EBLI
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ISSI IS49RL18640-107EBLI

Memory IC PTF Memory IC

Manufacturer No:

IS49RL18640-107EBLI

Manufacturer:

ISSI

Utmel No:

1266-IS49RL18640-107EBLI

Package:

Axial

ECAD Model:

Description:

PTF Memory IC PTF Series

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User Guide

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Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
IS49RL18640-107EBLI information

Specifications
Product Details
ISSI IS49RL18640-107EBLI technical specifications, attributes, parameters and parts with similar specifications to ISSI IS49RL18640-107EBLI.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    Axial
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    Axial
  • Package
    Bulk
  • Mfr
    ISSI, Integrated Silicon Solution Inc
  • Product Status
    Active
  • Memory Types
    Volatile
  • Factory Pack QuantityFactory Pack Quantity
    119
  • Manufacturer
    ISSI
  • Brand
    ISSI
  • RoHS
    Details
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 150°C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    PTF
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Size / Dimension

    In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

    0.145 Dia x 0.375 L (3.68mm x 9.53mm)
  • Tolerance

    In electronic components, "tolerance" refers to the acceptable deviation or variation from the specified or ideal value of a particular parameter, such as resistance, capacitance, or voltage. It indicates the range within which the actual value of the component can fluctuate while still being considered acceptable for use in a circuit. Tolerance is typically expressed as a percentage or a specific value and is important for ensuring the accuracy and reliability of electronic devices. Components with tighter tolerances are more precise but may also be more expensive. It is crucial to consider tolerance when selecting components to ensure proper functionality and performance of the circuit.

    ±0.1%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Number of Terminations
    2
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    ±10ppm/°C
  • Resistance

    Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

    649 kOhms
  • Composition

    Parameter "Composition" in electronic components refers to the specific materials and substances used in the construction of the component. It encompasses the chemical and physical elements that make up the component, influencing its electrical, thermal, and mechanical properties. The composition can affect the performance, reliability, and durability of the component in various applications. Understanding the composition is essential for optimizing the design and functionality of electronic devices.

    Metal Film
  • Power (Watts)

    The parameter "Power (Watts)" in electronic components refers to the amount of electrical energy consumed or dissipated by the component. It is a measure of how much energy the component can handle or generate. Power is typically measured in watts, which is a unit of power that indicates the rate at which energy is transferred. Understanding the power rating of electronic components is crucial for ensuring they operate within their specified limits to prevent overheating and potential damage. It is important to consider power requirements when designing circuits or selecting components to ensure proper functionality and reliability.

    0.25W, 1/4W
  • Subcategory
    Memory & Data Storage
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    RLDRAM 3
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.28V ~ 1.42V
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    --
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1.152Gbit
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    933 MHz
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    8 ns
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    DRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    -
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    DRAM
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Moisture Resistant
  • Product Category

    a particular group of related products.

    DRAM
  • Memory Organization

    Memory organization in electronic components refers to the way data is stored and accessed within the memory system. It includes the structure and arrangement of memory cells, addressing schemes, data organization, and access methods. The memory organization determines how data is stored in different memory locations, how it is retrieved, and how it is managed. Different types of memory, such as RAM, ROM, and cache memory, have specific memory organizations tailored to their intended functions and performance requirements. Overall, memory organization plays a crucial role in the efficiency and effectiveness of data storage and retrieval in electronic devices.

    64M x 18
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    --
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IS49RL18640-107EBLI Overview

You can get memory ics in a Bulk case. Axial case encloses it. There is 1.152Gbit of memory on the chip. The device uses a mainstream DRAM-format memory. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -55°C ~ 150°C. There is a voltage range of 1.28V ~ 1.42V for the supply voltage. It is recommended that the mounting type be Surface Mount. There are 2 terminations on the chip. It has a clock frequency of 933 MHz. This part is part of the PTF series of memory devices, which play a key role in its target applications. There is a common misconception that this component is a type of Memory & Data Storage.

IS49RL18640-107EBLI Features

Package / Case: Axial

IS49RL18640-107EBLI Applications

There are a lot of ISSI
IS49RL18640-107EBLI Memory applications.


  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory