ISSI, Integrated Silicon Solution Inc IS61QDP2B44M18A-400M3L
ISSI, Integrated Silicon Solution Inc IS61QDP2B44M18A-400M3L
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ISSI, Integrated Silicon Solution Inc IS61QDP2B44M18A-400M3L

Memory IC Memory IC

Manufacturer No:

IS61QDP2B44M18A-400M3L

Utmel No:

1266-IS61QDP2B44M18A-400M3L

Package:

165-LBGA

Usage Grade:

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ECAD Model:

Description:

1.5/1.81.8V V 165 Pin Memory IC 17mm mm

Quantity:

Unit Price: $116.898131

Ext Price: $116.90

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 2027

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $116.898131

    $116.90

  • 10

    $110.281256

    $1,102.81

  • 100

    $104.038920

    $10,403.89

  • 500

    $98.149925

    $49,074.96

  • 1000

    $92.594269

    $92,594.27

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
IS61QDP2B44M18A-400M3L information

Specifications
Product Details
Product Comparison
ISSI, Integrated Silicon Solution Inc IS61QDP2B44M18A-400M3L technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS61QDP2B44M18A-400M3L.
  • Type
    Parameter
  • Factory Lead Time
    12 Weeks
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    165-LBGA
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Number of Pins
    165
  • Memory Types
    Volatile
  • Usage Level
    Commercial grade
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    165
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.B.2.A
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    PIPELINED ARCHITECTURE
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.41
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.71V~1.89V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.8V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Pin Count

    a count of all of the component leads (or pins)

    165
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    1.89V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.5/1.81.8V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.71V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    72Mb 4M x 18
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    400MHz
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    8.4ns
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    SRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    4MX18
  • Output Characteristics

    Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

    3-STATE
  • Memory Width

    Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.

    18
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.36A
  • Memory Density

    Memory density in electronic components refers to the amount of data that can be stored in a given physical space or memory module. It is typically measured in bits or bytes per unit area, such as bits per square inch. Higher memory density means that more data can be stored in a smaller space, which is important for devices with limited physical size or power constraints. Memory density is a key factor in determining the capacity and performance of memory devices, such as RAM, ROM, and flash memory, and is a critical consideration in the design and manufacturing of electronic products.

    75497472 bit
  • I/O Type

    "I/O Type" in electronic components refers to the type of input/output interface that the component uses to communicate with other devices or systems. This parameter specifies whether the component uses analog or digital signals for input and output operations. Analog signals are continuous and can have an infinite number of values, while digital signals are discrete and have only two possible values (0 or 1).Understanding the I/O Type of an electronic component is crucial for ensuring compatibility and proper communication with other components in a circuit or system. It helps determine the type of signals that the component can send and receive, as well as the protocols and standards that need to be followed for successful data exchange.In summary, the I/O Type parameter of electronic components defines the nature of the signals used for input and output operations, whether they are analog or digital, and plays a key role in establishing seamless communication within electronic systems.

    SEPARATE
  • Standby Voltage-Min

    Standby Voltage-Min is a parameter in electronic components that refers to the minimum voltage required to maintain the standby mode of operation. Standby mode is a low-power state in which the device is still operational but consumes significantly less power compared to its active mode. The Standby Voltage-Min specification ensures that the component remains in standby mode and is ready to quickly transition to full operation when needed. It is important for ensuring energy efficiency and prolonging the battery life of devices that utilize standby modes.

    1.7V
  • Width
    15mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1.4mm
  • Length
    17mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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IS61QDP2B44M18A-400M3L Overview

In addition, memory ics is available in a Tray case as well. In the case of 165-LBGA, it is embedded within the case. A memory chip with a capacity of 72Mb 4M x 18 is used on this device. There is a mainstream memory format used by this device, which is called SRAM-format memory. This device has an extended operating temperature range of 0°C~70°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.71V~1.89V. As far as the mounting type is concerned, Surface Mount is recommended. On the chip, there are 165 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. In the memory, there is a clock frequency rotation that ranges 400MHz. The memory device has an 165-pin package, which encloses it in a small package. I have noticed that the memory device has 165 pins, which indicates that it has 165 locations in the memory. The memory chip also offers PIPELINED ARCHITECTURE to level up system performance despite its merits. There is only a single power supply required for this memory chip. There are I/O ports on this memory ics that have SEPARATE-bit memory mapping.

IS61QDP2B44M18A-400M3L Features

Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: SEPARATE

IS61QDP2B44M18A-400M3L Applications

There are a lot of ISSI, Integrated Silicon Solution Inc
IS61QDP2B44M18A-400M3L Memory applications.


  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
The three parts on the right have similar specifications to ISSI, Integrated Silicon Solution Inc & IS61QDP2B44M18A-400M3L.
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