IXYS Integrated Circuits Division IXDD609PI
IXYS Integrated Circuits Division IXDD609PI
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IXYS Integrated Circuits Division IXDD609PI

Gate Drivers ICs Through Hole Tube Active Gate Drivers ICs

Manufacturer No:

IXDD609PI

Utmel No:

1274-IXDD609PI

Package:

8-DIP (0.300, 7.62mm)

ECAD Model:

Description:

Through Hole Tube Active Gate Drivers ICs Non-Inverting 1 8-DIP (0.300, 7.62mm)

Quantity:

Unit Price: $1.697182

Ext Price: $1.70

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In Stock : 4000

Minimum: 1 Multiples: 1

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Unit Price

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  • 1

    $1.697182

    $1.70

  • 10

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    $16.01

  • 100

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    $151.05

  • 500

    $1.424987

    $712.49

  • 1000

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IXDD609PI information

Specifications
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IXYS Integrated Circuits Division IXDD609PI technical specifications, attributes, parameters and parts with similar specifications to IXYS Integrated Circuits Division IXDD609PI.
  • Type
    Parameter
  • Factory Lead Time
    8 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-DIP (0.300, 7.62mm)
  • Number of Pins
    8
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    8-DIP
  • Weight
    2.26799g
  • Driver Configuration
    Low-Side
  • Logic voltage-VIL, VIH
    0.8V 3V
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    2010
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    125°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40°C
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    4.5V~35V
  • Number of Outputs
    1
  • Max Output Current

    The maximum current that can be supplied to the load.

    2A
  • Number of Channels
    1
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    35V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    4.5V
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    10μA
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    2A
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    30 ns
  • Input Type

    Input type in electronic components refers to the classification of the signal or data that a component can accept for processing or conversion. It indicates whether the input is analog, digital, or a specific format such as TTL or CMOS. Understanding input type is crucial for ensuring compatibility between different electronic devices and circuits, as it determines how signals are interpreted and interacted with.

    Non-Inverting
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    30 ns
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    22ns
  • Fall Time (Typ)

    Fall Time (Typ) is a parameter used to describe the time it takes for a signal to transition from a high level to a low level in an electronic component, such as a transistor or an integrated circuit. It is typically measured in nanoseconds or microseconds and is an important characteristic that affects the performance of the component in digital circuits. A shorter fall time indicates faster switching speeds and can result in improved overall circuit performance, such as reduced power consumption and increased data transmission rates. Designers often consider the fall time specification when selecting components for their circuits to ensure proper functionality and efficiency.

    15 ns
  • Rise / Fall Time (Typ)

    The parameter "Rise / Fall Time (Typ)" in electronic components refers to the time it takes for a signal to transition from a specified low level to a specified high level (rise time) or from a high level to a low level (fall time). It is typically measured in nanoseconds or picoseconds and is an important characteristic in determining the speed and performance of a component, such as a transistor or integrated circuit. A shorter rise/fall time indicates faster signal switching and can impact the overall speed and efficiency of a circuit. Designers often consider this parameter when selecting components for high-speed applications to ensure proper signal integrity and timing.

    22ns 15ns
  • Channel Type

    In electronic components, the parameter "Channel Type" refers to the type of channel through which electrical signals or current flow within the component. This parameter is commonly associated with field-effect transistors (FETs) and other semiconductor devices. The channel type can be categorized as either N-channel or P-channel, depending on the polarity of the majority charge carriers (electrons or holes) that carry the current within the channel. N-channel devices have an electron-conducting channel, while P-channel devices have a hole-conducting channel. Understanding the channel type is crucial for proper circuit design and component selection to ensure compatibility and optimal performance.

    Single
  • Number of Drivers
    1
  • Gate Type

    In electronic components, the term "Gate Type" typically refers to the type of logic gate used in digital circuits. A logic gate is a fundamental building block of digital circuits that performs a specific logical operation based on the input signals it receives. Common types of logic gates include AND, OR, NOT, NAND, NOR, XOR, and XNOR gates.The Gate Type parameter specifies the specific logic function that the gate performs, such as AND, OR, or NOT. Different gate types have different truth tables that define their behavior based on the input signals. By selecting the appropriate gate type for a given application, designers can implement various logical functions and operations in digital circuits.Understanding the gate type is essential for designing and analyzing digital circuits, as it determines how the circuit processes and manipulates binary data. Choosing the right gate type is crucial for ensuring the correct functionality and performance of the digital system being designed.

    IGBT, N-Channel, P-Channel MOSFET
  • Current - Peak Output (Source, Sink)

    The parameter "Current - Peak Output (Source, Sink)" in electronic components refers to the maximum amount of current that the component can either supply (source) or sink (absorb) under peak conditions. This parameter is important for understanding the capability of the component to handle sudden surges or spikes in current without being damaged. The peak output current is typically specified in datasheets and is crucial for designing circuits that require high current handling capabilities. It is essential to consider this parameter to ensure the component operates within its safe operating limits and to prevent potential damage or malfunction.

    9A 9A
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for IXYS Integrated Circuits Division IXDD609PI.

Product Description

Description

The IXDD609PI is a single-channel, low-side gate driver integrated circuit (IC) designed for driving IGBTs, N-channel, and P-channel MOSFETs. Manufactured by IXYS Integrated Circuits Division, this IC is optimized for high-speed switching applications in various industrial and automotive systems. Its compact 8-DIP package ensures easy integration into a wide range of electronic devices.

Features

  • High Peak Output Current: The IXDD609PI can handle peak output currents of up to 9A, making it suitable for demanding power management applications.
  • Low-Side Driver Configuration: This configuration is ideal for applications where the gate driver needs to be connected to the source of the power transistor.
  • Fast Switching Times: With a fall time of 15 ns and a rise time of 22 ns, this IC ensures fast and efficient switching operations.
  • Wide Operating Temperature Range: The IC operates within a temperature range of -40°C to 125°C, providing reliability in harsh environments.
  • Low Operating Supply Current: The operating supply current is just 10 μA, minimizing power consumption and heat generation.
  • Lead-Free and RoHS3 Compliant: Ensuring environmental sustainability and compliance with global regulations.

Applications

  1. Primary Applications:
  2. Industrial Power Supplies: The IXDD609PI is well-suited for driving power transistors in industrial power supplies due to its high peak output current and fast switching times.
  3. Automotive Systems: Its reliability and fast switching characteristics make it an excellent choice for automotive applications such as motor control systems.
  4. Renewable Energy Systems: The IC can be used in solar inverters and wind turbines where high-speed switching is crucial.

  5. Secondary Applications:

  6. Medical Devices: The IC's high reliability and low operating supply current make it suitable for medical devices requiring precise control over power transistors.
  7. Consumer Electronics: It can be used in high-power consumer electronics such as audio amplifiers or high-definition display systems.

Alternative Parts

While the IXDD609PI is a versatile gate driver IC, alternative parts may be considered based on specific application requirements:

  • IXDD610PI: A dual-channel version of the IXDD609PI with similar specifications but designed for applications requiring two independent gate drivers.
  • IXDD608PI: A single-channel gate driver with slightly different specifications but also suitable for low-side driver configurations.

Embedded Modules

The IXDD609PI is often used in various embedded modules designed for specific applications:

  • Motor Control Modules: These modules integrate the IXDD609PI with other components like microcontrollers and sensors to provide complete motor control solutions.
  • Power Supply Modules: The IC is embedded in power supply modules to ensure efficient and reliable power management in industrial and automotive systems.
  • Inverter Modules: In solar inverters and wind turbines, the IXDD609PI helps in managing high-power transistors efficiently.

In summary, the IXDD609PI is a robust and efficient gate driver IC that offers high performance in various industrial and automotive applications. Its compact design, fast switching times, and reliability make it an excellent choice for a wide range of electronic devices requiring precise control over power transistors.

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