IXYS Integrated Circuits Division IXDI630CI
IXYS Integrated Circuits Division IXDI630CI
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IXYS Integrated Circuits Division IXDI630CI

Gate Drivers ICs Through Hole Tube Active Gate Drivers ICs

Manufacturer No:

IXDI630CI

Utmel No:

1274-IXDI630CI

Package:

TO-220-5

ECAD Model:

Description:

Through Hole Tube Active Gate Drivers ICs Inverting 1 TO-220-5

Quantity:

Unit Price: $8.209840

Ext Price: $8.21

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In Stock : 287

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IXDI630CI information

Specifications
Product Details
Product Comparison
IXYS Integrated Circuits Division IXDI630CI technical specifications, attributes, parameters and parts with similar specifications to IXYS Integrated Circuits Division IXDI630CI.
  • Type
    Parameter
  • Factory Lead Time
    11 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    TO-220-5
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    TO-220-5
  • Weight
    3.000003g
  • Driver Configuration
    Low-Side
  • Logic voltage-VIL, VIH
    0.8V 3.5V
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    100 ns
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    2011
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    125°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40°C
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    12.5V~35V
  • Number of Outputs
    1
  • Output Voltage

    Output voltage is a crucial parameter in electronic components that refers to the voltage level produced by the component as a result of its operation. It represents the electrical potential difference between the output terminal of the component and a reference point, typically ground. The output voltage is a key factor in determining the performance and functionality of the component, as it dictates the level of voltage that will be delivered to the connected circuit or load. It is often specified in datasheets and technical specifications to ensure compatibility and proper functioning within a given system.

    12.5V
  • Max Output Current

    The maximum current that can be supplied to the load.

    30A
  • Number of Channels
    1
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    35V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    10V
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    10μA
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    30A
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    65 ns
  • Input Type

    Input type in electronic components refers to the classification of the signal or data that a component can accept for processing or conversion. It indicates whether the input is analog, digital, or a specific format such as TTL or CMOS. Understanding input type is crucial for ensuring compatibility between different electronic devices and circuits, as it determines how signals are interpreted and interacted with.

    Inverting
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    100 ns
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    20ns
  • Fall Time (Typ)

    Fall Time (Typ) is a parameter used to describe the time it takes for a signal to transition from a high level to a low level in an electronic component, such as a transistor or an integrated circuit. It is typically measured in nanoseconds or microseconds and is an important characteristic that affects the performance of the component in digital circuits. A shorter fall time indicates faster switching speeds and can result in improved overall circuit performance, such as reduced power consumption and increased data transmission rates. Designers often consider the fall time specification when selecting components for their circuits to ensure proper functionality and efficiency.

    18 ns
  • Rise / Fall Time (Typ)

    The parameter "Rise / Fall Time (Typ)" in electronic components refers to the time it takes for a signal to transition from a specified low level to a specified high level (rise time) or from a high level to a low level (fall time). It is typically measured in nanoseconds or picoseconds and is an important characteristic in determining the speed and performance of a component, such as a transistor or integrated circuit. A shorter rise/fall time indicates faster signal switching and can impact the overall speed and efficiency of a circuit. Designers often consider this parameter when selecting components for high-speed applications to ensure proper signal integrity and timing.

    11ns 11ns
  • Channel Type

    In electronic components, the parameter "Channel Type" refers to the type of channel through which electrical signals or current flow within the component. This parameter is commonly associated with field-effect transistors (FETs) and other semiconductor devices. The channel type can be categorized as either N-channel or P-channel, depending on the polarity of the majority charge carriers (electrons or holes) that carry the current within the channel. N-channel devices have an electron-conducting channel, while P-channel devices have a hole-conducting channel. Understanding the channel type is crucial for proper circuit design and component selection to ensure compatibility and optimal performance.

    Single
  • Number of Drivers
    1
  • Gate Type

    In electronic components, the term "Gate Type" typically refers to the type of logic gate used in digital circuits. A logic gate is a fundamental building block of digital circuits that performs a specific logical operation based on the input signals it receives. Common types of logic gates include AND, OR, NOT, NAND, NOR, XOR, and XNOR gates.The Gate Type parameter specifies the specific logic function that the gate performs, such as AND, OR, or NOT. Different gate types have different truth tables that define their behavior based on the input signals. By selecting the appropriate gate type for a given application, designers can implement various logical functions and operations in digital circuits.Understanding the gate type is essential for designing and analyzing digital circuits, as it determines how the circuit processes and manipulates binary data. Choosing the right gate type is crucial for ensuring the correct functionality and performance of the digital system being designed.

    IGBT, N-Channel, P-Channel MOSFET
  • Current - Peak Output (Source, Sink)

    The parameter "Current - Peak Output (Source, Sink)" in electronic components refers to the maximum amount of current that the component can either supply (source) or sink (absorb) under peak conditions. This parameter is important for understanding the capability of the component to handle sudden surges or spikes in current without being damaged. The peak output current is typically specified in datasheets and is crucial for designing circuits that require high current handling capabilities. It is essential to consider this parameter to ensure the component operates within its safe operating limits and to prevent potential damage or malfunction.

    30A 30A
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Product Description

IXDI630CI - High-Performance Low-Side Gate Driver IC

The IXDI630CI is a high-speed, low-side gate driver IC designed by IXYS Integrated Circuits Division. This integrated circuit is specifically engineered to drive IGBTs, N-channel, and P-channel MOSFETs in various power electronic applications. The IXDI630CI offers exceptional performance with its low fall time of 18 ns and rise/fall times of 11 ns each, making it ideal for high-frequency switching applications.

Features

  • High Peak Output Current: The IXDI630CI can handle a peak output current of up to 30A, ensuring reliable operation in demanding power management scenarios.
  • Low-Side Driver Configuration: This IC is configured as a low-side driver, which simplifies the design process by reducing the complexity of the circuit layout.
  • Wide Operating Temperature Range: The device operates within a wide temperature range from -40°C to 125°C, providing flexibility in various environmental conditions.
  • Low Operating Supply Current: With an operating supply current of just 10μA, this IC minimizes power consumption, making it suitable for battery-powered systems or energy-efficient designs.
  • Lead-Free and RoHS3 Compliant: The IXDI630CI is manufactured using lead-free materials and complies with ROHS3 standards, ensuring environmental sustainability and regulatory compliance.
  • High Logic Voltage Range: The logic voltage range (VIL to VIH) is between 0.8V and 3.5V, accommodating a wide range of logic levels commonly used in modern electronics.

Applications

  1. Primary Applications:
  2. Power Converters: The IXDI630CI is particularly useful in power converter designs such as DC-DC converters, AC-DC converters, and motor drives.
  3. Motor Control Systems: Its ability to handle high peak currents makes it suitable for motor control systems where precise control over motor speed is required.
  4. Renewable Energy Systems: The IC's reliability and high performance make it an excellent choice for renewable energy systems like solar inverters and wind turbines.

  5. Secondary Applications:

  6. Audio Amplifiers: The high-speed switching capabilities of the IXDI630CI can also be leveraged in audio amplifier designs where fast switching times are essential.
  7. Industrial Automation: The IC's robustness and wide operating temperature range make it suitable for industrial automation applications where reliability is paramount.

Alternative Parts

While there may not be exact alternatives to the IXDI630CI due to its unique combination of features, some alternative gate driver ICs that could be considered include:

  • IXDI630BI: This variant has similar specifications but may have different package options or slightly different performance characteristics.
  • Other Low-Side Gate Drivers from IXYS: Depending on specific requirements, other low-side gate drivers from IXYS Integrated Circuits Division might offer comparable performance at different price points or with additional features.

Embedded Modules

The IXDI630CI is commonly used in various embedded modules designed for power management and motor control applications:

  • Motor Control Boards: Many motor control boards incorporate this IC due to its high performance and reliability.
  • Power Supply Modules: Some power supply modules utilize the IXDI630CI for efficient and fast switching operations.
  • Industrial Control Systems: Embedded systems used in industrial control applications often integrate this IC for precise control over motors and other actuators.

In summary, the IXDI630CI is a versatile and high-performance gate driver IC that offers exceptional speed and reliability, making it an excellent choice for a wide range of power electronic applications.

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