IXYS Integrated Circuits Division TS117PLTR
IXYS Integrated Circuits Division TS117PLTR
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IXYS Integrated Circuits Division TS117PLTR

Telecom product 2 Circuits 8 Pin Telecom Interface ICs

Manufacturer No:

TS117PLTR

Utmel No:

1274-TS117PLTR

Package:

8-SMD, Gull Wing

ECAD Model:

Description:

8 Pin Telecom device 2 Circuits

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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TS117PLTR information

Specifications
Documents & Media
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IXYS Integrated Circuits Division TS117PLTR technical specifications, attributes, parameters and parts with similar specifications to IXYS Integrated Circuits Division TS117PLTR.
  • Type
    Parameter
  • Factory Lead Time
    6 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-SMD, Gull Wing
  • Number of Pins
    8
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    8-Flatpack
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2012
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Termination

    Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

    Gull Wing
  • Resistance

    Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

    35Ohm
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40°C
  • Power (Watts)

    The parameter "Power (Watts)" in electronic components refers to the amount of electrical energy consumed or dissipated by the component. It is a measure of how much energy the component can handle or generate. Power is typically measured in watts, which is a unit of power that indicates the rate at which energy is transferred. Understanding the power rating of electronic components is crucial for ensuring they operate within their specified limits to prevent overheating and potential damage. It is important to consider power requirements when designing circuits or selecting components to ensure proper functionality and reliability.

    800mW
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    800mW
  • Function

    The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.

    Relay Switch
  • Output Voltage

    Output voltage is a crucial parameter in electronic components that refers to the voltage level produced by the component as a result of its operation. It represents the electrical potential difference between the output terminal of the component and a reference point, typically ground. The output voltage is a key factor in determining the performance and functionality of the component, as it dictates the level of voltage that will be delivered to the connected circuit or load. It is often specified in datasheets and technical specifications to ensure compatibility and proper functioning within a given system.

    350V
  • Number of Circuits
    2
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    120mA
  • Throw Configuration

    "Throw Configuration" is a term commonly used in the context of switches and relays in electronic components. It refers to the number of positions or states that the switch or relay can be set to. For example, a single-throw (ST) configuration means the switch has only one position, while a double-throw (DT) configuration means the switch has two positions.The throw configuration is important because it determines the versatility and functionality of the switch or relay. Different applications may require different throw configurations to control the flow of current or signals effectively. Understanding the throw configuration of a component is crucial for proper installation and operation within an electronic circuit.

    SPST
  • Max Output Voltage

    The maximum output voltage refers to the dynamic area beyond which the output is saturated in the positive or negative direction, and is limited according to the load resistance value.

    350V
  • Input Current

    Input current is a parameter that refers to the amount of electrical current flowing into a specific electronic component or device. It is typically measured in amperes (A) and represents the current required for the component to operate properly. Understanding the input current is important for designing circuits and power supplies, as it helps determine the capacity and compatibility of the components being used. Monitoring the input current also helps ensure that the component is not being overloaded or underpowered, which can affect its performance and longevity.

    50mA
  • Isolation Voltage

    Isolation voltage refers to a test of the ability of an insulator to minimize the flow of electric current with a high applied voltage.

    3.75kV
  • Height
    2.159mm
  • Length
    9.652mm
  • Width
    6.35mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for IXYS Integrated Circuits Division TS117PLTR.

TS117PLTR Overview

In order to save space on the board, the 8-SMD, Gull Wing package is used.Telecommunications equipment is packed using the Tape & Reel (TR) method.Mounting type Surface Mount is used.2 circuits make up this telecom IC .At -40°C~85°C, reliable performance can be achieved.Telecom switching is mounted in a Surface Mount-direction.There are 8 pins on this telecom interface.In order to ensure normal operation, the temperature is set to the minimum value of -40°C.A maximum value of 85°C is set to ensure normal operation.The telecommunication product can work with a resistance of 35Ohm.

TS117PLTR Features

Available in the 8-SMD, Gull Wing package

TS117PLTR Applications

There are a lot of IXYS Integrated Circuits Division
TS117PLTR Telecom applications.


  • Switches
  • LAN Routers
  • Digital Modems
  • SONET/SDH terminal
  • Add/Drop multiplexers (ADMs)
  • T1/E1/J1 add/drop multiplexers (MUX)
  • Channel Service Units (CSUs): T1/E1/J1
  • Fractional T1/E1/J1
  • BITS Timing
  • Digital Access Cross-connect System (DACs)
The three parts on the right have similar specifications to IXYS Integrated Circuits Division & TS117PLTR.
TS117PLTR Relevant information

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