Keystone Electronics 1992-2

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

The "Mounting Hole Diameter" in electronic components refers to the size of the hole or opening in the component that is used for mounting or securing it onto a circuit board or other surface. This parameter is crucial for ensuring that the component can be properly and securely attached to the intended location. The mounting hole diameter is typically specified in millimeters or inches and must match the corresponding mounting hardware or fasteners to ensure a proper fit. It is important to consider the mounting hole diameter when designing and assembling electronic circuits to ensure proper installation and functionality of the components.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

Contact finish refers to the surface coating or treatment applied to the electrical contacts of electronic components. This finish is crucial for ensuring reliable electrical connections and preventing corrosion or oxidation of the contacts. Common contact finishes include gold, silver, tin, and nickel, each offering different levels of conductivity, durability, and resistance to environmental factors. The choice of contact finish depends on the specific application requirements, such as operating conditions, cost considerations, and compatibility with other components in the circuit. Selecting the appropriate contact finish is essential for maintaining the performance and longevity of electronic devices.

Insulation in electronic components refers to the material properties that prevent the flow of electric current between conductive parts. It is critical for ensuring safety and reliability in circuits by minimizing unintended current paths. High insulation resistance helps protect against short circuits and enhances the durability of electronic devices by insulating high-voltage components from sensitive areas. Insulation can also affect signal integrity and can be a key factor in high-frequency applications.

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

The "Hole Diameter" parameter in electronic components refers to the size of the hole that is designed to accommodate a lead or pin of another component for soldering or connection purposes. It is a critical dimension that ensures proper alignment and fit between components during assembly. The hole diameter is typically specified in millimeters or inches and plays a crucial role in determining the mechanical stability and electrical connectivity of the overall circuit or device. Manufacturers provide specific hole diameter requirements to ensure compatibility and reliability in electronic assemblies.

Flange diameter is measured between centers of opposite holes in the hub flange. It is usually between 38 and 67 millimeters. Note that it is NOT the outside diameter of the hub's flange. Left and right flange diameters are often, but not always, the same.

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

The term "Terminal Style" in electronic components refers to the physical design and configuration of the terminals or connection points on the component. These terminals are used for connecting the component to a circuit or other components. The terminal style can vary depending on the type of component and its intended application.Common terminal styles include through-hole, surface mount, wire lead, and solder tab terminals. Through-hole terminals are typically cylindrical pins that pass through holes in a circuit board for soldering. Surface mount terminals are flat pads on the surface of the component that are soldered directly to the circuit board. Wire lead terminals are wires attached to the component for connection, while solder tab terminals are metal tabs that are soldered to the circuit board.The choice of terminal style can impact the ease of assembly, reliability, and overall performance of the electronic component in a circuit. Designers must consider the terminal style when selecting components to ensure compatibility with the circuit design and manufacturing processes.

Pin Size - Above Flange is a parameter that refers to the dimensions of the pins of an electronic component above the flange. The flange is a flat, typically circular component that serves as a mounting surface or connection point for the electronic component. The pin size above the flange is important for determining how the component will fit into a circuit board or other mounting structure. It includes measurements such as the length and diameter of the pins that extend above the flange, which are crucial for ensuring proper alignment and connection within the electronic system. Understanding this parameter is essential for selecting and integrating electronic components effectively in a design.

Contact Finish Thickness refers to the measurement of the layer of conductive material applied to the surfaces of electrical contacts in electronic components. This thickness is critical as it influences the electrical conductivity, solderability, wear resistance, and overall performance of the connection. The materials used for the contact finish can include gold, silver, or other metals, and the specified thickness is designed to ensure reliable operation over the component's lifespan.

Length - Overall is a crucial parameter in electronic components that refers to the total length of a component from one end to the other. It encompasses any protruding features or attachments, providing a complete measurement of the component's size. This dimension is essential for determining compatibility with circuit boards, housing, and other components in an assembly. Accurate knowledge of the overall length helps ensure proper fit and function in electronic designs.

Board Thickness in electronic components refers to the measurement of the thickness of the printed circuit board (PCB) on which the electronic components are mounted. The board thickness is an important parameter as it determines the overall mechanical strength and rigidity of the PCB. It also affects the electrical performance of the circuit, such as impedance control and signal integrity. Different applications may require different board thicknesses based on factors like the size of the components, the complexity of the circuit, and the environmental conditions in which the PCB will be used. Manufacturers typically provide a range of board thickness options to accommodate various design requirements.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.