Keystone Electronics 7229-5

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

In the context of electronic components, "Plating" refers to a process of depositing a thin layer of metal onto a substrate material. This plating is often used to enhance the component's performance, durability, and conductivity. The plating material can vary depending on the specific requirements of the component, with common choices including gold, silver, tin, and nickel. Plating can also be used for corrosion resistance, solderability, and to improve the overall appearance of the component. Overall, plating plays a crucial role in ensuring the reliability and functionality of electronic components in various applications.

Accessory Type in electronic components refers to additional items or attachments that enhance the functionality or usability of primary components. These can include connectors, adapters, mounting hardware, and protective casings. Accessory Types are essential for ensuring compatibility and achieving optimal performance in electronic systems.

given in nominal sizes, not in the actual measurement.

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

The "Head Diameter" parameter in electronic components refers to the measurement of the diameter of the head or top portion of the component. This measurement is important for determining the physical size and compatibility of the component with other parts or equipment. The head diameter is typically specified in millimeters or inches and is used to ensure proper fit and alignment during installation or assembly. It is a critical dimension to consider when designing circuits or selecting components for a project to ensure proper functionality and mechanical compatibility.

In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

Length - Below Head is a parameter used to describe the distance from the bottom of the head of a fastener, such as a screw or bolt, to the end of the threaded portion. This measurement is important in determining how deep the fastener can be inserted into a material while still allowing the head to sit flush or slightly below the surface. It helps ensure proper installation and secure fastening of components. Manufacturers provide this specification to assist users in selecting the appropriate fastener for their specific application based on the required depth and strength needed.

Head Height refers to the vertical distance from the highest point of a surface-mounted electronic component to the substrate or circuit board it is mounted on. This parameter is crucial for ensuring proper clearance and compatibility with other components in a design, as well as for maintaining effective heat dissipation. A suitable head height helps prevent physical interferences and facilitates the assembly and soldering processes in surface mount technology.

The parameter "Length - Threaded Portion Below Head" in electronic components refers to the measurement of the threaded portion of a fastener that extends below the head. This measurement is important for determining how much of the fastener will be inserted into a material or component when securing them together. It helps ensure that the fastener is the correct size for the application and that it will provide the necessary strength and stability. Manufacturers provide this specification to assist users in selecting the appropriate fastener for their specific needs and to ensure proper installation.

The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.